Scanning thermal microscopy using nanofabricated probes

Novel atomic force microscope (AFM) probes with integrated thin film thermal sensors are presented. Silicon micromachining and high resolution electron beam lithography (EBL) have been used to make batch fabricated, functionalised AFM probes. The AFM tips, situated at the ends of Si3N4 cantilevers, are shaped either as truncated pyramids or sharp triangular asperites. The former gives good thermalisation of the sensor to the specimen for flat specimens whereas the latter gives improved access to highly topographic specimens. Tip radii for the different probes are 1 m and 50 nm respectively. A variety of metal structures have been deposited on the tips using EBL and lift-off to form Au/Pd thermocouples and Pd resistance thermometer/heaters. Sensor dimensions down to 35 nm have been demonstrated. In the case of the sharp triangular tips, holes were etched into parts of the cantilever in order to provide self alignment of the sensor to the tip. On the pyramidal tips it has been shown that multiple sensors can be made on a single tip with good definition and matching between sensors. A conventional AFM was constructed in order to test the micromachined thermal probes. During scans of a photothermal test specimen using improved access thermocouple probes, 80 nm period metal gratings were thermally resolved. This is equivalent to a thermal lateral resolution of 40 nm. Pyramidal tips with a resistance thermometer/heater, which were made for the microscopy and analysis of polymers, have been showed by others to produce high resolution thermal conductivity images. The probes have also been shown to be capable of locally heating a polymer specimen and thermomechanically measuring phase changes in small volumes of material. Also presented here is a study of scanning thermal microscopy of semiconductor structures using a commercial AFM. Included are scans of several specimens using both commercial andthe new micromachined probes. Subsurface images of voids buried under a SiO2 passivation layer were taken. It is shown that contrast caused by thermal conductivity differences in the specimen may be detected at a depth of over 200 nm

Memory and Coupling in Nanocrystal Optoelectronic Devices

Optoelectronic devices incorporating semiconducting nanocrystals are promising for many potential applications. Nanocrystals whose size is below the exciton Bohr radius have optical absorption and emission that is tunable with size, due to the quantum confinement of the charge carriers. However, the same confinement that yields these optical properties also makes electrical conduction in a film of nanocrystals occur via tunneling, due to the high energy barrier between nanocrystals. Hence, the extraction of photo-generated charge carriers presents a significant challenge. Several approaches to optimizing the reliability and efficiency of optoelectronic devices using semiconducting nanocrystals are explored herein. Force microscopy is used to investigate charge behavior in nanocrystal films. Plasmonic structures are lithographically defined to enhance electric field and thus charge collection efficiency in two-electrode nanocrystal devices illuminated at plasmonically resonant wavelengths. Graphene substrates are shown to couple electronically with nanocrystal films, improving device conduction while maintaining carrier quantum confinement within the nanocrystal. And finally, the occupancy of charge carrier traps is shown to both directly impact the temperature-dependent photocurrent behavior, and be tunable using a combination of illumination and electric field treatments. Trap population manipulation is robustly demonstrated and verified using a variety of wavelength, intensity, and time-dependent measurements of photocurrent in nanogap nanocrystal devices, emphasizing the importance of measurement history and the possibility of advanced device behavior tuning based on desired operating conditions. Each of these experiments reveals a path toward understanding and optimizing semiconducting nanocrystal optoelectronic devices

Doctor of Philosophy

dissertationThis dissertation describes the advancements made towards the implementation of Tip-Enhanced Fluorescence Microscopy (TEFM) in imaging biological specimens. This specialized type of microscopy combines the chemical specifi city of optical microscopy techniques with the resolution of atomic force microscopy (AFM). When an AFM probe is centered in the focal spot of an excitation laser with axial polarization, the probe concentrates the optical field such that it can be used to induce nanometer scale fluorescence. The physical mechanisms of this optical field enhancement are set forth in detail. The feasibility of this technique for imaging bimolecular networks is discussed in regard to the requirements for adequate image contrast, as well as for obtaining fi eld enhancement in aqueous environments. A semianalytical model for image contrast for TEFM has been developed. This model shows that using demodulation techniques greatly increases the image contrast attainable with this technique, and is capable of predicting the requisite enhancement factors to achieve imaging of biomolecular networks at good contrast levels. This model predicts that signal enhancement factors on the order of 20 are needed to image densely packed samples. This dissertation also highlights a novel tomographical imaging approach. By timestamping the fluorescence photon arrival times, and subsequently correlating them to the timestamped motion of a vertically oscillating probe, a three-dimensional map of tip-sample interactions can be constructed. The culmination of these advancements has led to the ability to map the interactions between single carbon nanotubes and single fluorescent nanocrystals (quantum dots). Various attempts at using TEFM in water have been thus far unsuccessful. Several explanations for this shortfall have been identi ed|understanding these shortcomings has helped to identify the optimal excitation conditions for field enhancement

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Row-Column Capacitive Micromachined Ultrasonic Transducers for Medical Imaging

Ultrasound imaging plays an important role in modern medical diagnosis. Recent progress in real-time 3-D ultrasound imaging can offer critical information such as the accurate estimation of organ, cyst, or tumour volumes. However, compared to conventional 2-D ultrasound imaging, the large amount of data and circuit complexity found in 3-D ultrasound imaging results in very expensive systems. Therefore, a simplification scheme for 3-D ultrasound imaging technology is needed for a more wide-spread use and to advance clinical development of volumetric ultrasound. Row-column addressing 2-D array is one particular simplification scheme that requires only N + N addressing lines to activate each element in an N × N array. As a result, the fabrication, circuit, and processing complexity dramatically decrease. Capacitive micromachined ultrasonic transducer (CMUT) technology was chosen to fabricate the array as it offers micro-precision fabrication and a wide bandwidth, which make it an attractive transducer technology. The objective of this thesis is to investigate and demonstrate the imaging potential of row-column CMUT arrays for RT3D imaging. First, the motivation, physics, and modelling of both CMUTs and row-column arrays are described, followed by the demonstration of a customized row-column CMUT pseudo-real-time 3-D imaging system. One particular limitation about row-column arrays discovered as part of this dissertation work is the limited field-of-view of the row-column arrays’ imaging performance. A curved row-column CMUT array was proposed to improve the field-of-view, and the resulting modelling of the acoustic field and simulated reconstructed image are presented. Furthermore, a new fabrication process was proposed to construct a curved row-column CMUT array. The resulting device was tested to demonstrate its flexibility to achieve the necessary curvature. Finally, a new wafer bonding process is introduced to tackle the next generation of RC-CMUT fabrication. Many of the new fabrication techniques reported in this work are useful for CMUT fabrication engineers. The analysis on row-column array also provides additional insights for 2-D array simplification research

Batch-fabrication of novel nanoprobes for SPM

A micromachining method has been developed for fabricating 20µm tall silicon atomic force tips with flat tops less than 2µm wide suitable for defining nanosensors upon, and with low aspect ratio sides suitable for defining electrical connections to the sensor. Methods have been developed to allow flat substrate processing techniques to be applied to such non-planar micromachined substrates. This has necessitated the development of a novel resist-coating technique and the use of defocused electron-beam lithography. Methods for through-wafer alignment by electron-beam lithography and accurate alignment to the tips using micromachined alignment markers have also had to be developed. The fabrication process has been designed to enable a wide variety of sub-micron sensors to be defined on the atomic force probes, with little additional development beyond that of : sensors themselves. This flexibility has enabled very different sensors meant for very different scanning probe microscopy techniques to be designed without significant redevelopment of the underlying fabrication process. The main restrictions on the type of sensor that can be used are the physical dimensions of the sensor, the number of alignment levels necessary, the degree of alignment accuracy required and the choice of sensor materials. However, within these constraints it has been found that probes optimised for scanning near-field optical microscopy (SNOM), scanning thermal microscopy, modulation differential scanning calorimetry (MDSC) and scanning Hall-probe microscopy can be fabricated. For the SNOM probes three methods for fabricating sub-l00nm diameter apertures have been developed, analysed and compared with each other to evaluate both the process latitude. and, the size and reproducibility of apertures that can be fabricated, as a function of electron beam dose, pattern shape and size, and metallisation material and thickness. Two methods, both utilising multilayer 'resist' schemes have been found suitable for this purpose, one based on conventional electron-beam lithography with PMMA and a new dry etching process for titanium, and the other based on a novel electron-beam lithography technique utilising cross-linked PMMA for lifting off nichrome. A simple analytical model has also been developed for these probes allowing the effects of changes in the sensor design parameters on the light throughput to be compared qualitatively, if not quantitatively. For the scanning thermal probes a method for lifting-off sub-l00nm, thin-film thermocouple sensors on silicon tips without the loss of electrical continuity has been developed. For the MDSC probes, a similar method has been developed for defining thermal resistors. A method has also been presented for fabricating sensors for scanning Hall-probe microscopy based on an evaporated germanium sensing layer. This has been found to require annealing and optimisation of sensor design and geometry to reduce sensor resistance to acceptable levels

Direct-Write Ion Beam Lithography

Patterning with a focused ion beam (FIB) is an extremely versatile fabrication process that can be used to create microscale and nanoscale designs on the surface of practically any solid sample material. Based on the type of ion-sample interaction utilized, FIB-based manufacturing can be both subtractive and additive, even in the same processing step. Indeed, the capability of easily creating three-dimensional patterns and shaping objects by milling and deposition is probably the most recognized feature of ion beam lithography (IBL) and micromachining. However, there exist several other techniques, such as ion implantation- and ion damage-based patterning and surface functionalization types of processes that have emerged as valuable additions to the nanofabrication toolkit and that are less widely known. While fabrication throughput, in general, is arguably low due to the serial nature of the direct-writing process, speed is not necessarily a problem in these IBL applications that work with small ion doses. Here we provide a comprehensive review of ion beam lithography in general and a practical guide to the individual IBL techniques developed to date. Special attention is given to applications in nanofabrication