RF to Millimeter-wave Linear Power Amplifiers in Nanoscale CMOS SOI Technology

The low manufacturing cost, integration capability with baseband and digital circuits, and high operating frequency of nanoscale CMOS technologies have propelled their applications into RF and microwave systems. Implementing fully-integrated RF to millimeter-wave (mm-wave) CMOS power amplifiers (PAs), nevertheless, remains challenging due to the low breakdown voltages of CMOS transistors and the loss from on-chip matching networks. These limitations have reduced the design space of CMOS power amplifiers to narrow-band, low linearity metrics often with insufficient gain, output power, and efficiency. A new topology for implementing power amplifiers based on stacking of CMOS SOI transistors is proposed. The input RF power is coupled to the transistors using on-chip transformers, while the gate terminal of teach transistor is dynamically biased from the output node. The output voltages of the stacked transistors are added constructively to increase the total output voltage swing and output power. Moreover, the stack configuration increases the optimum load impedance of the PA to values close to 50 ohm, leading to power, efficiency and bandwidth enhancements. Practical design issues such as limitation in the number of stacked transistors, gate oxide breakdown, stability, effect of parasitic capacitances on the performance of the PA and large chip areas have also been addressed. Fully-integrated RF to mm-wave frequency CMOS SOI PAs are successfully implemented and measured using the proposed topology

Four-element phased-array beamformers and a self-interference canceling full-duplex transciver in 130-nm SiGe for 5G applications at 26 GHz

This thesis is on the design of radio-frequency (RF) integrated front-end circuits for next generation 5G communication systems. The demand for higher data rates and lower latency in 5G networks can only be met using several new technologies including, but not limited to, mm-waves, massive-MIMO, and full-duplex. Use of mm-waves provides more bandwidth that is necessary for high data rates at the cost of increased attenuation in air. Massive-MIMO arrays are required to compensate for this increased path loss by providing beam steering and array gain. Furthermore, full duplex operation is desirable for improved spectrum efficiency and reduced latency. The difficulty of full duplex operation is the self-interference (SI) between transmit (TX) and receive (RX) paths. Conventional methods to suppress this interference utilize either bulky circulators, isolators, couplers or two separate antennas. These methods are not suitable for fully-integrated full-duplex massive-MIMO arrays. This thesis presents circuit and system level solutions to the issues summarized above, in the form of SiGe integrated circuits for 5G applications at 26 GHz. First, a full-duplex RF front-end architecture is proposed that is scalable to massive-MIMO arrays. It is based on blind, RF self-interference cancellation that is applicable to single/shared antenna front-ends. A high resolution RF vector modulator is developed, which is the key building block that empowers the full-duplex frontend architecture by achieving better than state-of-the-art 10-b monotonic phase control. This vector modulator is combined with linear-in-dB variable gain amplifiers and attenuators to realize a precision self-interference cancellation circuitry. Further, adaptive control of this SI canceler is made possible by including an on-chip low-power IQ downconverter. It correlates copies of transmitted and received signals and provides baseband/dc outputs that can be used to adaptively control the SI canceler. The solution comes at the cost of minimal additional circuitry, yet significantly eases linearity requirements of critical receiver blocks at RF/IF such as mixers and ADCs. Second, to complement the proposed full-duplex front-end architecture and to provide a more complete solution, high-performance beamformer ICs with 5-/6- b phase and 3-/4-b amplitude control capabilities are designed. Single-channel, separate transmitter and receiver beamformers are implemented targeting massive- MIMO mode of operation, and their four-channel versions are developed for phasedarray communication systems. Better than state-of-the-art noise performance is obtained in the RX beamformer channel, with a full-channel noise figure of 3.3 d

이동통신 기기에 적합한 재구성이 가능한 다중대역 선형 CMOS 전력증폭기에 관한 연구

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2015. 2. 권영우.In this Dissertation, a study on multiband reconfigurable linear CMOS power amplifier (PA) is performed. Since a larger number of frequency bands is allocated for 3G/4G mobile communication standards nowadays, handset PAs are required to support the ever-increasing number of frequency bands. With the advent of high-speed wireless data transmission, handset PAs are also demanded to perform linear power amplification under the wide-band signal condition. Even though the CMOS technology has cost and size benefits, however, designing a watt-level linear CMOS PA is a challenging issue due to low breakdown voltage and nonlinear nature of the CMOS device. To resolve the issues above, this study presents two methods suitable for multiband (MB) linear CMOS PA: a reconfigurable MB matching structure and a linearization technique. The proposed MB structure shares a PA core to reduce the cost and size, and contains the power- and frequency-reconfigurable matching networks as well as the output path-selection function. Thus, it can perform the MB operation requiring multiple frequency bands and target output powers. The reconfiguration mechanism is quantitatively analyzed and experimentally demonstrated. The fabricated tri-band reconfigurable 3G UMTS PA using an InGaP/GaAs heterojunction bipolar transistor (HBT) process for practical handset application showed minimal efficiency degradation of less than 2% by multi-banding, compared with a single-band reference PA. For linearization of a CMOS PA, a phase-based linearization technique is presented. Since the PA nonlinearity is determined by the dynamic AM-AM and AM-PM, the two distortions should simultaneously be considered in linearization. Contrary to the previous works which have focused on the correction of AM-AM distortion by providing an envelope-dependent gate-bias, this work proposes an AM-PM linearizer using a varactor and an envelope-reshaping circuit. This linearizer helps the PA recover AM-AM distortion as well. To validate the usefulness of the proposed linearizer, 1.88 GHz and 0.9 GHz stacked-FET PAs using a 0.32-μm silicon-on-insulator (SOI) CMOS process were designed and fabricated. Measurement results showed that the fabricated 1.88 / 0.9 GHz linear CMOS PAs achieved linear efficiencies (meeting –39 dBc W-CDMA ACLR) of higher than 44 / 49%. Furthermore, a single-chain MB linear CMOS PA was implemented based on the proposed MB reconfiguration and linearization techniques. The fabricated MB PA, which has two outputs and covers five popular uplink UMTS/LTE bands (Band 1/2/4/5/8: 824 ~ 1980 MHz), showed minimal efficiency degradation (< 3.3%) compared to the single-band dedicated CMOS PA with W-CDMA efficiencies in excess of 40.7%. Finally, the signal-bandwidth limiting effect of the envelope-based linear CMOS PA is discussed and a solution is proposed. Due to the time delay during envelope-detection and shaping, a timing mismatch between the incoming RF signal and envelope-reshaped signal occurs, thus resulting in no linearization effect under wide-band signal (LTE 20 MHz or more) conditions. To resolve the problem, a group delay circuit with a compact size is employed and thus the linearization effect of the proposed phase-based linearizer is maintained up to 40 MHz LTE bandwidth.Abstract i Contents iii List of Tables vi List of Figures vii 1. Introduction 1 1.1 Motivation 1 1.2 Multiband PA Structure 4 1.3 Linearization of CMOS PA 6 1.4 Dissertation Organization 7 1.5 References 9 2. A Multiband Reconfigurable Power Amplifier for 3G UMTS Handset Applications 10 2.1 Introduction 10 2.2 Operation Principle of the Reconfigurable Output Matching Network 12 2.2.1 Power Reconfigurable Network (PRN) 14 2.2.2 Frequency Reconfigurable Network (FRN) 17 2.2.3 Path Selection Network (PSN) 20 2.2.4 Experimental Validation of the PRN and FRN 24 2.3 Fabrication and Measurement of a MB UMTS Reconfigurable PA 26 2.3.1 Design 26 2.3.2 Measurement 31 2.4 Summary 37 2.5 References 38 3. Linearization of CMOS Power Amplifier and Its Multiband Application 41 3.1 Introduction 41 3.2 Linearization of CMOS PAs: Prior Arts 43 3.3 Harmonic Termination 46 3.3.1 Operation Analysis 47 3.3.2 Experimental Validation 52 3.4 Control of Gate Bias Modulation Effect 54 3.4.1 Analysis 54 3.4.2 Experimental Validation 60 3.5 Proposed Linearization #1: Hybrid Bias 67 3.6 Proposed Linearization #2: Phase Injection 71 3.6.1 Motivation 71 3.6.2 Phase (Capacitance) Injection 72 3.7 Linear CMOS PA Design 75 3.7.1 Baseline PA Design 76 3.7.2 Linearizer Design 78 3.7.3 Fabrication 82 3.8 Measurement Results 83 3.8.1 CW Measurement 83 3.8.2 W-CDMA Measurement 84 3.8.3 LTE Measurement 87 3.9 A Single-Chain MB Reconfigurable Linear PA in SOI CMOS 90 3.9.1 MB Linear CMOS PA: Design 90 3.9.2 MB Linear CMOS PA: Measurement 94 3.10 Summary 99 3.11 References 100 4. Linearization of CMOS Power Amplifier Convering Wideband Signal 105 4.1 Introduction 105 4.2 Bandwidth Limitation of Envelope-Based Linearizers 106 4.2.1 Analysis 106 4.2.2 Delay Correction 110 4.2.3 Feedforward Envelope-Detection Structure with a Delay T/L 114 4.3 Group Delay Circuit 117 4.3.1 Positive GDC versus Negative GDC 117 4.3.2 Left-Handed T/L-Based GDC 119 4.4 Fabrication and Measurement 122 4.4.1 GDC Measurement 123 4.4.2 LTE Measurement 124 4.5 Summary 127 4.6 References 128 5. Conclusions 130 5.1 Research Summary 130 5.2 Future Works 132 Abstract in Korean 133 Publications 135Docto

Analysis and Design of CMOS Radio-Frequency Power Amplifiers

The continuous advancement of semiconductor technologies, especially CMOS technology, has enabled exponential growth of the wireless communication industry. This explosive growth in turn has completely changed people’s lives. The CMOS feature size scale down greatly benefits digital logic integrations, which result in more powerful, versatile, and economical digital signal processing. Further research and development has pushed analog, mixed-signal, and even radio-frequency (RF) circuit blocks to be implemented and integrated in CMOS. Future generations of wireless communication call for even further level of integration, and as of now, the only circuit block that is rarely integrated in CMOS along with other parts of the system is the power amplifier (PA). Due to the fact that the PA in a wireless communication system is the most power-hungry circuit block, the integration of RF PA in CMOS would potentially not only save the cost of the wireless communication system real estate, but also reduce power consumption since die-to-die connection loss can be eliminated. RF PA design involves handling large amounts of voltage and current at the radio frequencies, which in the present wireless communication standards are in the range of giga-hertz. Therefore, a good understanding of many aspects related to RF PA design is necessary. Theoretical analysis of the communication system, nonlinear effects of the PA, as well as the impedance matching network is systematically presented. The analysis of the nonlinear effects proposes a formal mathematical description of the multitone nonlinearity, and through its relationship with two-tone test, the proposed PA design methodology would greatly reduce the design time while improving the design accuracy. A thorough analysis of the available architecture and design techniques for efficiency and linearity enhancement of RF PA shows that despite tremendous amounts of research and development into this topic, the fundamental tradeoff between the two still limits the RF PA implementation largely within SiGe, GaAs, and InP technologies. A RF PA for Wideband Code-Division Multiple Access (WCDMA) application standard is proposed, designed, and implemented in CMOS that demonstrates the proposed segmentation technique that resolved the main tradeoff between power efficiency and linearity. The innovative architecture developed in this work is not limited to applications in the WCDMA communication protocol or the CMOS technology, although CMOS implementation would take advantage of the readily available digital resources

Analysis and Design of CMOS Radio-Frequency Power Amplifiers

The continuous advancement of semiconductor technologies, especially CMOS technology, has enabled exponential growth of the wireless communication industry. This explosive growth in turn has completely changed people’s lives. The CMOS feature size scale down greatly benefits digital logic integrations, which result in more powerful, versatile, and economical digital signal processing. Further research and development has pushed analog, mixed-signal, and even radio-frequency (RF) circuit blocks to be implemented and integrated in CMOS. Future generations of wireless communication call for even further level of integration, and as of now, the only circuit block that is rarely integrated in CMOS along with other parts of the system is the power amplifier (PA). Due to the fact that the PA in a wireless communication system is the most power-hungry circuit block, the integration of RF PA in CMOS would potentially not only save the cost of the wireless communication system real estate, but also reduce power consumption since die-to-die connection loss can be eliminated. RF PA design involves handling large amounts of voltage and current at the radio frequencies, which in the present wireless communication standards are in the range of giga-hertz. Therefore, a good understanding of many aspects related to RF PA design is necessary. Theoretical analysis of the communication system, nonlinear effects of the PA, as well as the impedance matching network is systematically presented. The analysis of the nonlinear effects proposes a formal mathematical description of the multitone nonlinearity, and through its relationship with two-tone test, the proposed PA design methodology would greatly reduce the design time while improving the design accuracy. A thorough analysis of the available architecture and design techniques for efficiency and linearity enhancement of RF PA shows that despite tremendous amounts of research and development into this topic, the fundamental tradeoff between the two still limits the RF PA implementation largely within SiGe, GaAs, and InP technologies. A RF PA for Wideband Code-Division Multiple Access (WCDMA) application standard is proposed, designed, and implemented in CMOS that demonstrates the proposed segmentation technique that resolved the main tradeoff between power efficiency and linearity. The innovative architecture developed in this work is not limited to applications in the WCDMA communication protocol or the CMOS technology, although CMOS implementation would take advantage of the readily available digital resources

A review of technologies and design techniques of millimeter-wave power amplifiers

his article reviews the state-of-the-art millimeter-wave (mm-wave) power amplifiers (PAs), focusing on broadband design techniques. An overview of the main solid-state technologies is provided, including Si, gallium arsenide (GaAs), GaN, and other III-V materials, and both field-effect and bipolar transistors. The most popular broadband design techniques are introduced, before critically comparing through the most relevant design examples found in the scientific literature. Given the wide breadth of applications that are foreseen to exploit the mm-wave spectrum, this contribution will represent a valuable guide for designers who need a single reference before adventuring in the challenging task of the mm-wave PA design