Digital Offset Calibration of an OPAMP Towards Improving Static Parameters of 90 nm CMOS DAC

In this paper, an on-chip self-calibrated 8-bit R-2R digital-to-analog converter (DAC) based on digitally compensated input offset of the operational amplifier (OPAMP) is presented. To improve the overall DAC performance, a digital offset cancellation method was used to compensate deviations in the input offset voltage of the OPAMP caused by process variations. The whole DAC as well as offset compensation circuitry were designed in a standard 90 nm CMOS process. The achieved results show that after the self-calibration process, the improvement of 48% in the value of DAC offset error is achieved

Asynchronous Circuit Stacking for Simplified Power Management

As digital integrated circuits (ICs) continue to increase in complexity, new challenges arise for designers. Complex ICs are often designed by incorporating multiple power domains therefore requiring multiple voltage converters to produce the corresponding supply voltages. These converters not only take substantial on-chip layout area and/or off-chip space, but also aggregate the power loss during the voltage conversions that must occur fast enough to maintain the necessary power supplies. This dissertation work presents an asynchronous Multi-Threshold NULL Convention Logic (MTNCL) “stacked” circuit architecture that alleviates this problem by reducing the number of voltage converters needed to supply the voltage the ICs operate at. By stacking multiple MTNCL circuits between power and ground, supplying a multiple of VDD to the entire stack and incorporating simple control mechanisms, the dynamic range fluctuation problem can be mitigated. A 130nm Bulk CMOS process and a 32nm Silicon-on-Insulator (SOI) CMOS process are used to evaluate the theoretical effect of stacking different circuitry while running different workloads. Post parasitic physical implementations are then carried out in the 32nm SOI process for demonstrating the feasibility and analyzing the advantages of the proposed MTNCL stacking architecture

A 10-bit Charge-Redistribution ADC Consuming 1.9 μW at 1 MS/s

This paper presents a 10 bit successive approximation ADC in 65 nm CMOS that benefits from technology scaling. It meets extremely low power requirements by using a charge-redistribution DAC that uses step-wise charging, a dynamic two-stage comparator and a delay-line-based controller. The ADC requires no external reference current and uses only one external supply voltage of 1.0 V to 1.3 V. Its supply current is proportional to the sample rate (only dynamic power consumption). The ADC uses a chip area of approximately 115--225 μm2. At a sample rate of 1 MS/s and a supply voltage of 1.0 V, the 10 bit ADC consumes 1.9 μW and achieves an energy efficiency of 4.4 fJ/conversion-step

Design of a compact and low-power TDC for an array of SiPM's in 110nm CIS technology

Silicon photomultipliers (SiPMs) are meant to substitute photomultiplier tubes in high-energy physics detectors and nuclear medicine. This is because of their -to name a few interesting properties- compactness, lower bias voltage, tolerance to magnetic fields and finer spatial resolution. SiPMs can also be built in CMOS technology. This allows the incorporation of active quenching and recharge schemes at cell level and processing circuitry at pixel level. One of the elements that can lead to finer temporal resolutions is the time-to-digital converter (TDC). In this paper we describe the architecture of a compact TDC to be included at each pixel of an array of SiPMs. It is compact and consumes low power. It is based on a voltage controlled oscillator that generates multiple internal phases that are interpolated to provide time resolution below the time delay of a single gate. Simulation results of a 11b TDC based on a 4-stage VCRO in 110nm CIS technology yield a time resolution of 80.0ps, a DNL of ±0.28 LSB, a INL ±0.52 LSB, and a power consumption of 850μW.Ministerio de Economía y Competitividad TEC2015-66878-C3-1-RJunta de Andalucía TIC 2012-2338Office of Naval Research (USA) N00014141035

A RISC-V Vector Processor With Simultaneous-Switching Switched-Capacitor DC-DC Converters in 28 nm FDSOI

This work demonstrates a RISC-V vector microprocessor implemented in 28 nm FDSOI with fully integrated simultaneous-switching switched-capacitor DC-DC (SC DC-DC) converters and adaptive clocking that generates four on-chip voltages between 0.45 and 1 V using only 1.0 V core and 1.8 V IO voltage inputs. The converters achieve high efficiency at the system level by switching simultaneously to avoid charge-sharing losses and by using an adaptive clock to maximize performance for the resulting voltage ripple. Details about the implementation of the DC-DC switches, DC-DC controller, and adaptive clock are provided, and the sources of conversion loss are analyzed based on measured results. This system pushes the capabilities of dynamic voltage scaling by enabling fast transitions (20 ns), simple packaging (no off-chip passives), low area overhead (16%), high conversion efficiency (80%-86%), and high energy efficiency (26.2 DP GFLOPS/W) for mobile devices

Comparator Design in Sensors for Environmental Monitoring

This paper presents circuit design considerations of comparator in analog-to-digital converters (ADC) applied for a portable, low-cost and high performance nano-sensor chip which can be applied to detect the airborne magnetite pollution nano particulate matter (PM) for environmental monitoring. High-resolution ADC plays a vital important role in high perfor-mance nano-sensor, while high-resolution comparator is a key component in ADC. In this work, some important design issues related to comparators in analog-to-digital converters (ADCs) are discussed, simulation results show that the resolution of the comparator proposed can achieve 5µV , and it is appropriate for high-resolution application

Design of A Low Power Low Voltage CMOS Opamp

In this paper a CMOS operational amplifier is presented which operates at 2V power supply and 1microA input bias current at 0.8 micron technology using non conventional mode of operation of MOS transistors and whose input is depended on bias current. The unique behaviour of the MOS transistors in subthreshold region not only allows a designer to work at low input bias current but also at low voltage. While operating the device at weak inversion results low power dissipation but dynamic range is degraded. Optimum balance between power dissipation and dynamic range results when the MOS transistors are operated at moderate inversion. Power is again minimised by the application of input dependant bias current using feedback loops in the input transistors of the differential pair with two current substractors. In comparison with the reported low power low voltage opamps at 0.8 micron technology, this opamp has very low standby power consumption with a high driving capability and operates at low voltage. The opamp is fairly small (0.0084 mm 2) and slew rate is more than other low power low voltage opamps reported at 0.8 um technology [1,2]. Vittoz at al [3] reported that slew rate can be improved by adaptive biasing technique and power dissipation can be reduced by operating the device in weak inversion. Though lower power dissipation is achieved the area required by the circuit is very large and speed is too small. So, operating the device in moderate inversion is a good solution. Also operating the device in subthreshold region not only allows lower power dissipation but also a lower voltage operation is achieved.Comment: 8 Pages, VLSICS Journa