MODELING THE PHYSICS OF FAILURE FOR ELECTRONIC PACKAGING COMPONENTS SUBJECTED TO THERMAL AND MECHANICAL LOADING

This dissertation presents three separate studies that examined electronic components using numerical modeling approaches. The use of modeling techniques provided a deeper understanding of the physical phenomena that contribute to the formation of cracks inside ceramic capacitors, damage inside plated through holes, and to dynamic fracture of MEMS structures. The modeling yielded numerical substantiations for previously proposed theoretical explanations. Multi-Layer Ceramic Capacitors (MLCCs) mounted with stiffer lead-free solder have shown greater tolerance than tin-lead solder for single cycle board bending loads with low strain rates. In contrast, flexible terminations have greater tolerance than stiffer standard terminations under the same conditions. It has been proposed that residual stresses in the capacitor account for this disparity. These stresses have been attributed to the higher solidification temperature of lead free solders coupled with the CTE mismatch between the board and the capacitor ceramic. This research indicated that the higher solidification temperatures affected the residual stresses. Inaccuracies in predicting barrel failures of plated through holes are suspected to arise from neglecting the effects of the reflow process on the copper material. This research used thermo mechanical analysis (TMA) results to model the damage in the copper above the glass transition temperature (Tg) during reflow. Damage estimates from the hysteresis plots were used to improve failure predictions. Modeling was performed to examine the theory that brittle fracture in MEMS structures is not affected by strain rates. Numerical modeling was conducted to predict the probability of dynamic failure caused by shock loads. The models used a quasi-static global gravitational load to predict the probability of brittle fracture. The research presented in this dissertation explored drivers for failure mechanisms in flex cracking of capacitors, barrel failures in plated through holes, and dynamic fracture of MEMS. The studies used numerical modeling to provide new insights into underlying physical phenomena. In each case, theoretical explanations were examined where difficult geometries and complex material properties made it difficult or impossible to obtain direct measurements

A systematic analysis of printed circuit boards bending during in-circuit tests

When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce excessive strain. This study focuses on the building of a Finite Elements Analysis (FEA) methodology that prevents excessive bending strain in critical points of a PCB during an ICT. To validate this methodology, a set of experimental tests, matched with a set of FEA, were carried out. Thus, companies, before the development of an ICT machine (fixture), will be able to use this FEA methodology to predict whether the maximum strain of a PCB under study, when subjected to its ICT, will damage it, thus reducing unnecessary production costs. A guideline was thus designed to enable the creation of the most representative Finite Elements Model (FEM) for any PCB, based on its amount and direction of copper traces.This work is co-funded by the European Regional Development Fund (ERDF) through the North Regional Operational Program (NORTE 2020) of the Portugal 2020 Program (Project No. 43922, with acronym “iFixturing”; Funding Reference NORTE-01-0247-FEDER-043922)

Three-Dimensional Finite Element Analysis of Conventional and Ultrasonic Vibration Assisted Micro-Drilling on PCB

Recent advancement in society’s demands has forced industries to produce more and more precise micro parts. With an advancement in engineering sciences, current manufacturers in various fields such as aerospace, medical, electronics, automobile, biotechnology, etc. have achieved the potential to fabricate miniaturized products, but with numerous technical challenges. Dimensional accuracy and surface integrity of the machined components are the key challenges and at the same time, cost minimization is strongly desired. To meet these challenges and demands, improvements in machining regarding new procedures, tooling, tool materials and modern machine tools are highly essential. Micromachining has shown potential to achieve the fast-growing needs of the present micro manufacturing sector. Additionally, new machining techniques like ultrasonic machining, laser drilling, etc. have been developed as an alternative source to reduce obstructions caused during macro/micro machining. The present research aims to perform three-dimensional (3D) finite element dynamic analysis for micro-drilling of multi-layer printed circuit boards (PCBs). Both conventional and ultrasonic vibration assisted micro-drilling (UVAMD) FE simulations have been compared to predict and evaluate the effect of process parameters on the output responses like stress generation and reaction forces and burr formation on the workpiece surfaces. The Lagrangian based approach is followed for the FE simulation including the mass and inertial properties of the proposed FE model. The predicted FE results are compared with the past experimental work for thrust force evaluation and burr formation on workpiece surfaces. The present work is supported with modal and harmonic analysis of stepped and conical horns along with micro drill bit. Here, horns made up of Aluminum 6061-T6, Titanium and Mild steel are chosen with micro drill bit of 0.3 mm diameter with varying tool materials (Tungsten carbide and High speed steel). The effects of natural frequencies with different mode shapes within the range of 15-30 kHz are shown. The frequency responses of micro drill with displacement conditions have been presented for longitudinal modes. The present simulation results will be helpful to conduct proper experimentation in order to achieve efficient machining and surface finish. The results enumerate that the drilling parameters have a strong influence on thrust forces and stresses occurring in micro-drilling. Ultrasonic assisted micro-drilling has a good potential in reduction of forces generated by vii selecting proper machining parameters. The FE simulation of UVA micro machining can further be enhanced and extended to various materials like plastics, sheet metal, other PCBs, etc. to predict the performance with varying machining and geometrical parameters

First self-resonant frequency of power inductors based on approximated corrected stray capacitances

Inductive devices are extensively employed in power electronic systems due to their magnetic energy storage and power transfer capabilities. The current trend is towards increasing the frequency of operation in order to reduce the size of the magnetic components, but the main drawback is that the parasitic capacitance effect can become significant, and degrade the performance of the system. This work analyses the influence of this stray capacitance, and considers how to improve the performance of the device. In general, the impact of the stray capacitance on a magnetic component can be reduced by two methods: reducing the parasitic capacitance between turns of the winding or, alternatively, modifying the arrangement of the connection between turns. To evaluate the last option, an approximated expression of the first self-resonant frequency of the magnetic device is proposed. This gives a rapid assessment of the performance of different devices maintaining the overall equivalent inductance. The proposed expression accounts for the influence of the connection between turns in the bandwidth of the component. Finally, some numerical results are verified with planar coils manufactured on two-layer printed circuit boards

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit. Finite element analysis (FEA) is a numerical method of analysis for stresses and strain in structures of any given geometry

A physics-based pi pre-layout tool for PCB PDN design

With increasingly stringent requirements for lower voltage supply, and higher density in PCB PDN design, now integrity (PI) is an increasingly important aspect that must be considered. A pre-layout tool based on the Cavity Model and Boundary Element Method is built to automatically achieve a specified target impedance for a multi-layered Printed Circuit Board (PCB) Power Distribution Network (PDN) design with a minimal number of decoupling capacitors. The pre-work about the post-layout design and analysis is proposed and the guidelines for creating a decoupling capacitors network with better performance has been built. With limit inputs, physical limitations for the minimal impedance that can be achieved in PDN system are calculated first to determine if a design is physically realizable and provide feedback to the user. The decoupling capacitor location will be determined by physics. Then a special decoupling capacitor selection algorithm through poles and zeros is utilized to determine which decoupling capacitor from a library should be added. Finally, the target impedance could be achieved using the minimum number of decoupling capacitors. Genetic algorithm is utilized to verify the performance and time cost of the new designed algorithm and several industry designs are used to verify the calculation result. The process is quite time-saving and convenient, and allows the user to do design discovery quickly, and determine the limiting factors under different conditions. --Abstract, page iii

An Improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC

Radio Frequency Interference (RFI) problems are critical issues in wireless platform design. The accurate noise model of integrated circuits (ICs) is needed to help designers to diagnose and predict RFI problems. In this dissertation, an improved IC radiated emission model based on near-field measurements is proposed. The regularization technique and the truncated SVD method are employed together with the least square method to calculate the dipole moments from the near-field data. This dipole model has clear physical meaning: the electric and magnetic dipoles represent the voltage and the current in the circuit, respectively. One application of this dipole model is the prediction of heat sink radiation. In order to accurately predict the fields excited by a heat sink, an approach is proposed in this paper to include the exact excitation of the heat sink, which is described by some dipole moments constructed from the near-field scanning of the integrated circuit beneath the heat sink. Another contribution of the work is the proposal of effective dielectric properties of layered media for cavity model applications. With the effective properties. the cavity model can be generalized for either parallel plates or metal enclosures containing multiple dielectric layers. In the fourth paper a unified s-parameter (multimode s-parameter) representation for a multiport passive structure is proposed. Both mixed-mode and single-ended s-parameters arc included in the unified representation, which makes it more convenient to characterize structures --Abstract, page iv

Modeling multi-layer via structure using PEEC method

In this dissertation, a new integral equation formulation for via structures is developed for the capacitance extraction between vias and planes. The proposed method can be used to calculate the shared-antipad via structure which is widely used in highspeed differential signal interconnects. In addition, we use the image theory to handle inhomogeneous media. Further, a new technique is given to reduce computational resources for via-to-plane structures based on properties of the matrix coefficient. The extracted capacitance is also incorporated into the physics-based circuit model to characterize the overall performance of the via transition. In the second paper, a rigorous modeling of the shared-antipad via structure is developed using surface partial element equivalent circuit (PEEC). The cavity Green\u27s function is used to evaluate the equivalent circuit elements, thereby requiring fewer cells for numerical computation. The non-orthogonal, quadrilateral cell is used in the mesh to better accommodate the non-rectangular shape of the via and the antipad. A novel wave port excitation method is applied to the equivalent circuit to obtain the network parameters of the via transition. The Z-parameters of the via structure are calculated using the proposed method, and the results are validated with the finite element solution obtained from commercial software. In the third paper, an effective methodology is proposed to estimate the RF interference received by an antenna due to near-field coupling using divide-and-conquer based on reciprocity. The proposed methodology fits well with engineering practice, and is particularly suitable for pre-layout wireless system design and planning --Abstract, page iv

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact