Gas Damping Coefficient Research for MEMS Comb Linear Vibration Gyroscope

Silicon-MEMS gyroscope is an important part of MEMS (Micro Electrical Mechanical System). There are some disturb ignored in traditional gyroscope that must be evaluated newly because of its smaller size (reach the level of micron). In these disturb, the air pressure largely influences the performance of MEMS gyroscope. Different air pressure causes different gas damping coefficient for the MEMS comb linear vibration gyroscope and different gas damping coefficient influences the quality factor of the gyroscope directive. The quality factor influences the dynamic working bandwidth of the MEMS comb linear vibration gyroscope, so it is influences the output characteristic of the MEMS comb linear vibration gyroscope. The paper shows the relationship between the air pressure and the output amplified and phase of the detecting axis through analyzing the air pressure influence on the MEMS comb linear vibration gyroscope. It discusses the influence on the frequency distribute and quality factor of the MEMS comb linear vibration gyroscope for different air pressure.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Evaluation of MEMS Structures with Directional Characteristics Based on FRAT and Lifting Wavelet

Steps and grooves, which have typical directional characteristic, are two main functional structures of MEMS (Micro-Electro-Mechanical Systems). This paper proposes a method for analysis and evaluation of MEMS steps and grooves based on finite radon transform (FRAT) and lifting wavelet. The method consists of three steps. Firstly, FRAT is adopted to detect the directional characteristic of a MEMS structure. Secondly, on the basis of the directional characteristic obtained, the profiles of the MEMS structure are analyzed by lifting wavelet. Finally, Histogram-fitting is employed for areal evaluation of a MEMS structure. Simulated and experimental results show that MEMS structures with directional characteristic can be extracted and evaluated by the method effectively

Tunable MEMS VCSEL on Silicon substrate

We present design, fabrication and characterization of a MEMS VCSEL which utilizes a silicon-on-insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding, which improves the protection and control of the tuning element. This procedure enables a more robust fabrication, a larger free spectral range and facilitates bidirectional tuning of the MEMS element. The MEMS VCSEL device uses a high contrast grating mirror on a MEMS stage as the bottom mirror, a wafer bonded InP with quantum wells for amplification and a deposited dielectric DBR as the top mirror. A 40 nm tuning range and a mechanical resonance frequency in excess of 2 MHz are demonstrated

Experiments and simulations of MEMS thermal sensors for wall shear-stress measurements in aerodynamic control applications

MEMS thermal shear-stress sensors exploit heat-transfer effects to measure the shear stress exerted by an air flow on its solid boundary, and have promising applications in aerodynamic control. Classical theory for conventional, macroscale thermal shear-stress sensors states that the rate of heat removed by the flow from the sensor is proportional to the 1/3-power of the shear stress. However, we have observed that this theory is inconsistent with experimental data from MEMS sensors. This paper seeks to develop an understanding of MEMS thermal shear-stress sensors through a study including both experimental and theoretical investigations. We first obtain experimental data that confirm the inadequacy of the classical theory by wind-tunnel testing of prototype MEMS shear-stress sensors with different dimensions and materials. A theoretical analysis is performed to identify that this inadequacy is due to the lack of a thin thermal boundary layer in the fluid flow at the sensor surface, and then a two-dimensional MEMS shear-stress sensor theory is presented. This theory incorporates important heat-transfer effects that are ignored by the classical theory, and consistently explains the experimental data obtained from prototype MEMS sensors. Moreover, the prototype MEMS sensors are studied with three-dimensional simulations, yielding results that quantitatively agree with experimental data. This work demonstrates that classical assumptions made for conventional thermal devices should be carefully examined for miniature MEMS devices

Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the packaging requirement. Due to the lack of standardized testing procedures, the reliability of those MEMS packages sometimes can only be proven by taking into consideration its functionality over lifetime. Innovation with regards to cost reduction and standardization in the field of packaging is therefore of utmost importance to the speed of commercialisation of MEMS devices. Nowadays heavily driven by consumer applications the MEMS device market is forecasted to enjoy a compound annual growth rate (CAGR) above 13%, which is when compared to the IC device market, an outstanding growth rate. Nevertheless this forecasted value can drift upwards or downwards depending on the rate of innovation in the field of packaging. MEMS devices typically require a specific fabrication process where the device wafer is bonded to a second wafer which effectively encapsulates the MEMS structure. This method leaves the device free to move within a vacuum or an inert gas atmosphere.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Dynamic metasurface lens based on MEMS Technology

In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along the two orthogonal axes (tip-tilt) by +-9 degrees, thus enabling dynamic beam steering. The device can compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems

MEMS practice, from the lab to the telescope

Micro-electro-mechanical systems (MEMS) technology can provide for deformable mirrors (DMs) with excellent performance within a favorable economy of scale. Large MEMS-based astronomical adaptive optics (AO) systems such as the Gemini Planet Imager are coming on-line soon. As MEMS DM end-users, we discuss our decade of practice with the micromirrors, from inspecting and characterizing devices to evaluating their performance in the lab. We also show MEMS wavefront correction on-sky with the "Villages" AO system on a 1-m telescope, including open-loop control and visible-light imaging. Our work demonstrates the maturity of MEMS technology for astronomical adaptive optics.Comment: 14 pages, 15 figures, Invited Paper, SPIE Photonics West 201

Design principles for six degrees-of-freedom MEMS-based precision manipulators

In the future, the precision manipulation of small objects will become more and more important for appliances such as data storage, micro assembly, sample manipulation in microscopes, cell manipulation, and manipulation of beam paths by micro mirrors. At the same time, there is a drive towards miniaturized systems.\ud Therefore, Micro ElectroMechanical Systems (MEMS), a fabrication technique enabling micron sized features, has been researched for precision manipulation. MEMS devices comprise micro sensors, actuators, mechanisms, optics and fluidic systems. They have the ability to integrate several functions in a small package. MEMS can be commercially attractive by providing cost reduction or enabling new functionality with respect to macro systems. Combining design principles, a mature design philosophy for creating precision machines, and MEMS fabrication, a\ud technology for miniaturization, could lead to micro systems with deterministic behavior and accurate positioning capability. However, in MEMS design trade-offs\ud need to be made between fabrication complexity and design principle requirements.\ud Therefore, the goal of this research has been twofold:\ud 1. Design and manufacture a 6 Degrees-of-Freedom (DOFs) MEMS-based manipulator with nanometer resolution positioning.\ud 2. Derive principle solutions for the synthesis of exact kinematic constraint design and MEMS fabrication technology for multi DOFs precision manipulation in the\ud micro domain

Modelling methodology of MEMS structures based on Cosserat theory

Modelling MEMS involves a variety of software tools that deal with the analysis of complex geometrical structures and the assessment of various interactions among different energy domains and components. Moreover, the MEMS market is growing very fast, but surprisingly, there is a paucity of modelling and simulation methodology for precise performance verification of MEMS products in the nonlinear regime. For that reason, an efficient and rapid modelling approach is proposed that meets the linear and nonlinear dynamic behaviour of MEMS systems.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Workload-Based Configuration of MEMS-Based Storage Devices for Mobile Systems

Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. However, flash memory may outperform MEMS-based storage in terms of performance, and energy-efficiency. The problem is that MEMS-based storage devices have a large number (i.e., thousands) of heads, and to deliver peak performance, all heads must be deployed simultaneously to access each single sector. Since these devices are mechanical and thus some housekeeping information is needed for each head, this results in a huge capacity loss and increases the energy consumption of MEMS-based storage with respect to flash. We solve this problem by proposing new techniques to lay out data in MEMS-based storage devices. Data layouts represent optimizations in a design space spanned by three parameters: the number of active heads, sector parallelism, and sector size. We explore this design space and show that by exploiting knowledge of the expected workload, MEMS-based devices can employ all heads, thus delivering peak performance, while decreasing the energy consumption and compromising only a little on the capacity. Our exploration shows that MEMS-based storage is competitive with flash in most cases, and outperforms flash in a few cases