Book Review

A Scholarly Review of “Error Control for Network-On-Chip Links” (Authors: Bo Fu and Paul Ampadu, 2012)Fu, B.; and Ampadu, P. 2012. Error Control for Network-On-Chip Links.Springer Science+Business Media, LLC, New York, NY, USA.Available: <http://dx.doi.org/10.1007/978-1-4419-9313-7>

Data integrity for on-chip interconnects

With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologies, the global buses are fast becoming the "weakest-links" in VLSI design. They have large delays and are error-prone. Especially, in system-onchip (SoC) designs, where parallel interconnects run over large distances, they pose difficult research and design problems. This work presents an approach for evaluating the data carrying capacity of such wires. The method treats the delay and reliability in interconnects from an information theoretic perspective. The results point to an optimal frequency of operation for a given bus dimension for maximum data transfer rate. Moreover, this optimal frequency is higher than that achieved by present day designs which accommodate the worst case delays. This work also proposes several novel ways to approach this optimal data transfer rate in practical designs.From the analysis of signal propagation delay in long wires, it is seen that the signal delay distribution has a long tail, meaning that most signals arrive at the output much faster than the worst case delay. Using communication theory, these "good" signals arriving early can be used to predict/correct the "few" signals that arrive late. In addition to this correction based on prediction, the approaches use coding techniques to eliminate high delay cases to generate a higher transmission rate. The work also extends communication theoretic approaches to other areas of VLSI design. Parity groups are generated based on low output delay correlation to add redundancy in combinatorial circuits. This redundancy is used to increase the frequency of operation and/or reduce the energy consumption while improving the overall reliability of the circuit

High-performance long NoC link using delay-insensitive current-mode signaling

High-performance long-range NoC link enables efficient implementation of network-on-chip topologies which inherently require high-performance long-distance point-to-point communication such as torus and fat-tree structures. In addition, the performance of other topologies, such as mesh, can be improved by using high-performance link between few selected remote nodes.We presented novel implementation of high-performance long-range NoC link based onmultilevel current-mode signaling and delayinsensitive two-phase 1-of-4 encoding. Current-mode signaling reduces the communication latency of long wires significantlycompared to voltage-mode signaling, making it possible to achieve high throughput without pipelining and/or using repeaters. The performance of the proposed multilevel current-mode interconnect is analyzed and compared with two reference voltage mode interconnects. These two reference interconnects are designed using two-phase 1-of-4 encoded voltage-mode signaling, one with pipeline stages and the other using optimal repeater insertion. The proposed multilevel current-mode interconnect achieves higher throughput and lower latency than the two reference interconnects. Its throughput at 8mm wire length is 1.222GWord/swhich is 1.58 and 1.89 times higher than the pipelined and optimal repeater insertion interconnects, respectively. Furthermore, its power consumption is less than the optimal repeater insertion voltage-mode interconnect, at 10mm wire length its power consumption is 0.75mW while the reference repeater insertion interconnect is 1.066 mW. The effect of crosstalk is analyzed using four-bit parallel data transfer with the best-case and worst-case switching patterns and a transmission line model which has both capacitive coupling and inductive coupling.</p

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Aeronautical Engineering: A special bibliography with indexes, supplement 64, December 1975

This bibliography lists 288 reports, articles, and other documents introduced into the NASA scientific and technical information system in November 1975

SIGNAL PROCESSING TECHNIQUES AND APPLICATIONS

As the technologies scaling down, more transistors can be fabricated into the same area, which enables the integration of many components into the same substrate, referred to as system-on-chip (SoC). The components on SoC are connected by on-chip global interconnects. It has been shown in the recent International Technology Roadmap of Semiconductors (ITRS) that when scaling down, gate delay decreases, but global interconnect delay increases due to crosstalk. The interconnect delay has become a bottleneck of the overall system performance. Many techniques have been proposed to address crosstalk, such as shielding, buffer insertion, and crosstalk avoidance codes (CACs). The CAC is a promising technique due to its good crosstalk reduction, less power consumption and lower area. In this dissertation, I will present analytical delay models for on-chip interconnects with improved accuracy. This enables us to have a more accurate control of delays for transition patterns and lead to a more efficient CAC, whose worst-case delay is 30-40% smaller than the best of previously proposed CACs. As the clock frequency approaches multi-gigahertz, the parasitic inductance of on-chip interconnects has become significant and its detrimental effects, including increased delay, voltage overshoots and undershoots, and increased crosstalk noise, cannot be ignored. We introduce new CACs to address both capacitive and inductive couplings simultaneously.Quantum computers are more powerful in solving some NP problems than the classical computers. However, quantum computers suffer greatly from unwanted interactions with environment. Quantum error correction codes (QECCs) are needed to protect quantum information against noise and decoherence. Given their good error-correcting performance, it is desirable to adapt existing iterative decoding algorithms of LDPC codes to obtain LDPC-based QECCs. Several QECCs based on nonbinary LDPC codes have been proposed with a much better error-correcting performance than existing quantum codes over a qubit channel. In this dissertation, I will present stabilizer codes based on nonbinary QC-LDPC codes for qubit channels. The results will confirm the observation that QECCs based on nonbinary LDPC codes appear to achieve better performance than QECCs based on binary LDPC codes.As the technologies scaling down further to nanoscale, CMOS devices suffer greatly from the quantum mechanical effects. Some emerging nano devices, such as resonant tunneling diodes (RTDs), quantum cellular automata (QCA), and single electron transistors (SETs), have no such issues and are promising candidates to replace the traditional CMOS devices. Threshold gate, which can implement complex Boolean functions within a single gate, can be easily realized with these devices. Several applications dealing with real-valued signals have already been realized using nanotechnology based threshold gates. Unfortunately, the applications using finite fields, such as error correcting coding and cryptography, have not been realized using nanotechnology. The main obstacle is that they require a great number of exclusive-ORs (XORs), which cannot be realized in a single threshold gate. Besides, the fan-in of a threshold gate in RTD nanotechnology needs to be bounded for both reliability and performance purpose. In this dissertation, I will present a majority-class threshold architecture of XORs with bounded fan-in, and compare it with a Boolean-class architecture. I will show an application of the proposed XORs for the finite field multiplications. The analysis results will show that the majority class outperforms the Boolean class architectures in terms of hardware complexity and latency. I will also introduce a sort-and-search algorithm, which can be used for implementations of any symmetric functions. Since XOR is a special symmetric function, it can be implemented via the sort-and-search algorithm. To leverage the power of multi-input threshold functions, I generalize the previously proposed sort-and-search algorithm from a fan-in of two to arbitrary fan-ins, and propose an architecture of multi-input XORs with bounded fan-ins

SiGe Millimeter-Wave (W-Band) Down-Converter for Phased Focal Plane Array

A millimeter-wave (W-Band) down-converter for Phased Focal Plane Arrays (PFPAs) has been designed and fabricated using the IBM Silicon-Germanium (SiGe) BiCMOS 8HP process technology. The radio frequency (RF) input range of the down-converter chip is from 70 95GHz. The intermediate frequency (IF) range is from 5 30GHz. The local oscillator (LO) frequency is fixed at 65GHz. The down-converter chip has been designed to achieve a conversion gain greater than 20dB, a noise figure (NF) below 10dB and input return loss greater than 10dB. The chip also has novel LO circuitry facilitating LO feed-through among down-converters chips in parallel. This wide bandwidth down-converter will be part of millimeter-wave PFPA receiver designed and fabricated in collaboration with the University of Massachusetts-Amherst Department of Astronomy. This PFPA receiver will be installed on Green Bank Telescope (GMT) / Large millimeter wave telescope (LMT) in Q2 of 2014. This project is collaboration between the University of Massachusetts-Amherst (UMass), Brigham Young University (BYU) and National Radio Astronomy Observatory (NRAO). To the best of the author’s knowledge, this is first wide bandwidth down-converter at W-band to achieve this high gain and low noise figure among Si/SiGe based systems

Communication Reliability in Network on Chip Designs

The performance of low latency Network on Chip (NoC) architectures, which incorporate fast bypass paths to reduce communication latency, is limited by crosstalk induced skewing of signal transitions on link wires. As a result of crosstalk interactions between wires, signal transitions belonging to the same flit or bit vector arrive at the destination at different times and are likely to violate setup and hold time constraints for the design. This thesis proposes a two-step technique: TransSync- RecSync, to dynamically eliminate packet errors resulting from inter-bit-line transition skew. The proposed approach adds minimally to router complexity and involves no wire overhead. The actual throughput of NoC designs with asynchronous bypass designs is evaluated and the benefits of augmenting such schemes with the proposed design are studied. The TransSync, TransSync-2-lines and RecSync schemes described here are found to improve the average communication latency by 26%, 20% and 38% respectively in a 7X7 mesh NoC with asynchronous bypass channel. This work also evaluates the bit-error ratio (BER) performance of several existing crosstalk avoidance and error correcting schemes and compares them to that of the proposed schemes. Both TransSync and RecSync scheme are dynamic in nature and can be switched on and off on-the-fly. The proposed schemes can therefore be employed to impart unequal error protection (UEP) against intra-flit skewing on NoC links. In the UEP, a larger fraction of the energy budget is spent in providing protection to those parts of the data being transmitted on the link which have a higher priority, while expending smaller effort in protecting relatively less important parts of the data. This allows us to achieve the prescribed level of performance with lower levels of power. The benefits of the presented technique are illustrated using an H.264 video decoder system-on-chip (SoC) employing NoC architecture. We show that for Akyio test streams transmitted over 3mm long link wires, the power consumption can be reduced by as much as 20% at the cost of an acceptable degradation in average peak signal to noise ratio (PSNR) with UEP

Status of Muon Collider Research and Development and Future Plans

The status of the research on muon colliders is discussed and plans are outlined for future theoretical and experimental studies. Besides continued work on the parameters of a 3-4 and 0.5 TeV center-of-mass (CoM) energy collider, many studies are now concentrating on a machine near 0.1 TeV (CoM) that could be a factory for the s-channel production of Higgs particles. We discuss the research on the various components in such muon colliders, starting from the proton accelerator needed to generate pions from a heavy-Z target and proceeding through the phase rotation and decay ($\pi \to \mu \nu_{\mu}$) channel, muon cooling, acceleration, storage in a collider ring and the collider detector. We also present theoretical and experimental R & D plans for the next several years that should lead to a better understanding of the design and feasibility issues for all of the components. This report is an update of the progress on the R & D since the Feasibility Study of Muon Colliders presented at the Snowmass'96 Workshop [R. B. Palmer, A. Sessler and A. Tollestrup, Proceedings of the 1996 DPF/DPB Summer Study on High-Energy Physics (Stanford Linear Accelerator Center, Menlo Park, CA, 1997)].Comment: 95 pages, 75 figures. Submitted to Physical Review Special Topics, Accelerators and Beam