Electromagnetic Interference (EMI) of System-on-Package (SOP)

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration

System and IC level analysis of electrostatic discharge (ESD) and electrical fast transient (EFT) immunity and associated coupling mechanisms

The exposure of electronic circuits to lightning, electrostatic discharge (ESD), electrical fast transients (EFT) or sine wave signals can reveal RF immunity problems. Typical problems include temporary malfunctions or permanent damage of integrated circuits (ICs). In an effort to reproduce those disturbances, a series of electromagnetic compatibility standards has been developed. However, a complete understanding of the root cause of the immunity problems has yet to be established. This dissertation discusses immunity problems in three papers, starting at the system level, via the coupling path into the IC --Abstract, page iv

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

Toward the assessment of the susceptibility of a digital system to lightning upset

Accomplishments and directions for further research aimed at developing methods for assessing a candidate design of an avionic computer with respect to susceptability to lightning upset are reported. Emphasis is on fault tolerant computers. Both lightning stress and shielding are covered in a review of the electromagnetic environment. Stress characterization, system characterization, upset detection, and positive and negative design features are considered. A first cut theory of comparing candidate designs is presented including tests of comparative susceptability as well as its analysis and simulation. An approach to lightning induced transient fault effects is included

Avionics system design for high energy fields: A guide for the designer and airworthiness specialist

Because of the significant differences in transient susceptibility, the use of digital electronics in flight critical systems, and the reduced shielding effects of composite materials, there is a definite need to define pracitices which will minimize electromagnetic susceptibility, to investigate the operational environment, and to develop appropriate testing methods for flight critical systems. The design practices which will lead to reduced electromagnetic susceptibility of avionics systems in high energy fields is described. The levels of emission that can be anticipated from generic digital devices. It is assumed that as data processing equipment becomes an ever larger part of the avionics package, the construction methods of the data processing industry will increasingly carry over into aircraft. In Appendix 1 tentative revisions to RTCA DO-160B, Environmental Conditions and Test Procedures for Airborne Equipment, are presented. These revisions are intended to safeguard flight critical systems from the effects of high energy electromagnetic fields. A very extensive and useful bibliography on both electromagnetic compatibility and avionics issues is included

Analog-Digital System Modeling for Electromagnetic Susceptibility Prediction

The thesis is focused on the noise susceptibility of communication networks. These analog-mixed signal systems operate in an electrically noisy environment, in presence of multiple equipments connected by means of long wiring. Every module communicates using a transceiver as an interface between the local digital signaling and the data transmission through the network. Hence, the performance of the IC transceiver when affected by disturbances is one of the main factors that guarantees the EM immunity of the whole equipment. The susceptibility to RF and transient disturbances is addressed at component level on a CAN transceiver as a test case, highlighting the IC features critical for noise immunity. A novel procedure is proposed for the IC modeling for mixed-signal immunity simulations of communication networks. The procedure is based on a gray-box approach, modeling IC ports with a physical circuit and the internal links with a behavioural block. The parameters are estimated from time and frequency domain measurements, allowing accurate and efficient reproduction of non-linear device switching behaviours. The effectiveness of the modeling process is verified by applying the proposed technique to a CAN transceiver, involved in a real immunity test on a data communication link. The obtained model is successfully implemented in a commercial solver to predict both the functional signals and the RF noise immunity at component level. The noise immunity at system level is then evaluated on a complete communication network, analyzing the results of several tests on a realistic CAN bus. After developing models for wires and injection probes, a noise immunity test in avionic environment is carried out in a simulation environment, observing good overall accuracy and efficiency

Application of advanced on-board processing concepts to future satellite communications systems: Bibliography

Abstracts are presented of a literature survey of reports concerning the application of signal processing concepts. Approximately 300 references are included

Application of advanced technology to space automation

Automated operations in space provide the key to optimized mission design and data acquisition at minimum cost for the future. The results of this study strongly accentuate this statement and should provide further incentive for immediate development of specific automtion technology as defined herein. Essential automation technology requirements were identified for future programs. The study was undertaken to address the future role of automation in the space program, the potential benefits to be derived, and the technology efforts that should be directed toward obtaining these benefits