Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

High-level synthesis of dataflow programs for heterogeneous platforms:design flow tools and design space exploration

The growing complexity of digital signal processing applications implemented in programmable logic and embedded processors make a compelling case the use of high-level methodologies for their design and implementation. Past research has shown that for complex systems, raising the level of abstraction does not necessarily come at a cost in terms of performance or resource requirements. As a matter of fact, high-level synthesis tools supporting such a high abstraction often rival and on occasion improve low-level design. In spite of these successes, high-level synthesis still relies on programs being written with the target and often the synthesis process, in mind. In other words, imperative languages such as C or C++, most used languages for high-level synthesis, are either modified or a constrained subset is used to make parallelism explicit. In addition, a proper behavioral description that permits the unification for hardware and software design is still an elusive goal for heterogeneous platforms. A promising behavioral description capable of expressing both sequential and parallel application is RVC-CAL. RVC-CAL is a dataflow programming language that permits design abstraction, modularity, and portability. The objective of this thesis is to provide a high-level synthesis solution for RVC-CAL dataflow programs and provide an RVC-CAL design flow for heterogeneous platforms. The main contributions of this thesis are: a high-level synthesis infrastructure that supports the full specification of RVC-CAL, an action selection strategy for supporting parallel read and writes of list of tokens in hardware synthesis, a dynamic fine-grain profiling for synthesized dataflow programs, an iterative design space exploration framework that permits the performance estimation, analysis, and optimization of heterogeneous platforms, and finally a clock gating strategy that reduces the dynamic power consumption. Experimental results on all stages of the provided design flow, demonstrate the capabilities of the tools for high-level synthesis, software hardware Co-Design, design space exploration, and power optimization for reconfigurable hardware. Consequently, this work proves the viability of complex systems design and implementation using dataflow programming, not only for system-level simulation but real heterogeneous implementations

Modelling energy efficiency for computation

In the last decade, efficient use of energy has become a topic of global significance, touching almost every area of modern life, including computing. From mobile to desktop to server, energy efficiency concerns are now ubiquitous. However, approaches to the energy problem are often piecemeal and focus on only one area for improvement. I argue that the strands of the energy problem are inextricably entangled and cannot be solved in isolation. I offer a high-level view of the problem and, building from it, explore a selection of subproblems within the field. I approach these with various levels of formality, and demonstrate techniques to make improvements on all levels.Clare College Domestic Research Scholarshi

Aeronautical engineering: A continuing bibliography with indexes (supplement 202)

This bibliography lists 447 reports, articles and other documents introduced into the NASA scientific and technical information system in June 1986

Multivoltage Scheduling with Voltage-Partitioned Variable Storage

Multivoltage scheduling (MVS) for datapaths offers the energy savings of voltage scaling on a per-operation basis with a voltage aware operator scheduling. This work investigates the effect of using multivoltage register file storage in operator graph scheduling for multivoltage datapaths, thus partitioning the variable storage space on the basis of operating voltages. Scheduling operations on multivoltage functional units lowers the energy-delay product by exploiting slack in the schedule. We find that using multivoltage partitioned register files do the same by exploiting the variable lifetimes in the schedule. In a resource constrained context, longer variable lifetimes provide the opportunity to store such variables in low voltage register files. A ZOLP formulation for the resource constrained MVS problem is presented along with energy-delay savings obtained from applying this formulation to image processing transform graphs

Bibliography of Lewis Research Center technical publications announced in 1988

This bibliography contains abstracts of the technical reports that resulted from the scientific and engineering work performed and managed by the Lewis Research Center in 1988. Subject, author, and corporate source indexes are also included. All the publications were announced in the 1988 issues of STAR (Scientific and Technical Aerospace Reports) and/or IAA (International Aerospace Abstracts). Included are research reports, journal articles, conference presentations, patents and patent applications, and theses