Neurostream: Scalable and Energy Efficient Deep Learning with Smart Memory Cubes

open4siHigh-performance computing systems are moving towards 2.5D and 3D memory hierarchies, based on High Bandwidth Memory (HBM) and Hybrid Memory Cube (HMC) to mitigate the main memory bottlenecks. This trend is also creating new opportunities to revisit near-memory computation. In this paper, we propose a flexible processor-in-memory (PIM) solution for scalable and energy-efficient execution of deep convolutional networks (ConvNets), one of the fastest-growing workloads for servers and high-end embedded systems. Our co-design approach consists of a network of Smart Memory Cubes (modular extensions to the standard HMC) each augmented with a many-core PIM platform called NeuroCluster. NeuroClusters have a modular design based on NeuroStream coprocessors (for Convolution-intensive computations) and general-purpose RISC-V cores. In addition, a DRAM-friendly tiling mechanism and a scalable computation paradigm are presented to efficiently harness this computational capability with a very low programming effort. NeuroCluster occupies only 8 percent of the total logic-base (LoB) die area in a standard HMC and achieves an average performance of 240 GFLOPS for complete execution of full-featured state-of-the-art (SoA) ConvNets within a power budget of 2.5 W. Overall 11 W is consumed in a single SMC device, with 22.5 GFLOPS/W energy-efficiency which is 3.5X better than the best GPU implementations in similar technologies. The minor increase in system-level power and the negligible area increase make our PIM system a cost-effective and energy efficient solution, easily scalable to 955 GFLOPS with a small network of just four SMCs.openAzarkhish, Erfan*; Rossi, Davide; Loi, Igor; Benini, LucaAzarkhish, Erfan*; Rossi, Davide; Loi, Igor; Benini, Luc

Performance Implications of NoCs on 3D-Stacked Memories: Insights from the Hybrid Memory Cube

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for connecting their internal structural organizations. This novel usage of NoC, in addition to aiding processing-in-memory capabilities, enables numerous benefits such as high bandwidth and memory-level parallelism. However, the implications of NoCs on the characteristics of 3D-stacked memories in terms of memory access latency and bandwidth have not been fully explored. This paper addresses this knowledge gap by (i) characterizing an HMC prototype on the AC-510 accelerator board and revealing its access latency behaviors, and (ii) by investigating the implications of such behaviors on system and software designs

Near Data Processing for Efficient and Trusted Systems

We live in a world which constantly produces data at a rate which only increases with time. Conventional processor architectures fail to process this abundant data in an efficient manner as they expend significant energy in instruction processing and moving data over deep memory hierarchies. Furthermore, to process large amounts of data in a cost effective manner, there is increased demand for remote computation. While cloud service providers have come up with innovative solutions to cater to this increased demand, the security concerns users feel for their data remains a strong impediment to their wide scale adoption. An exciting technique in our repertoire to deal with these challenges is near-data processing. Near-data processing (NDP) is a data-centric paradigm which moves computation to where data resides. This dissertation exploits NDP to both process the data deluge we face efficiently and design low-overhead secure hardware designs. To this end, we first propose Compute Caches, a novel NDP technique. Simple augmentations to underlying SRAM design enable caches to perform commonly used operations. In-place computation in caches not only avoids excessive data movement over memory hierarchy, but also significantly reduces instruction processing energy as independent sub-units inside caches perform computation in parallel. Compute Caches significantly improve the performance and reduce energy expended for a suite of data intensive applications. Second, this dissertation identifies security advantages of NDP. While memory bus side channel has received much attention, a low-overhead hardware design which defends against it remains elusive. We observe that smart memory, memory with compute capability, can dramatically simplify this problem. To exploit this observation, we propose InvisiMem which uses the logic layer in the smart memory to implement cryptographic primitives, which aid in addressing memory bus side channel efficiently. Our solutions obviate the need for expensive constructs like Oblivious RAM (ORAM) and Merkle trees, and have one to two orders of magnitude lower overheads for performance, space, energy, and memory bandwidth, compared to prior solutions. This dissertation also addresses a related vulnerability of page fault side channel in which the Operating System (OS) induces page faults to learn application's address trace and deduces application secrets from it. To tackle it, we propose Sanctuary which obfuscates page fault channel while allowing the OS to manage memory as a resource. To do so, we design a novel construct, Oblivious Page Management (OPAM) which is derived from ORAM but is customized for page management context. We employ near-memory page moves to reduce OPAM overhead and also propose a novel memory partition to reduce OPAM transactions required. For a suite of cloud applications which process sensitive data we show that page fault channel can be tackled at reasonable overheads.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/144139/1/shaizeen_1.pd

HPC Accelerators with 3D Memory

Artículo invitado, publicado en las actas del congreso por IEEE Society Press. Páginas 320 a 328. ISBN: 978-1-5090-3593-9.DOI 10.1109/CSE-EUC-DCABES-2016.203After a decade evolving in the High Performance Computing arena, GPU-equipped supercomputers have con- quered the top500 and green500 lists, providing us unprecedented levels of computational power and memory bandwidth. This year, major vendors have introduced new accelerators based on 3D memory, like Xeon Phi Knights Landing by Intel and Pascal architecture by Nvidia. This paper reviews hardware features of those new HPC accelerators and unveils potential performance for scientific applications, with an emphasis on Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) used by commercial products according to roadmaps already announced.Universidad de Málaga. Campus de Excelencia Internacional Andalucia Tec

Near-Memory Address Translation

Memory and logic integration on the same chip is becoming increasingly cost effective, creating the opportunity to offload data-intensive functionality to processing units placed inside memory chips. The introduction of memory-side processing units (MPUs) into conventional systems faces virtual memory as the first big showstopper: without efficient hardware support for address translation MPUs have highly limited applicability. Unfortunately, conventional translation mechanisms fall short of providing fast translations as contemporary memories exceed the reach of TLBs, making expensive page walks common. In this paper, we are the first to show that the historically important flexibility to map any virtual page to any page frame is unnecessary in today's servers. We find that while limiting the associativity of the virtual-to-physical mapping incurs no penalty, it can break the translate-then-fetch serialization if combined with careful data placement in the MPU's memory, allowing for translation and data fetch to proceed independently and in parallel. We propose the Distributed Inverted Page Table (DIPTA), a near-memory structure in which the smallest memory partition keeps the translation information for its data share, ensuring that the translation completes together with the data fetch. DIPTA completely eliminates the performance overhead of translation, achieving speedups of up to 3.81x and 2.13x over conventional translation using 4KB and 1GB pages respectively.Comment: 15 pages, 9 figure

Memory Hierarchy Design for Next Generation Scalable Many-core Platforms

Performance and energy consumption in modern computing platforms is largely dominated by the memory hierarchy. The increasing computational power in the multiprocessors and accelerators, and the emergence of the data-intensive workloads (e.g. large-scale graph traversal and scientific algorithms) requiring fast transfer of large volumes of data, are two main trends which intensify this problem by putting even higher pressure on the memory hierarchy. This increasing gap between computation speed and data transfer speed is commonly referred as the “memory wall” problem. With the emergence of heterogeneous Three Dimensional (3D) Integration based on through-silicon-vias (TSV), this situation has started to recover in the past years. On one hand, it is now possible to improve memory access bandwidth and/or latency by either stacking memories directly on top of processors or through abstracted memory interfaces such as Micron’s Hybrid Memory Cube (HMC). On the other hand, near memory computation has become worthy of revisiting due to the cost-effective integration of logic and memory in 3D stacks. These two directions bring about several interesting opportunities including performance improvement, energy and cost reduction, product miniaturization, and modular design for improved time to market. In this research, we study the effectiveness of the 3D integration technology and the optimization opportunities which it can provide in the different layers of the memory hierarchy in cluster-based many-core platforms ranging from intra-cluster L1 to inter-cluster L2 scratchpad memories (SPMs), as well as the main memory. In addition, by moving a part of the computation to where data resides, in the 3D-stacked memory context, we demonstrate further energy and performance improvement opportunities

Accelerating Neural Network Inference with Processing-in-DRAM: From the Edge to the Cloud

Neural networks (NNs) are growing in importance and complexity. A neural network's performance (and energy efficiency) can be bound either by computation or memory resources. The processing-in-memory (PIM) paradigm, where computation is placed near or within memory arrays, is a viable solution to accelerate memory-bound NNs. However, PIM architectures vary in form, where different PIM approaches lead to different trade-offs. Our goal is to analyze, discuss, and contrast DRAM-based PIM architectures for NN performance and energy efficiency. To do so, we analyze three state-of-the-art PIM architectures: (1) UPMEM, which integrates processors and DRAM arrays into a single 2D chip; (2) Mensa, a 3D-stack-based PIM architecture tailored for edge devices; and (3) SIMDRAM, which uses the analog principles of DRAM to execute bit-serial operations. Our analysis reveals that PIM greatly benefits memory-bound NNs: (1) UPMEM provides 23x the performance of a high-end GPU when the GPU requires memory oversubscription for a general matrix-vector multiplication kernel; (2) Mensa improves energy efficiency and throughput by 3.0x and 3.1x over the Google Edge TPU for 24 Google edge NN models; and (3) SIMDRAM outperforms a CPU/GPU by 16.7x/1.4x for three binary NNs. We conclude that the ideal PIM architecture for NN models depends on a model's distinct attributes, due to the inherent architectural design choices.Comment: This is an extended and updated version of a paper published in IEEE Micro, pp. 1-14, 29 Aug. 2022. arXiv admin note: text overlap with arXiv:2109.1432