The impact of self-heating and SiGe strain-relaxed buffer thickness on the analog performance of strained Si nMOSFETs

The impact of the thickness of the silicon–germanium strain-relaxed buffer (SiGe SRB) on the analog performance of strained Si nMOSFETs is investigated. The negative drain conductance caused by self-heating at high power levels leads to negative self-gain which can cause anomalous circuit behavior like non-linear phase shifts. Using AC and DC measurements, it is shown that reducing the SRB thickness improves the analog design space and performance by minimizing self-heating. The range of terminal voltages that leverage positive self-gain in 0.1 μm strained Si MOSFETs fabricated on 425 nm SiGe SRBs is increased by over 100% compared with strained Si devices fabricated on conventional SiGe SRBs 4 μm thick. Strained Si nMOSFETs fabricated on thin SiGe SRBs also show 45% improvement in the self-gain compared with the Si control as well as 25% enhancement in the on-state performance compared with the strained Si nMOSFETs on the 4 μm SiGe SRB. The extracted thermal resistance is 50% lower in the strained Si device on the thin SiGe SRB corresponding to a 30% reduction in the temperature rise compared with the device fabricated on the 4 μm SiGe SRB. Comparisons between the maximum drain voltages for positive self-gain in the strained Si devices and the ITRS projections of supply-voltage scaling show that reducing the thickness of the SiGe SRB would be necessary for future technology nodes

MEMS-enabled silicon photonic integrated devices and circuits

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC's Standard iSiPP50G Silicon Photonics Platform and a custom release process

Power harvesting in a helicopter lag damper

In this paper a new power harvesting application is developed and simulated. Power harvesting is chosen within the European Clean Sky project as a solution to powering in-blade health monitoring systems as opposed to installing an elaborate electrical infrastructure to draw power from and transmit signals to the helicopter body. Local generation of power will allow for a ‘plug and play’ rotor blade and signals may be logged or transmitted wirelessly.\ud The lag damper is chosen to be modified as it provides a well defined loading due to the re-gressive damping characteristic. A piezo electric stack is installed inside the damper rod, effec-tively coupled in series with the damper. Due to the well defined peak force generated in the damper the stack geometry requires a very limited margin of safety. Typically the stack geometry must be chosen to prevent excessive voltage build-up as opposed to mechanical overload.\ud Development and simulation of the model is described starting with a simplified blade and piezo element model. Presuming specific flight conditions transient simulations are conducted using various power harvesting circuits and their performance is evaluated. The best performing circuit is further optimized to increase the specific power output. Optimization of the electrical and mechanical domains must be done simultaneously due to the high electro-mechanical cou-pling of the piezo stack. The non-linear electrical properties of the piezo material, most notably the capacitance which may have a large influence, are not yet considered in this study.\ud The power harvesting lag damper provides sufficient power for extensive health monitoring systems within the blade while retaining the functionality and safety of the standard component. For the 8.15m blade radius and 130 knots flight speed under consideration simulations show 7.5 watts of power is generated from a single damper

Programmable photonics : an opportunity for an accessible large-volume PIC ecosystem

We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Index to NASA Tech Briefs, 1975

This index contains abstracts and four indexes--subject, personal author, originating Center, and Tech Brief number--for 1975 Tech Briefs

Automated routing and control of silicon photonic switch fabrics

Automatic reconfiguration and feedback controlled routing is demonstrated in an 8×8 silicon photonic switch fabric based on Mach-Zehnder interferometers. The use of non-invasive Contactless Integrated Photonic Probes (CLIPPs) enables real-time monitoring of the state of each switching element individually. Local monitoring provides direct information on the routing path, allowing an easy sequential tuning and feedback controlled stabilization of the individual switching elements, thus making the switch fabric robust against thermal crosstalk, even in the absence of a cooling system for the silicon chip. Up to 24 CLIPPs are interrogated by a multichannel integrated ASIC wire-bonded to the photonic chip. Optical routing is demonstrated on simultaneous WDM input signals that are labelled directly on-chip by suitable pilot tones without affecting the quality of the signals. Neither preliminary circuit calibration nor lookup tables are required, being the proposed control scheme inherently insensible to channels power fluctuations

NASA Tech Briefs Index, 1977, volume 2, numbers 1-4

Announcements of new technology derived from the research and development activities of NASA are presented. Abstracts, and indexes for subject, personal author, originating center, and Tech Brief number are presented for 1977