Testing Embedded Memories in Telecommunication Systems

Extensive system testing is mandatory nowadays to achieve high product quality. Telecommunication systems are particularly sensitive to such a requirement; to maintain market competitiveness, manufacturers need to combine reduced costs, shorter life cycles, advanced technologies, and high quality. Moreover, strict reliability constraints usually impose very low fault latencies and a high degree of fault detection for both permanent and transient faults. This article analyzes major problems related to testing complex telecommunication systems, with particular emphasis on their memory modules, often so critical from the reliability point of view. In particular, advanced BIST-based solutions are analyzed, and two significant industrial case studies presente

Power Minimisation Techniques for Testing Low Power VLSI Circuits (PhD Dissertation)

Testing low power very large scale integrated (VLSI) circuits has recently become an area of concern due to yield and reliability problems. This dissertation focuses on minimising power dissipation during test application at logic level and register-transfer level (RTL) of abstraction of the VLSI design flow. The first part of this dissertation addresses power minimisation techniques in scan sequential circuits at the logic level of abstraction. A new best primary input change (BPIC) technique based on a novel test application strategy has been proposed. The technique increases the correlation between successive states during shifting in test vectors and shifting out test responses by changing the primary inputs such that the smallest number of transitions is achieved. The new technique is test set dependent and it is applicable to small to medium sized full and partial scan sequential circuits. Since the proposed test application strategy depends only on controlling primary input change time, power is minimised with no penalty in test area, performance, test efficiency, test application time or volume of test data. Furthermore, it is shown that partial scan does not provide only the commonly known benefits such as less test area overhead and test application time, but also less power dissipation during test application when compared to full scan. To achieve power savings in large scan sequential circuits a new test set independent multiple scan chain-based technique which employs a new design for test (DFT) architecture and a novel test application strategy, is presented. The technique has been validated using benchmark examples, and it has been shown that power is minimised with low computational time, low overhead in test area and volume of test data, and with no penalty in test application time, test efficiency, or performance. The second part of this dissertation addresses power minimisation techniques for testing low power VLSI circuits using built-in self-test (BIST) at RTL. First, it is important to overcome the shortcomings associated with traditional BIST methodologies. It is shown how a new BIST methodology for RTL data paths using a novel concept called test compatibility classes (TCC) overcomes high test application time, BIST area overhead, performance degradation, volume of test data, fault-escape probability, and complexity of the testable design space exploration. Second, power minimisation in BIST RTL data paths is achieved by analysing the effect of test synthesis and test scheduling on power dissipation during test application and by employing new power conscious test synthesis and test scheduling algorithms. Third, the new BIST methodology has been validated using benchmark examples. Further, it is shown that when the proposed power conscious test synthesis and test scheduling is combined with novel test compatibility classes simultaneous reduction in test application time and power dissipation is achieved with low overhead in computational time

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

Scalable diversified antirandom test pattern generation with improved fault coverage for black-box circuit testing

Pseudorandom testing is incapable of utilizing the success rate of preceding test patterns while generating subsequent test patterns. Many redundant test patterns have been generated that increase the test length without any significant increase in the fault coverage. An extension to pseudorandom testing is Antirandom that induces divergent patterns by maximizing the Total Hamming Distance (THD) and Total Cartesian Distance (TCD) of every subsequent test pattern. However, the Antirandom test sequence generation algorithm is prone to unsystematic selection when more than one patterns possess maximum THD and TCD. As a result, diversity among test sequences is compromised, lowering the fault coverage. Therefore, this thesis analyses the effect of Hamming distance in vertical as well as horizontal dimension to enhance diversity among test patterns. First contribution of this thesis is the proposal of a Diverse Antirandom (DAR) test pattern generation algorithm. DAR employs Horizontal Total Hamming Distance (HTHD) along with THD and TCD for diversity enhancement among test patterns as maximum distance test pattern generation. The HTHD and TCD are used as distance metrics that increase computational complexity in divergent test sequence generation. Therefore, the second contribution of this thesis is the proposal of tree traversal search method to maximize diversity among test patterns. The proposed method uses bits mutation of a temporary test pattern following a path leading towards maximization of TCD. Results of fault simulations on benchmark circuits have shown that DAR significantly improves the fault coverage up to 18.3% as compared to Antirandom. Moreover, the computational complexity of Antirandom is reduced from exponential O(2n) to linear O(n). Next, the DARalgorithm is modified to ease hardware implementation for on-chip test generation. Therefore, the third contribution of this thesis is the design of a hardware-oriented DAR (HODA) test pattern generator architecture as an alternative to linear feedback shift register (LFSR) that consists of large number of memory elements. Parallel concatenation of the HODA architecture is designed to reduce the number of memory elements by implementing bit slicing architecture. It has been proven through simulation that the proposed architecture has increased fault coverage up to 66% and a reduction of 46.59% gate count compared to the LFSR. Consequently, this thesis presents uniform and scalable test pattern generator architecture for built-in self-test (BIST) applications and solution to maximum distance test pattern generation for high fault coverage in black-box environment