Multilevel simulation-based co-design of next generation HPC microprocessors

This paper demonstrates the combined use of three simulation tools in support of a co-design methodology for an HPC-focused System-on-a-Chip (SoC) design. The simulation tools make different trade-offs between simulation speed, accuracy and model abstraction level, and are shown to be complementary. We apply the MUSA trace-based simulator for the initial sizing of vector register length, system-level cache (SLC) size and memory bandwidth. It has proven to be very efficient at pruning the design space, as its models enable sufficient accuracy without having to resort to highly detailed simulations. Then we apply gem5, a cycle-accurate micro-architecture simulator, for a more refined analysis of the performance potential of our reference SoC architecture, with models able to capture detailed hardware behavior at the cost of simulation speed. Furthermore, we study the network-on-chip (NoC) topology and IP placements using both gem5 for representative small- to medium-scale configurations and SESAM/VPSim, a transaction-level emulator for larger scale systems with good simulation speed and sufficient architectural details. Overall, we consider several system design concerns, such as processor subsystem sizing and NoC settings. We apply the selected simulation tools, focusing on different levels of abstraction, to study several configurations with various design concerns and evaluate them to guide architectural design and optimization decisions. Performance analysis is carried out with a number of representative benchmarks. The obtained numerical results provide guidance and hints to designers regarding SIMD instruction width, SLC sizing, memory bandwidth as well as the best placement of memory controllers and NoC form factor. Thus, we provide critical insights for efficient design of future HPC microprocessors.This work has been performed in the context of the European Processor Initiative (EPI) project, which has received funding from the European Union’s Horizon 2020 research and innovation program under Grant Agreement № 826647. A special thanks to Amir Charif and Arief Wicaksana for their invaluable contributions to the SESAM/VPSim tool in the initial phases of the EPI project.Peer ReviewedPostprint (author's final draft

Soft Error Effects on Arm Microprocessors: Early Estimations versus Chip Measurements

Extensive research efforts are being carried out to evaluate and improve the reliability of computing devices either through beam experiments or simulation-based fault injection. Unfortunately, it is still largely unclear to which extend fault injection can provide an accurate error rate estimation at early stages and if beam experiments can be used to identify the weakest resources in a device. The importance and challenges associated with a timely, but yet realistic reliability evaluation grow with the increase of complexity in both the hardware domain, with the integration of different types of cores in an SoC (System-on-Chip), and the software domain, with the OS (operating system) required to take full advantage of the available resources. In this paper, we combine and analyze data gathered with extensive beam experiments (on the final physical CPU hardware) and microarchitectural fault injections (on early microarchitectural CPU models). We target a standalone Arm Cortex-A5 CPU and an Arm Cortex-A9 CPU integrated into an SoC and evaluate their reliability in bare-metal and Linux-based configurations. Combining experimental data that covers more than 18 million years of device time with the result of more than 176,000 injections we find that both the SoC integration and the presence of the OS increase the system DUEs (Detected Unrecoverable Errors) rate (for different reasons) but do not significantly impact the SDCs (Silent Data Corruptions) rate which is solely attributed to the CPU core. Our reliability analysis demonstrates that even considering SoC integration and OS inclusion, early, pre-silicon microarchitecture-level fault injection delivers accurate SDC rates estimations and lower bounds for the DUE rates

Cross-layer system reliability assessment framework for hardware faults

System reliability estimation during early design phases facilitates informed decisions for the integration of effective protection mechanisms against different classes of hardware faults. When not all system abstraction layers (technology, circuit, microarchitecture, software) are factored in such an estimation model, the delivered reliability reports must be excessively pessimistic and thus lead to unacceptably expensive, over-designed systems. We propose a scalable, cross-layer methodology and supporting suite of tools for accurate but fast estimations of computing systems reliability. The backbone of the methodology is a component-based Bayesian model, which effectively calculates system reliability based on the masking probabilities of individual hardware and software components considering their complex interactions. Our detailed experimental evaluation for different technologies, microarchitectures, and benchmarks demonstrates that the proposed model delivers very accurate reliability estimations (FIT rates) compared to statistically significant but slow fault injection campaigns at the microarchitecture level.Peer ReviewedPostprint (author's final draft

Exploiting Adaptive Techniques to Improve Processor Energy Efficiency

Rapid device-miniaturization keeps on inducing challenges in building energy efficient microprocessors. As the size of the transistors continuously decreasing, more uncertainties emerge in their operations. On the other hand, integrating more and more transistors on a single chip accentuates the need to lower its supply-voltage. This dissertation investigates one of the primary device uncertainties - timing error, in microprocessor performance bottleneck in NTC era. Then it proposes various innovative techniques to exploit these opportunities to maintain processor energy efficiency, in the context of emerging challenges. Evaluated with the cross-layer methodology, the proposed approaches achieve substantial improvements in processor energy efficiency, compared to other start-of-art techniques

SyRA: early system reliability analysis for cross-layer soft errors resilience in memory arrays of microprocessor systems

© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Cross-layer reliability is becoming the preferred solution when reliability is a concern in the design of a microprocessor-based system. Nevertheless, deciding how to distribute the error management across the different layers of the system is a very complex task that requires the support of dedicated frameworks for cross-layer reliability analysis. This paper proposes SyRA, a system-level cross-layer early reliability analysis framework for radiation induced soft errors in memory arrays of microprocessor-based systems. The framework exploits a multi-level hybrid Bayesian model to describe the target system and takes advantage of Bayesian inference to estimate different reliability metrics. SyRA implements several mechanisms and features to deal with the complexity of realistic models and implements a complete tool-chain that scales efficiently with the complexity of the system. The simulation time is significantly lower than micro-architecture level or RTL fault-injection experiments with an accuracy high enough to take effective design decisions. To demonstrate the capability of SyRA, we analyzed the reliability of a set of microprocessor-based systems characterized by different microprocessor architectures (i.e., Intel x86, ARM Cortex-A15, ARM Cortex-A9) running both the Linux operating system or bare metal. Each system under analysis executes different software workloads both from benchmark suites and from real applications.Peer ReviewedPostprint (author's final draft