THz Instruments for Space

Terahertz technology has been driven largely by applications in astronomy and space science. For more than three decades cosmochemists, molecular spectroscopists, astrophysicists, and Earth and planetary scientists have used submillimeter-wave or terahertz sensors to identify, catalog and map lightweight gases, atoms and molecules in Earth and planetary atmospheres, in regions of interstellar dust and star formation, and in new and old galaxies, back to the earliest days of the universe, from both ground based and more recently, orbital platforms. The past ten years have witnessed the launch and successful deployment of three satellite instruments with spectral line heterodyne receivers above 300 GHz (SWAS, Odin, and MIRO) and a fourth platform, Aura MLS, that reaches to 2520 GHz, crossing the terahertz threshold from the microwave side for the first time. The former Soviet Union launched the first bolometric detectors for the submillimeter way back in 1974 and operated the first space based submillimeter wave telescope on the Salyut 6 station for four months in 1978. In addition, continuum, Fourier transform and spectrophotometer instruments on IRAS, ISO, COBE, the recent Spitzer Space Telescope and Japan's Akari satellite have all encroached into the submillimeter from the infrared using direct detection bolometers or photoconductors. At least two more major satellites carrying submillimeter wave instruments are nearing completion, Herschel and Planck, and many more are on the drawing boards in international and national space organizations such as NASA, ESA, DLR, CNES, and JAXA. This paper reviews some of the programs that have been proposed, completed and are still envisioned for space applications in the submillimeter and terahertz spectral range

Applications of Graphene at Microwave Frequencies

In view to the epochal scenarios that nanotechnology discloses, nano-electronics has the potential to introduce a paradigm shift in electronic systems design similar to that of the transition from vacuum tubes to semiconductor devices. Since low dimensional (1D and 2D) nano-structured materials exhibit unprecedented electro-mechanical properties in a wide frequency range, including radio-frequencies (RF), microwave nano-electronics provides an enormous and yet widely undiscovered opportunity for the engineering community. Carbon nano-electronics is one of the main research routes of RF/microwave nano-electronics. In particular, graphene has shown proven results as an emblematic protagonist, and a real solution for a wide variety of microwave electronic devices and circuits. This paper introduces graphene properties in the microwave range, and presents a paradigm of novel graphene-based devices and applications in the microwave/RF frequency range

Spaceborne sensors (1983-2000 AD): A forecast of technology

A technical review and forecast of space technology as it applies to spaceborne sensors for future NASA missions is presented. A format for categorization of sensor systems covering the entire electromagnetic spectrum, including particles and fields is developed. Major generic sensor systems are related to their subsystems, components, and to basic research and development. General supporting technologies such as cryogenics, optical design, and data processing electronics are addressed where appropriate. The dependence of many classes of instruments on common components, basic R&D and support technologies is also illustrated. A forecast of important system designs and instrument and component performance parameters is provided for the 1983-2000 AD time frame. Some insight into the scientific and applications capabilities and goals of the sensor systems is also given

Microwave Photonics: Current challenges towards widespread application

Microwave Photonics, a symbiotic field of research that brings together the worlds of optics and radio frequency is currently facing several challenges in its transition from a niche to a truly widespread technology essential to support the ever-increasing values for speed, bandwidth, processing capability and dynamic range that will be required in next generation hybrid access networks. We outline these challenges, which are the subject of the contributions to this focus issue

Coherent Detector Arrays for Millimeter and Submillimeter Astronomy

Progress in many areas of astronomy requires large-area surveys and observations of extended objects. This includes the cosmic microwave background, nearby galaxies, the Milky Way, and regions of star-forming regions within our galaxy. The ability to carry out such studies is critically dependent on the development of affordable high-sensitivity focal plane arrays, for both spectral line and continuum observations. We discuss a program for the next decade to develop such technology for ground-based and spacebased millimeter and submillimeter astronomy. Appropriate technologies exist, but significant effort is required to make the transition from simply replicating individual pixels to approaching focal plane array design in an integrated fashion from feeds to spectrometers for spectral analysis. This advance is essential to realize the full potential of major new ground-based, suborbital, and future space facilities, and is relevant to the RMS and EOS panels. The recommended budget for this activity is $65M

Packages for Terahertz Electronics

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.119Ysciescopu