A 0.1–5.0 GHz flexible SDR receiver with digitally assisted calibration in 65 nm CMOS

© 2017 Elsevier Ltd. All rights reserved.A 0.1–5.0 GHz flexible software-defined radio (SDR) receiver with digitally assisted calibration is presented, employing a zero-IF/low-IF reconfigurable architecture for both wideband and narrowband applications. The receiver composes of a main-path based on a current-mode mixer for low noise, a high linearity sub-path based on a voltage-mode passive mixer for out-of-band rejection, and a harmonic rejection (HR) path with vector gain calibration. A dual feedback LNA with “8” shape nested inductor structure, a cascode inverter-based TCA with miller feedback compensation, and a class-AB full differential Op-Amp with Miller feed-forward compensation and QFG technique are proposed. Digitally assisted calibration methods for HR, IIP2 and image rejection (IR) are presented to maintain high performance over PVT variations. The presented receiver is implemented in 65 nm CMOS with 5.4 mm2 core area, consuming 9.6–47.4 mA current under 1.2 V supply. The receiver main path is measured with +5 dB m/+5dBm IB-IIP3/OB-IIP3 and +61dBm IIP2. The sub-path achieves +10 dB m/+18dBm IB-IIP3/OB-IIP3 and +62dBm IIP2, as well as 10 dB RF filtering rejection at 10 MHz offset. The HR-path reaches +13 dB m/+14dBm IB-IIP3/OB-IIP3 and 62/66 dB 3rd/5th-order harmonic rejection with 30–40 dB improvement by the calibration. The measured sensitivity satisfies the requirements of DVB-H, LTE, 802.11 g, and ZigBee.Peer reviewedFinal Accepted Versio

Performance enhancement in the desing of amplifier and amplifier-less circuits in modern CMOS technologies.

In the context of nowadays CMOS technology downscaling and the increasing demand of high performance electronics by industry and consumers, analog design has become a major challenge. On the one hand, beyond others, amplifiers have traditionally been a key cell for many analog systems whose overall performance strongly depends on those of the amplifier. Consequently, still today, achieving high performance amplifiers is essential. On the other hand, due to the increasing difficulty in achieving high performance amplifiers in downscaled modern technologies, a different research line that replaces the amplifier by other more easily achievable cells appears: the so called amplifier-less techniques. This thesis explores and contributes to both philosophies. Specifically, a lowvoltage differential input pair is proposed, with which three multistage amplifiers in the state of art are designed, analysed and tested. Moreover, a structure for the implementation of differential switched capacitor circuits, specially suitable for comparator-based circuits, that features lower distortion and less noise than the classical differential structures is proposed, an, as a proof of concept, implemented in a ΔΣ modulator

An improved reversed miller compensation technique for three-stage CMOS OTAs with double pole-zero cancellation and almost single-pole frequency response

This paper presents an improved reversed nested Miller compensation technique exploiting a single additional feed-forward stage to obtain double pole-zero cancellation and ideally single-pole behavior, in a three-stage Miller amplifier. The approach allows designing a three-stage operational transconductance amplifier (OTA) with one dominant pole and two (ideally) mutually cancelling pole-zero doublets. We demonstrate the robustness of the proposed cancellation technique, showing that it is not significantly influenced by process and temperature variations. The proposed design equations allow setting the unity-gain frequency of the amplifier and the complex poles' resonance frequency and quality factor. We introduce the notion of bandwidth efficiency to quantify the OTA performance with respect to a telescopic cascode OTA for given load capacitance and power consumption constraints and demonstrate analytically that the proposed approach allows a bandwidth efficiency that can ideally approach 100%. A CMOS implementation of the proposed compensation technique is provided, in which a current reuse scheme is used to reduce the total current consumption. The OTA has been designed using a 130-nm CMOS process by STMicroelectronics and achieves a DC gain larger than 120 dB, with almost single-pole frequency response. Monte Carlo simulations have been performed to show the robustness of the proposed approach to process, voltage, and temperature (PVT) variations and mismatches

Power amplifier design in digital CMOS processes

The ability to integrate designs from board level, multi-chip modules to single process solutions is highly attractive in today's PC multimedia industry. Saving board area and chip count will decrease the production cost of personal computing hardware and increase profitability. The ability to integrate analog circuit capability and it's reference circuitry with DSP cores and processors creates a highly profitable line of products. This possible line of products warrants research and development of the ability to produce high quality analog functionality in digital processes. Techniques for analog design in digital processes are valuable pieces of intellectual property. Digital processes rarely include analog functionality and analog processes' feature sizes tend to be several generations behind those of the digital. Personal computing is a driving force behind today's integrated circuit market. The primary functionality of the PC utilizes mainly digital products. The most prevalent products are processors closely followed by Digital Signal Processing cores. In these cases analog functionality has been implemented at the board level in costly analog chip packages such as sound cards and reference systems. The ability to integrate all of the analog and digital functionality on a single die, even at a lower performance level is profitable and attractive option for today's PC multimedia industry. Three amplifiers have been designed and tested in a digital CMOS process. The goal of this effort is to provide some insight into the feasibility of precision analog functionality in digital processes. Each amplifier has been tested with three types of resistors and three types of capacitors readily available in digital processes. The results are tabulated and some insights into the design theory are presented. And finally some insight into amplifier topological choices when only specific passive components are available are shared

A 0.3 V rail-to-rail ultra-low-power OTA with improved bandwidth and slew rate

In this paper, we present a novel operational transconductance amplifier (OTA) topology based on a dual-path body-driven input stage that exploits a body-driven current mirror-active load and targets ultra-low-power (ULP) and ultra-low-voltage (ULV) applications, such as IoT or biomedical devices. The proposed OTA exhibits only one high-impedance node, and can therefore be compensated at the output stage, thus not requiring Miller compensation. The input stage ensures rail-to-rail input common-mode range, whereas the gate-driven output stage ensures both a high open-loop gain and an enhanced slew rate. The proposed amplifier was designed in an STMicroelectronics 130 nm CMOS process with a nominal supply voltage of only 0.3 V, and it achieved very good values for both the small-signal and large-signal Figures of Merit. Extensive PVT (process, supply voltage, and temperature) and mismatch simulations are reported to prove the robustness of the proposed amplifier

A neural probe with up to 966 electrodes and up to 384 configurable channels in 0.13 μm SOI CMOS

In vivo recording of neural action-potential and local-field-potential signals requires the use of high-resolution penetrating probes. Several international initiatives to better understand the brain are driving technology efforts towards maximizing the number of recording sites while minimizing the neural probe dimensions. We designed and fabricated (0.13-μm SOI Al CMOS) a 384-channel configurable neural probe for large-scale in vivo recording of neural signals. Up to 966 selectable active electrodes were integrated along an implantable shank (70 μm wide, 10 mm long, 20 μm thick), achieving a crosstalk of −64.4 dB. The probe base (5 × 9 mm2) implements dual-band recording and a 1

Analysis and Characterization of a SiGe BiCMOS Low Power Operational Amplifier

Integrated circuit design for space applications can require radiation immunity, cryogenic operation and low power consumption. This thesis provides analysis and characterization of a SiGe BiCMOS low power operational amplifier (op amp) designed for lunar surface applications. The op amp has been fabricated on a commercially available 0.35-micron Silicon-Germanium (SiGe) BiCMOS process. The Heterojunction bipolar transistors (HBT) available in the SiGe process have been used in this op amp to take advantage of the total ionizing dose (TID) irradiation immunity and superb cryogenic operation, along with PMOS devices that show better TID immunity than their NMOS counterparts. The key features of the op amp include rail-to-rail output voltage swing, low input offset voltage, high open-loop gain and low supply current. The characterization of op amp is done for extreme temperatures and the results demonstrate that the op amp is fully functional across the lunar surface temperature range of −180°C to +120°C. The wide temperature operation of this op amp is tested using different bias current techniques such as proportional-to-absolute-temperature current, constant current and constant inversion coefficient current sources to investigate optimal biasing strategies for BiCMOS analog design. In addition, the SiGe BiCMOS low power op amp provides lower power consumption with the same or better unity-gain bandwidth when compared to a CMOS op amp with similar circuit topology

[Delta] IDDQ testing of a CMOS 12-bit charge scaling digital-to-analog converter

This work presents design, implementation and test of a built-in current sensor (BICS) for ∆IDDQ testing of a CMOS 12-bit charge scaling digital-to-analog converter (DAC). The sensor uses power discharge method for the fault detection. The sensor operates in two modes, the test mode and the normal mode. In the test mode, the BICS is connected to the circuit under test (CUT) which is DAC and detects abnormal currents caused by manufacturing defects. In the normal mode, BICS is isolated from the CUT. The BICS is integrated with the DAC and is implemented in a 0.5 μm n-well CMOS technology. The DAC uses charge scaling method for the design and a low voltage (0 to 2.5 V) folded cascode op-amp. The built-in current sensor (BICS) has a resolution of 0.5 μA. Faults have been introduced into DAC using fault injection transistors (FITs). The method of ∆IDDQ testing has been verified both from simulation and experimental measurements