Power Management for Deep Submicron Microprocessors

As VLSI technology scales, the enhanced performance of smaller transistors comes at the expense of increased power consumption. In addition to the dynamic power consumed by the circuits there is a tremendous increase in the leakage power consumption which is further exacerbated by the increasing operating temperatures. The total power consumption of modern processors is distributed between the processor core, memory and interconnects. In this research two novel power management techniques are presented targeting the functional units and the global interconnects. First, since most leakage control schemes for processor functional units are based on circuit level techniques, such schemes inherently lack information about the operational profile of higher-level components of the system. This is a barrier to the pivotal task of predicting standby time. Without this prediction, it is extremely difficult to assess the value of any leakage control scheme. Consequently, a methodology that can predict the standby time is highly beneficial in bridging the gap between the information available at the application level and the circuit implementations. In this work, a novel Dynamic Sleep Signal Generator (DSSG) is presented. It utilizes the usage traces extracted from cycle accurate simulations of benchmark programs to predict the long standby periods associated with the various functional units. The DSSG bases its decisions on the current and previous standby state of the functional units to accurately predict the length of the next standby period. The DSSG presents an alternative to Static Sleep Signal Generation (SSSG) based on static counters that trigger the generation of the sleep signal when the functional units idle for a prespecified number of cycles. The test results of the DSSG are obtained by the use of a modified RISC superscalar processor, implemented by SimpleScalar, the most widely accepted open source vehicle for architectural analysis. In addition, the results are further verified by a Simultaneous Multithreading simulator implemented by SMTSIM. Leakage saving results shows an increase of up to 146% in leakage savings using the DSSG versus the SSSG, with an accuracy of 60-80% for predicting long standby periods. Second, chip designers in their effort to achieve timing closure, have focused on achieving the lowest possible interconnect delay through buffer insertion and routing techniques. This approach, though, taxes the power budget of modern ICs, especially those intended for wireless applications. Also, in order to achieve more functionality, die sizes are constantly increasing. This trend is leading to an increase in the average global interconnect length which, in turn, requires more buffers to achieve timing closure. Unconstrained buffering is bound to adversely affect the overall chip performance, if the power consumption is added as a major performance metric. In fact, the number of global interconnect buffers is expected to reach hundreds of thousands to achieve an appropriate timing closure. To mitigate the impact of the power consumed by the interconnect buffers, a power-efficient multi-pin routing technique is proposed in this research. The problem is based on a graph representation of the routing possibilities, including buffer insertion and identifying the least power path between the interconnect source and set of sinks. The novel multi-pin routing technique is tested by applying it to the ISPD and IBM benchmarks to verify the accuracy, complexity, and solution quality. Results obtained indicate that an average power savings as high as 32% for the 130-nm technology is achieved with no impact on the maximum chip frequency

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Customer premise service study for 30/20 GHz satellite system

Satellite systems in which the space segment operates in the 30/20 GHz frequency band are defined and compared as to their potential for providing various types of communications services to customer premises and the economic and technical feasibility of doing so. Technical tasks performed include: market postulation, definition of the ground segment, definition of the space segment, definition of the integrated satellite system, service costs for satellite systems, sensitivity analysis, and critical technology. Based on an analysis of market data, a sufficiently large market for services is projected so as to make the system economically viable. A large market, and hence a high capacity satellite system, is found to be necessary to minimize service costs, i.e., economy of scale is found to hold. The wide bandwidth expected to be available in the 30/20 GHz band, along with frequency reuse which further increases the effective system bandwidth, makes possible the high capacity system. Extensive ground networking is required in most systems to both connect users into the system and to interconnect Earth stations to provide spatial diversity. Earth station spatial diversity is found to be a cost effective means of compensating the large fading encountered in the 30/20 GHz operating band

Tiled microprocessors

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.Includes bibliographical references (p. 251-258).Current-day microprocessors have reached the point of diminishing returns due to inherent scalability limitations. This thesis examines the tiled microprocessor, a class of microprocessor which is physically scalable but inherits many of the desirable properties of conventional microprocessors. Tiled microprocessors are composed of an array of replicated tiles connected by a special class of network, the Scalar Operand Network (SON), which is optimized for low-latency, low-occupancy communication between remote ALUs on different tiles. Tiled microprocessors can be constructed to scale to 100's or 1000's of functional units. This thesis identifies seven key criteria for achieving physical scalability in tiled microprocessors. It employs an archetypal tiled microprocessor to examine the challenges in achieving these criteria and to explore the properties of Scalar Operand Networks. The thesis develops the field of SONs in three major ways: it introduces the 5-tuple performance metric, it describes a complete, high-frequency SON implementation, and it proposes a taxonomy, called AsTrO, for categorizing them.(cont.) To develop these ideas, the thesis details the design, implementation and analysis of a tiled microprocessor prototype, the Raw Microprocessor, which was implemented at MIT in 180 nm technology. Overall, compared to Raw, recent commercial processors with half the transistors required 30x as many lines of code, occupied 100x as many designers, contained 50x as many pre-tapeout bugs, and resulted in 33x as many post-tapeout bugs. At the same time, the Raw microprocessor proves to be more versatile in exploiting ILP, stream, and server-farm workloads with modest to large amounts of parallelism.by Michael Bedford Taylor.Ph.D

Intelligent Sensor Networks

In the last decade, wireless or wired sensor networks have attracted much attention. However, most designs target general sensor network issues including protocol stack (routing, MAC, etc.) and security issues. This book focuses on the close integration of sensing, networking, and smart signal processing via machine learning. Based on their world-class research, the authors present the fundamentals of intelligent sensor networks. They cover sensing and sampling, distributed signal processing, and intelligent signal learning. In addition, they present cutting-edge research results from leading experts

EUROSENSORS XVII : book of abstracts

Fundação Calouste Gulbenkien (FCG).Fundação para a Ciência e a Tecnologia (FCT)