Physical Design and Clock Tree Synthesis Methods For A 8-Bit Processor

Now days a number of processors are available with a lot kind of feature from different industries. A processor with similar kind of architecture of the current processors only missing the memory stuffs like the RAM and ROM has been designed here with the help of Verilog style of coding. This processor contains architecturally the program counter, instruction register, ALU, ALU latch, General Purpose Registers, control state module, flag registers and the core module containing all the modules. And a test module is designed for testing the processor. After the design of the processor with successful functionality, the processor is synthesized with 180nm technology. The synthesis is performed with the data path optimization like the selection of proper adders and multipliers for timing optimization in the data path while the ALU operations are performed. During synthesis how to take care of the worst negative slack (WNS), how to include the clock gating cells, how to define the cost and path groups etc. have been covered. After the proper synthesis we get the proper net list and the synthesized constraint file for carrying out the physical design. In physical design the steps like floor-planning, partitioning, placement, legalization of the placement, clock tree synthesis, and routing etc. have been performed. At all the stages the static timing analysis is performed for the timing meet of the design for better performance in terms of timing or frequency. Each steps of physical design are discussed with special effort towards the concepts behind the step. Out of all the steps of physical design the clock tree synthesis is performed with some improvement in the performance of the clock tree by creating a symmetrical clock tree and maintaining more common clock paths. A special algorithm has been framed for creating a symmetrical clock tree and thereby making the power consumption of the clock tree low

A sub-mW IoT-endnode for always-on visual monitoring and smart triggering

This work presents a fully-programmable Internet of Things (IoT) visual sensing node that targets sub-mW power consumption in always-on monitoring scenarios. The system features a spatial-contrast $128\mathrm{x}64$ binary pixel imager with focal-plane processing. The sensor, when working at its lowest power mode ($10\mu W$ at 10 fps), provides as output the number of changed pixels. Based on this information, a dedicated camera interface, implemented on a low-power FPGA, wakes up an ultra-low-power parallel processing unit to extract context-aware visual information. We evaluate the smart sensor on three always-on visual triggering application scenarios. Triggering accuracy comparable to RGB image sensors is achieved at nominal lighting conditions, while consuming an average power between $193\mu W$ and $277\mu W$, depending on context activity. The digital sub-system is extremely flexible, thanks to a fully-programmable digital signal processing engine, but still achieves 19x lower power consumption compared to MCU-based cameras with significantly lower on-board computing capabilities.Comment: 11 pages, 9 figures, submitteted to IEEE IoT Journa

Physical design of USB1.1

In earlier days, interfacing peripheral devices to host computer has a big problematic. There existed so many different kinds’ ports like serial port, parallel port, PS/2 etc. And their use restricts many situations, Such as no hot-pluggability and involuntary configuration. There are very less number of methods to connect the peripheral devices to host computer. The main reason that Universal Serial Bus was implemented to provide an additional benefits compared to earlier interfacing ports. USB is designed to allow many peripheral be connecting using single standardize interface. It provides an expandable fast, cost effective, hot-pluggable plug and play serial hardware interface that makes life of computer user easier allowing them to plug different devices to into USB port and have them configured automatically. In this thesis demonstrated the USB v1.1 architecture part in briefly and generated gate level net list form RTL code by applying the different constraints like timing, area and power. By applying the various types design constraints so that the performance was improved by 30%. And then it implemented in physically by using SoC encounter EDI system, estimation of chip size, power analysis and routing the clock signal to all flip-flops presented in the design. To reduce the clock switching power implemented register clustering algorithm (DBSCAN). In this design implementation TSMC 180nm technology library is used

Hardware Considerations for Signal Processing Systems: A Step Toward the Unconventional.

As we progress into the future, signal processing algorithms are becoming more computationally intensive and power hungry while the desire for mobile products and low power devices is also increasing. An integrated ASIC solution is one of the primary ways chip developers can improve performance and add functionality while keeping the power budget low. This work discusses ASIC hardware for both conventional and unconventional signal processing systems, and how integration, error resilience, emerging devices, and new algorithms can be leveraged by signal processing systems to further improve performance and enable new applications. Specifically this work presents three case studies: 1) a conventional and highly parallel mix signal cross-correlator ASIC for a weather satellite performing real-time synthetic aperture imaging, 2) an unconventional native stochastic computing architecture enabled by memristors, and 3) two unconventional sparse neural network ASICs for feature extraction and object classification. As improvements from technology scaling alone slow down, and the demand for energy efficient mobile electronics increases, such optimization techniques at the device, circuit, and system level will become more critical to advance signal processing capabilities in the future.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116685/1/knagphil_1.pd

Energy Efficient Hardware Design for Securing the Internet-of-Things

The Internet of Things (IoT) is a rapidly growing field that holds potential to transform our everyday lives by placing tiny devices and sensors everywhere. The ubiquity and scale of IoT devices require them to be extremely energy efficient. Given the physical exposure to malicious agents, security is a critical challenge within the constrained resources. This dissertation presents energy-efficient hardware designs for IoT security. First, this dissertation presents a lightweight Advanced Encryption Standard (AES) accelerator design. By analyzing the algorithm, a novel method to manipulate two internal steps to eliminate storage registers and replace flip-flops with latches to save area is discovered. The proposed AES accelerator achieves state-of-art area and energy efficiency. Second, the inflexibility and high Non-Recurring Engineering (NRE) costs of Application-Specific-Integrated-Circuits (ASICs) motivate a more flexible solution. This dissertation presents a reconfigurable cryptographic processor, called Recryptor, which achieves performance and energy improvements for a wide range of security algorithms across public key/secret key cryptography and hash functions. The proposed design employs circuit techniques in-memory and near-memory computing and is more resilient to power analysis attack. In addition, a simulator for in-memory computation is proposed. It is of high cost to design and evaluate new-architecture like in-memory computing in Register-transfer level (RTL). A C-based simulator is designed to enable fast design space exploration and large workload simulations. Elliptic curve arithmetic and Galois counter mode are evaluated in this work. Lastly, an error resilient register circuit, called iRazor, is designed to tolerate unpredictable variations in manufacturing process operating temperature and voltage of VLSI systems. When integrated into an ARM processor, this adaptive approach outperforms competing industrial techniques such as frequency binning and canary circuits in performance and energy.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147546/1/zhyiqun_1.pd

Trends in Pixel Detectors: Tracking and Imaging

For large scale applications, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the state of the art in pixel detector technology to date. They have been developed and start to be used as tracking detectors and also imaging devices in radiography, autoradiography, protein crystallography and in X-ray astronomy. A number of trends and possibilities for future applications in these fields with improved performance, less material, high read-out speed, large radiation tolerance, and potential off-the-shelf availability have appeared and are momentarily matured. Among them are monolithic or semi-monolithic approaches which do not require complicated hybridization but come as single sensor/IC entities. Most of these are presently still in the development phase waiting to be used as detectors in experiments. The present state in pixel detector development including hybrid and (semi-)monolithic pixel techniques and their suitability for particle detection and for imaging, is reviewed.Comment: 10 pages, 15 figures, Invited Review given at IEEE2003, Portland, Oct, 200

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects