Simulated Annealing

The book contains 15 chapters presenting recent contributions of top researchers working with Simulated Annealing (SA). Although it represents a small sample of the research activity on SA, the book will certainly serve as a valuable tool for researchers interested in getting involved in this multidisciplinary field. In fact, one of the salient features is that the book is highly multidisciplinary in terms of application areas since it assembles experts from the fields of Biology, Telecommunications, Geology, Electronics and Medicine

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Secure Physical Design

An integrated circuit is subject to a number of attacks including information leakage, side-channel attacks, fault-injection, malicious change, reverse engineering, and piracy. Majority of these attacks take advantage of physical placement and routing of cells and interconnects. Several measures have already been proposed to deal with security issues of the high level functional design and logic synthesis. However, to ensure end-to-end trustworthy IC design flow, it is necessary to have security sign-off during physical design flow. This paper presents a secure physical design roadmap to enable end-to-end trustworthy IC design flow. The paper also discusses utilization of AI/ML to establish security at the layout level. Major research challenges in obtaining a secure physical design are also discussed

A Comprehensive Survey on Particle Swarm Optimization Algorithm and Its Applications

Particle swarm optimization (PSO) is a heuristic global optimization method, proposed originally by Kennedy and Eberhart in 1995. It is now one of the most commonly used optimization techniques. This survey presented a comprehensive investigation of PSO. On one hand, we provided advances with PSO, including its modifications (including quantum-behaved PSO, bare-bones PSO, chaotic PSO, and fuzzy PSO), population topology (as fully connected, von Neumann, ring, star, random, etc.), hybridization (with genetic algorithm, simulated annealing, Tabu search, artificial immune system, ant colony algorithm, artificial bee colony, differential evolution, harmonic search, and biogeography-based optimization), extensions (to multiobjective, constrained, discrete, and binary optimization), theoretical analysis (parameter selection and tuning, and convergence analysis), and parallel implementation (in multicore, multiprocessor, GPU, and cloud computing forms). On the other hand, we offered a survey on applications of PSO to the following eight fields: electrical and electronic engineering, automation control systems, communication theory, operations research, mechanical engineering, fuel and energy, medicine, chemistry, and biology. It is hoped that this survey would be beneficial for the researchers studying PSO algorithms

A Comprehensive Review of Bio-Inspired Optimization Algorithms Including Applications in Microelectronics and Nanophotonics

The application of artificial intelligence in everyday life is becoming all-pervasive and unavoidable. Within that vast field, a special place belongs to biomimetic/bio-inspired algorithms for multiparameter optimization, which find their use in a large number of areas. Novel methods and advances are being published at an accelerated pace. Because of that, in spite of the fact that there are a lot of surveys and reviews in the field, they quickly become dated. Thus, it is of importance to keep pace with the current developments. In this review, we first consider a possible classification of bio-inspired multiparameter optimization methods because papers dedicated to that area are relatively scarce and often contradictory. We proceed by describing in some detail some more prominent approaches, as well as those most recently published. Finally, we consider the use of biomimetic algorithms in two related wide fields, namely microelectronics (including circuit design optimization) and nanophotonics (including inverse design of structures such as photonic crystals, nanoplasmonic configurations and metamaterials). We attempted to keep this broad survey self-contained so it can be of use not only to scholars in the related fields, but also to all those interested in the latest developments in this attractive area

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Enabling Capillary Self-Assembly for Microsystem Integration

Efficient and precise assembly of very-large quantities of sub-millimeter-sized devices onto pre-processed substrates is presently a key frontier for microelectronics, in its aspiration to large-scale mass production of devices with new functionalities and applications (e.g. thin dies embedded into flexible substrates, 3D microsystem integration). In this perspective, on the one hand established pick&place assembly techniques may be unsuitable, due to a trade-off between throughput and placement accuracy and to difficulties in predictably handling very-small devices. On the other hand, self-assembly processes are massively parallel, may run unsupervised and allow contactless manipulation of objects. The convergence between robotic assembly and self-assembly, epitomized by capillarity-enhanced flip-chip assembly, can therefore enable an ideal technology meeting short-to-medium-term electronic packaging and assembly needs. The objective of this thesis is bridging the gap between academic proofs-of- concept of capillary self-assembly and its industrial application. Our work solves several issues relevant to capillary self-assembly of thin dies onto preprocessed substrates. Very-different phenomena and aspects of both scientific and technological interest coexist in such a broad context. They were tackled both experimentally and theoretically. After a critical review of the state-of-the-art in microsystem integration, a complete quasi-static study of lateral capillary meniscus forces is presented. Our experimental setup enables also a novel method to measure the contact angle of liquids. Recessed binding sites are introduced to obtain perfectly-conformal fluid dip-coating of patterned surfaces, which enables the effective and robust coding of geometrical information into binding sites to direct the assembly of parts. A general procedure to establish solder-mediated electro-mechanical interconnections between parts and substrate is validated. Smart surface chemistries are invoked to solve the issue of mutual adhesion between parts during the capillary self-assembly process. Two chemical kinetic-inspired analytic models of fluidic self-assembly are presented and criticized to introduce a novel agent-based model of the process. The latter approach allows realistic simulations by taking into account spatial factors and collision dynamics. Concluding speculations propose envisioned solutions to residual open issues and further perspectives for this field of rapidly-growing importance