Total Ionizing Dose and Dose Rate Effects on (Positive and Negative) BJT Based Bandgap References

abstract: Space exploration is a large field that requires high performing circuitry due to the harsh environment. Within a space environment one of the biggest factors leading to circuit failure is radiation. Circuits must be robust enough to continue operation after being exposed to the high doses of radiation. Bandgap reference (BGR) circuits are designed to be voltage references that stay stable across a wide range of supply voltages and temperatures. A bandgap reference is a piece of a large circuit that supplies critical elements of the large circuit with a constant voltage. When used in a space environment with large amounts of radiation a BGR needs to maintain its output voltage to enable the rest of the circuit to operate under proper conditions. Since a BGR is not a standalone circuit it is difficult and expensive to test if a BGR is maintaining its reference voltage. This thesis describes a methodology of isolating and simulating bandgap references. Both NPN and PNP bandgap references are simulated over a variety of radiation doses and dose rates. This methodology will allow the degradation due to radiation of a BGR to be modeled easily and affordably. It can be observed that many circuits experience enhanced low dose rate sensitivity (ELDRS) which can lead to failure at low total ionizing doses (TID) of radiation. A compact model library demonstrating degradation of transistors at both high and low dose rates (HDR and LDR) will be used to show bandgap references reliability. Specifically, two bandgap references being utilized in commercial off the shelf low dropout regulators (LDO) will be evaluated. The LDOs are reverse engineered in a simulation program with integrated circuit emphasis (SPICE). Within the two LDOs the bandgaps will be the points of interest. Of the LDOs one has a positive regulated voltage and one has a negative regulated voltage. This requires an NPN and a PNP based BGR respectively. This simulation methodology will draw conclusions about the above bandgap references, and how they operate under radiation at different doses and dose rates.Dissertation/ThesisMasters Thesis Electrical Engineering 201

The Impact on Space Radiation Requirements and Effects on ASIMS

The evolution of highly miniaturized electronic and mechanical systems will be accompanied by new problems and issues regarding the radiation response of these systems in the space environment. In this paper we discuss some of the more prominent radiation problems brought about by miniaturization. For example, autonomous micro-spacecraft will require large amounts of high density memory, most likely in the form of stacked, multichip modules of DRAM's, that must tolerate the radiation environment. However, advanced DRAM's (16 to 256 Mbit) are quite susceptible to radiation, particularly single event effects, and even exhibit new radiation phenomena that were not a problem for older, less dense memory chips. Another important trend in micro-spacecraft electronics is toward the use of low-voltage microelectronic systems that consume less power. However, the reduction in operating voltage also caries with it an increased susceptibility to radiation. In the case of application specific integrated microcircuits (ASIM's), advanced devices of this type, such as high density field programmable gate arrays (FPGA's) exhibit new single event effects (SEE), such as single particle reprogramming of anti-fuse links. New advanced bipolar circuits have been shown recently to degrade more rapidly in the low dose rate space environment than in the typical laboratory total dose radiation test used to qualify such devices. Thus total dose testing of these parts is no longer an appropriately conservative measure to be used for hardness assurance. We also note that the functionality of micromechanical Si-based devices may be altered due to the radiation-induced deposition of charge in the oxide passivation layers

Study of SEM induced current and voltage contrast modes to assess semiconductor reliability

The purpose of the scanning electron microscopy study was to review the failure history of existing integrated circuit technologies to identify predominant failure mechanisms, and to evaluate the feasibility of their detection using SEM application techniques. The study investigated the effects of E-beam irradiation damage and contamination deposition rates; developed the necessary methods for applying the techniques to the detection of latent defects and weaknesses in integrated circuits; and made recommendations for applying the techniques

Statistical Methods for Large Flight Lots and Ultra-high Reliability Applications

We present statistical techniques for evaluating random and systematic errors for use in flight performance predictions for large flight lots and ultra-high reliability applications

Operation of silicon-germanium heterojunction bipolar transistors on silicon-on-insulator in extreme environments

Recently, several SiGe HBT devices fabricated on CMOS-compatible silicon on insulator (SOI) substrates (SiGe HBTs-on-SOI) have been demonstrated, combining the well-known SiGe HBT performance with the advantages of SOI substrates. These new devices are especially interesting in the context of extreme environments - highly challenging surroundings that lie outside commercial and even military electronics specifications. However, fabricating HBTs on SOI substrates instead of traditional silicon bulk substrates requires extensive modifications to the structure of the transistors and results in significant trade-offs. The present work investigates, with measurements and TCAD simulations, the performance and reliability of SiGe heterojunction bipolar transistors fabricated on silicon on insulator substrates with respect to operation in extreme environments such as at extremely low or extremely high temperatures or in the presence of radiation (both in terms of total ionizing dose and single effect upset).Ph.D.Committee Chair: Cressler, John D.; Committee Member: Papapolymerou, John; Committee Member: Ralph, Stephen; Committee Member: Shen, Shyh-Chiang; Committee Member: Zhou, Hao Mi

Saturn integrated circuit reliability test program Final report, 28 Jun. 1966 - 1 Jul. 1967

Literature survey and test program to study reliability of linear integrated circuit