PERFORMANCE STUDY OF 1 BIT STATIC RAM BASED ON PROCESS TECHNOLOGIES

A basic memory cell of Static Random Access Memory (SRAM) topology consists of four transistors which act as a flip flop and two more transistors will act as pass transistor. In this study, experiment is done by varying the values of different variables that can affect the performance of basic memory cell. Among the variables are magnitudes of voltage supply, temperature, clock frequency and process technology to be used in fabrication of memory cell. These variables will have their own limit due to the configuration of circuit and properties transistor parameters in the memory cell. These values will determine the performance of the memory cell. The studies are carried out using various process technologies by simulation at schematic level. The results show that higher clock frequency will require higher value of supplied voltage. Lower supplied voltage will make SRAM failed to operate at high temperature. Different process technology will also influence the value for minimum supplied voltage used and temperature range that the SRAM circuit can operate properly. The process technology of hpl4tb has the minimum voltage supply of0.83 Vat 5 MHz while amil6 has the widest effective range temperature from -229°C to 224°C at IOOMHz and 1.3 V simulation. i

PERFORMANCE STUDY OF 1 BIT STATIC RAM BASED ON PROCESS TECHNOLOGIES

A basic memory cell of Static Random Access Memory (SRAM) topology consists of four transistors which act as a flip flop and two more transistors will act as pass transistor. In this study, experiment is done by varying the values of different variables that can affect the performance of basic memory cell. Among the variables are magnitudes of voltage supply, temperature, clock frequency and process technology to be used in fabrication of memory cell. These variables will have their own limit due to the configuration of circuit and properties transistor parameters in the memory cell. These values will determine the performance of the memory cell. The studies are carried out using various process technologies by simulation at schematic level. The results show that higher clock frequency will require higher value of supplied voltage. Lower supplied voltage will make SRAM failed to operate at high temperature. Different process technology will also influence the value for minimum supplied voltage used and temperature range that the SRAM circuit can operate properly. The process technology of hpl4tb has the minimum voltage supply of0.83 Vat 5 MHz while amil6 has the widest effective range temperature from -229°C to 224°C at IOOMHz and 1.3 V simulation. i

A Study on Performance and Power Efficiency of Dense Non-Volatile Caches in Multi-Core Systems

In this paper, we present a novel cache design based on Multi-Level Cell Spin-Transfer Torque RAM (MLC STTRAM) that can dynamically adapt the set capacity and associativity to use efficiently the full potential of MLC STTRAM. We exploit the asymmetric nature of the MLC storage scheme to build cache lines featuring heterogeneous performances, that is, half of the cache lines are read-friendly, while the other is write-friendly. Furthermore, we propose to opportunistically deactivate ways in underutilized sets to convert MLC to Single-Level Cell (SLC) mode, which features overall better performance and lifetime. Our ultimate goal is to build a cache architecture that combines the capacity advantages of MLC and performance/energy advantages of SLC. Our experiments show an improvement of 43% in total numbers of conflict misses, 27% in memory access latency, 12% in system performance, and 26% in LLC access energy, with a slight degradation in cache lifetime (about 7%) compared to an SLC cache

dReDBox: Materializing a full-stack rack-scale system prototype of a next-generation disaggregated datacenter

Current datacenters are based on server machines, whose mainboard and hardware components form the baseline, monolithic building block that the rest of the system software, middleware and application stack are built upon. This leads to the following limitations: (a) resource proportionality of a multi-tray system is bounded by the basic building block (mainboard), (b) resource allocation to processes or virtual machines (VMs) is bounded by the available resources within the boundary of the mainboard, leading to spare resource fragmentation and inefficiencies, and (c) upgrades must be applied to each and every server even when only a specific component needs to be upgraded. The dRedBox project (Disaggregated Recursive Datacentre-in-a-Box) addresses the above limitations, and proposes the next generation, low-power, across form-factor datacenters, departing from the paradigm of the mainboard-as-a-unit and enabling the creation of function-block-as-a-unit. Hardware-level disaggregation and software-defined wiring of resources is supported by a full-fledged Type-1 hypervisor that can execute commodity virtual machines, which communicate over a low-latency and high-throughput software-defined optical network. To evaluate its novel approach, dRedBox will demonstrate application execution in the domains of network functions virtualization, infrastructure analytics, and real-time video surveillance.This work has been supported in part by EU H2020 ICTproject dRedBox, contract #687632.Peer ReviewedPostprint (author's final draft

Concepts for on-board satellite image registration. Volume 3: Impact of VLSI/VHSIC on satellite on-board signal processing

Anticipated major advances in integrated circuit technology in the near future are described as well as their impact on satellite onboard signal processing systems. Dramatic improvements in chip density, speed, power consumption, and system reliability are expected from very large scale integration. Improvements are expected from very large scale integration enable more intelligence to be placed on remote sensing platforms in space, meeting the goals of NASA's information adaptive system concept, a major component of the NASA End-to-End Data System program. A forecast of VLSI technological advances is presented, including a description of the Defense Department's very high speed integrated circuit program, a seven-year research and development effort

Improving the Performance and Endurance of Persistent Memory with Loose-Ordering Consistency

Persistent memory provides high-performance data persistence at main memory. Memory writes need to be performed in strict order to satisfy storage consistency requirements and enable correct recovery from system crashes. Unfortunately, adhering to such a strict order significantly degrades system performance and persistent memory endurance. This paper introduces a new mechanism, Loose-Ordering Consistency (LOC), that satisfies the ordering requirements at significantly lower performance and endurance loss. LOC consists of two key techniques. First, Eager Commit eliminates the need to perform a persistent commit record write within a transaction. We do so by ensuring that we can determine the status of all committed transactions during recovery by storing necessary metadata information statically with blocks of data written to memory. Second, Speculative Persistence relaxes the write ordering between transactions by allowing writes to be speculatively written to persistent memory. A speculative write is made visible to software only after its associated transaction commits. To enable this, our mechanism supports the tracking of committed transaction ID and multi-versioning in the CPU cache. Our evaluations show that LOC reduces the average performance overhead of memory persistence from 66.9% to 34.9% and the memory write traffic overhead from 17.1% to 3.4% on a variety of workloads.Comment: This paper has been accepted by IEEE Transactions on Parallel and Distributed System

Testing Embedded Memories in Telecommunication Systems

Extensive system testing is mandatory nowadays to achieve high product quality. Telecommunication systems are particularly sensitive to such a requirement; to maintain market competitiveness, manufacturers need to combine reduced costs, shorter life cycles, advanced technologies, and high quality. Moreover, strict reliability constraints usually impose very low fault latencies and a high degree of fault detection for both permanent and transient faults. This article analyzes major problems related to testing complex telecommunication systems, with particular emphasis on their memory modules, often so critical from the reliability point of view. In particular, advanced BIST-based solutions are analyzed, and two significant industrial case studies presente

A low-energy rate-adaptive bit-interleaved passive optical network

Energy consumption of customer premises equipment (CPE) has become a serious issue in the new generations of time-division multiplexing passive optical networks, which operate at 10 Gb/s or higher. It is becoming a major factor in global network energy consumption, and it poses problems during emergencies when CPE is battery-operated. In this paper, a low-energy passive optical network (PON) that uses a novel bit-interleaving downstream protocol is proposed. The details about the network architecture, protocol, and the key enabling implementation aspects, including dynamic traffic interleaving, rate-adaptive descrambling of decimated traffic, and the design and implementation of a downsampling clock and data recovery circuit, are described. The proposed concept is shown to reduce the energy consumption for protocol processing by a factor of 30. A detailed analysis of the energy consumption in the CPE shows that the interleaving protocol reduces the total energy consumption of the CPE significantly in comparison to the standard 10 Gb/s PON CPE. Experimental results obtained from measurements on the implemented CPE prototype confirm that the CPE consumes significantly less energy than the standard 10 Gb/s PON CPE