Low-power reconfigurable network architecture for on-chip photonic interconnects

Photonic Networks-On-Chip have emerged as a viable solution for interconnecting multicore computer architectures in a power-efficient manner. Current architectures focus on large messages, however, which are not compatible with the coherence traffic found on chip multiprocessor networks. In this paper, we introduce a reconfigurable optical interconnect in which the topology is adapted automatically to the evolving traffic situation. This allows a large fraction of the (short) coherence messages to use the optical links, making our technique a better match for CMP networks when compared to existing solutions. We also evaluate the performance and power efficiency of our architecture using an assumed physical implementation based on ultra-low power optical switching devices and under realistic traffic load conditions

Cycle-accurate evaluation of reconfigurable photonic networks-on-chip

There is little doubt that the most important limiting factors of the performance of next-generation Chip Multiprocessors (CMPs) will be the power efficiency and the available communication speed between cores. Photonic Networks-on-Chip (NoCs) have been suggested as a viable route to relieve the off- and on-chip interconnection bottleneck. Low-loss integrated optical waveguides can transport very high-speed data signals over longer distances as compared to on-chip electrical signaling. In addition, with the development of silicon microrings, photonic switches can be integrated to route signals in a data-transparent way. Although several photonic NoC proposals exist, their use is often limited to the communication of large data messages due to a relatively long set-up time of the photonic channels. In this work, we evaluate a reconfigurable photonic NoC in which the topology is adapted automatically (on a microsecond scale) to the evolving traffic situation by use of silicon microrings. To evaluate this system's performance, the proposed architecture has been implemented in a detailed full-system cycle-accurate simulator which is capable of generating realistic workloads and traffic patterns. In addition, a model was developed to estimate the power consumption of the full interconnection network which was compared with other photonic and electrical NoC solutions. We find that our proposed network architecture significantly lowers the average memory access latency (35% reduction) while only generating a modest increase in power consumption (20%), compared to a conventional concentrated mesh electrical signaling approach. When comparing our solution to high-speed circuit-switched photonic NoCs, long photonic channel set-up times can be tolerated which makes our approach directly applicable to current shared-memory CMPs

Architectural study of reconfigurable photonic networks-on-chip for multi-core processors

Photonic Networks-on-Chip (NoCs) have become a promising route to interconnect processor cores on chip multiprocessors (CMP) in a power efficient way. Although several photonic NoC proposals exist, their use is limited to the communication of large data messages due to a relatively long set-up time for the photonic channels. In this work, we evaluate a reconfigurable photonic NoC in which the topology is adapted automatically to the evolving traffic situation. This way, long photonic channel set-up times can be tolerated which makes our approach more compatible in the context of shared-memory CMPs

Multi-FSR Silicon Photonic Flex-LIONS Module for Bandwidth-Reconfigurable All-to-All Optical Interconnects

This article proposes and experimentally demonstrates the first bandwidth-reconfigurable all-to-all optical interconnects using a multi-Free-Spectral-Ranges (FSR) integrated 8 × 8 SiPh Flex-LIONS module. The multi-FSR operation utilizes the first FSR (FSR1) to steer the bandwidth between selected node pairs and the zeroth FSR (FSR0) to guarantee a minimum diameter all-to-all topology among the interconnected nodes after reconfiguration. Successful Flex-LIONS design, fabrication, packaging, and system testing demonstrate error-free all-to-all interconnects for both FSR0 and FSR1 with a 5.3-dB power penalty induced by AWGR intra-band crosstalk under the worst-case polarization scenario. After reconfiguration in FSR1, the bandwidth between the selected pair of nodes is increased from 50 to 125 Gb/s while maintaining a 25 Gb/s/λ all-to-all interconnectivity in FSR0

Silicon Photonic Flex-LIONS for Bandwidth-Reconfigurable Optical Interconnects

This paper reports the first experimental demonstration of silicon photonic (SiPh) Flex-LIONS, a bandwidth-reconfigurable SiPh switching fabric based on wavelength routing in arrayed waveguide grating routers (AWGRs) and space switching. Compared with the state-of-the-art bandwidth-reconfigurable switching fabrics, Flex-LIONS architecture exhibits 21× less number of switching elements and 2.9× lower on-chip loss for 64 ports, which indicates significant improvements in scalability and energy efficiency. System experimental results carried out with an 8-port SiPh Flex-LIONS prototype demonstrate error-free one-to-eight multicast interconnection at 25 Gb/s and bandwidth reconfiguration from 25 Gb/s to 100 Gb/s between selected input and output ports. Besides, benchmarking simulation results show that Flex-LIONS can provide a 1.33× reduction in packet latency and >1.5× improvements in energy efficiency when replacing the core layer switches of Fat-Tree topologies with Flex-LIONS. Finally, we discuss the possibility of scaling Flex-LIONS up to N = 1024 ports (N = M × W) by arranging M^2 W-port Flex-LIONS in a Thin-CLOS architecture using W wavelengths

Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

RecoNoC: a reconfigurable network-on-chip

This article presents the design of RecoNoC: a compact, highly flexible FPGA-based network-on-chip (NoC), that can be easily adapted for various experiments. In this work, we enhanced this NoC with dynamically reconfigurable shortcuts. These can be used to alter the NoC's topology to adapt to the system's communication needs. The design has been implemented and tested on a Xilinx Virtex-2 Pro FPGA, using the TMAP dynamic datafolding toolflow to automatically generate the reconfigurable hardware and the software reconfiguration procedures. The results show that, using dynamic datafolding, the overhead of introducing this shortcut mechanism is limited