Selective metallization of alumina by laser

Nickel has been selectively deposited on an alumina substrate without any pretreatment from a flow of a nickel acetate solution using the focused beam of an excimer laser. Nickel spots as well as nickel lines were drawn and subsequently plated with an electroless Ni-B coating. Excellent adhesion of the metallized layers was achieved, since with laser irradiation, both etching and deposition took place simultaneously

Laser-assisted solar cell metallization processing

Laser-assisted processing techniques for producing high-quality solar cell metallization patterns are being investigated, developed, and characterized. The tasks comprising these investigations are outlined

Optical device and Method of Making

An optical device and method is disclosed for forming the optical device within the wide-bandgap semiconductor substrate. The optical device is formed by directing a thermal energy beam onto a selected portion of the wide-bandgap semiconductor substrate for changing an optical property of the selected portion to form the optical device in the wide-bandgap semiconductor substrate. The thermal energy beam defines the optical and physical properties of the optical device. The optical device may take the form of an electro-optical device with the addition of electrodes located on the wide-bandgap semiconductor substrate in proximity to the optical device for changing the optical property of the optical device upon a change of a voltage applied to the optional electrodes. The invention is also incorporated into a method of using the optical device hr remotely sensing temperature, pressure and/or chemical composition

Laser-assisted solar-cell metallization processing

A photolytic metal deposition system using a focused continuous wave ultraviolet laser, a photolytic metal deposition system using a mask and ultraviolet flood illumination, and a pyrolytic metal deposition system using a focused continuous wave laser were studied. Fabrication of solar cells, as well as characterization to determine the effects of transient heat on solar cell junctions were investigated

Directed-energy process technology efforts

A summary of directed-energy process technology for solar cells was presented. This technology is defined as directing energy or mass to specific areas on solar cells to produce a desired effect in contrast to exposing a cell to a thermal or mass flow environment. Some of these second generation processing techniques are: ion implantation; microwave-enhanced chemical vapor deposition; rapid thermal processing; and the use of lasers for cutting, assisting in metallization, assisting in deposition, and drive-in of liquid dopants. Advantages of directed energy techniques are: surface heating resulting in the bulk of the cell material being cooler and unchanged; better process control yields; better junction profiles, junction depths, and metal sintering; lower energy consumption during processing and smaller factory space requirements. These advantages should result in higher-efficiency cells at lower costs. The results of the numerous contracted efforts were presented as well as the application potentials of these new technologies

Laser Metallization And Doping For Silicon Carbide Diode Fabrication And Endotaxy

Silicon carbide is a promising semiconductor material for high voltage, high frequency and high temperature devices due to its wide bandgap, high breakdown electric field strength, highly saturated drift velocity of electrons and outstanding thermal conductivity. With the aim of overcoming some challenges in metallization and doping during the fabrication of silicon carbide devices, a novel laser-based process is provided to direct metallize the surface of silicon carbide without metal deposition and dope in silicon carbide without high temperature annealing, as an alternative to the conventional ion implantation, and find applications of this laser direct write metallization and doping technique on the fabrication of diodes, endotaxial layer and embedded optical structures on silicon carbide wafers. Mathematical models have been presented for the temperature distributions in the wafer during laser irradiation to optimize laser process parameters and understand the doping and metallization mechanisms in laser irradiation process. Laser irradiation of silicon carbide in a dopant-containing ambient allows to simultaneously heating the silicon carbide surface without melting and incorporating dopant atoms into the silicon carbide lattice. The process that dopant atoms diffuse into the bulk silicon carbide by laser-induced solid phase diffusion (LISPD) can be explained by considering the laser enhanced substitutional and interstitial diffusion mechanisms. Nitrogen and Trimethyaluminum (TMA) are used as dopants to produce n-type and p-type doped silicon carbide, respectively. Two laser doping methods, i.e., internal heating doping and surface heating doping are presented in this dissertation. Deep (800 nm doped junction for internal heating doping) and shallow (200 nm and 450 nm doped junction for surface heating doping) can be fabricated by different doping methods. Two distinct diffusion regions, near-surface and far-surface regions, were identified in the dopant concentration profiles, indicating different diffusion mechanisms in these two regions. The effective diffusion coefficients of nitrogen and aluminum were determined for both regions by fitting the diffusion equation to the measured concentration profiles. The calculated diffusivities are at least 6 orders of magnitude higher than the typical values for nitrogen and aluminum, which indicate that laser doping process enhances the diffusion of dopants in silicon carbide significantly. No amorphization was observed in laser-doped samples eliminating the need for high temperature annealing. Laser direct metallization can be realized on the surface of silicon carbide by generating metal-like conductive phases due to the decomposition of silicon carbide. The ohmic property of the laser direct metallized electrodes can be dramatically improved by fabricating such electrodes on laser heavily doped SiC substrate. This laser-induced solid phase diffusion technique has been utilized to fabricate endolayers in n-type 6H-SiC substrates by carbon incorporation. X-ray energy dispersive spectroscopic analysis shows that the thickness of endolayer is about 100 nm. High resolution transmission electron microscopic images indicate that the laser endotaxy process maintains the crystalline integrity of the substrate without any amorphization. Rutherford backscattering studies also show no amorphization and evident lattice disorder occur during this laser solid phase diffusion process. The resistivity of the endolayer formed in a 1.55 omegacm silicon carbide wafer segment was found to be 1.1E5 omegacm which is sufficient for device fabrication and isolation. Annealing at 1000 oC for 10 min to remove hydrogen resulted in a resistivity of 9.4E4 omegacm. Prototype silicon carbide PIN diodes have been fabricated by doping the endolayer and parent silicon carbide epilayer with aluminum using this laser-induced solid phase diffusion technique to create p-regions on the top surfaces of the substrates. Laser direct metallized contacts were also fabricated on selected PIN diodes to show the effectiveness of these contacts. The results show that the PIN diode fabricated on a 30 nm thick endolayer can block 18 V, and the breakdown voltages and the forward voltages drop at 100 A/cm2 of the diodes fabricated on 4H-SiC with homoepilayer are 420 ~ 500 V and 12.5 ~ 20 V, respectively. The laser direct metallization and doping technique can also be used to synthesize embedded optical structures, which can increase 40% reflectivity compared to the parent wafer, showing potential for the creation of optical, electro-optical, opto-electrical, sensor devices and other integrated structures that are stable in high temperature, high-pressure, corrosive environments and deep space applications

Coupled-cavity terahertz quantum cascade lasers for single mode operation

We demonstrate the operation of coupled-cavity terahertz frequency quantum-cascade lasers composed of two sub-cavities separated by an air gap realized by optical lithography and dry etching. This geometry allows stable, single mode operation with typical side mode suppression ratios in the 30-40 dB range. We employ a transfer matrix method to model the mode selection mechanism. The obtained results are in good agreement with the measurements and allow prediction of the operating frequency

Method of Fabricating Solid State Gas Dissociating Device By Laser Doping

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