Impact of Multi-level Clustering on Performance Driven Global Placement

Delay and wirelength minimization continue to be important objectives in the design of high-performance computing systems. For large-scale circuits, the clustering process becomes essential for reducing the problem size. However, to the best of our knowledge, there is no study about the impact of multi-level clustering on performance-driven global placement. In this paper, five clustering algorithms including the quasi-optimal retiming delay driven PRIME and the cutsize-driven ESC have been considered for their impact on state-of-the-art mincut based global placement. Results show that minimizing cutsize or wirelength during clustering typically results in significant performance improvements

Multilevel Global Placement with Retiming

Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipelining on global interconnects. In this paper, we present a practical solution for simultaneous retiming and multilevel global placement for performance optimization, based on the theory and algorithms of sequential timing analysis (Seq-TA). We extend the Seq-TA to handle gates/clusters with multiple outputs and integrate it into a multilevel optimization framework for simultaneous retiming and placement. We also develop two speed-up techniques which enable the Seq-TA to be efficiently integrated into a simulated annealing-based multilevel coarse placement for large-scale designs. Experimental results show that (i) retiming can improve the performance (delay) by 14% on average when it is applied after placement; (ii) our approach for simultaneous retiming and placement can outperform the two-step approach (placement followed by retiming) by 10% on average in terms of delay minimization