Arbitrated address event representation digital image sensor

80×60 (1/8 VGA) address event imager in 0.6 μm CMOS converts light intensity into a one-bit code (a spike). The read-out of each spike is initiated by the pixel. The dynamic range is 200 dB for a pixel and 120 dB for the array. It uses 3.4 mW at a spike rate of 200 kHz. It is capable of 8.3 k effective frames/s

A high dynamic range digital LinLog CMOS image sensor architecture based on Event Readout of pixels and suitable for low voltage operation

Several approaches have been developed to extend the dynamic range of image sensor in order to keep all the information content of natural scenes covering a very broad range of illumination. Digital CMOS image sensor are especially well suited to wide dynamic range imaging by implementing dual sampling, multiple exposure methods using either column or in pixel ADC, or Address Event Representation. A new architecture of digital high dynamic range CMOS image sensor, suitable for low voltage operation, has been developed that implements a built-in dynamic compression function targeted to LinLog behavior, by combining an event based readout of pixels, the use of multiple integrations per frame and the coding of pixel values using the mantissa-exponent principle, to achieve the dynamic range extension

Sun Sensor Based on a Luminance Spiking Pixel Array

We present a novel sun sensor concept. It is the very first sun sensor built with an address event representation spiking pixel matrix. Its pixels spike with a frequency proportional to illumination. It offers remarkable advantages over conventional digital sun sensors based on active pixel sensor (APS) pixels. Its output data flow is quite reduced. It is possible to resolve the sun position just receiving one single event operating in time-to-first-spike mode. It operates with a latency in the order of milliseconds. It has higher dynamic range than APS image sensors (higher than 100 dB). A custom algorithm to compute the centroid of the illuminated pixels is presented. Experimental results are provided.Universidad de Cádiz PR2016-072Ministerio de Economía y Competitividad TEC2015-66878-C3-1-RJunta de Andalucía TIC 2012- 2338Office of Naval Research (USA) N00014141035

A spatial contrast retina with on-chip calibration for neuromorphic spike-based AER vision systems

We present a 32 32 pixels contrast retina microchip that provides its output as an address event representation (AER) stream. Spatial contrast is computed as the ratio between pixel photocurrent and a local average between neighboring pixels obtained with a diffuser network. This current-based computation produces an important amount of mismatch between neighboring pixels, because the currents can be as low as a few pico-amperes. Consequently, a compact calibration circuitry has been included to trimm each pixel. Measurements show a reduction in mismatch standard deviation from 57% to 6.6% (indoor light). The paper describes the design of the pixel with its spatial contrast computation and calibration sections. About one third of pixel area is used for a 5-bit calibration circuit. Area of pixel is 58 m 56 m, while its current consumption is about 20 nA at 1-kHz event rate. Extensive experimental results are provided for a prototype fabricated in a standard 0.35- m CMOS process.Gobierno de España TIC2003-08164-C03-01, TEC2006-11730-C03-01European Union IST-2001-3412

Low-power CMOS digital-pixel Imagers for high-speed uncooled PbSe IR applications

This PhD dissertation describes the research and development of a new low-cost medium wavelength infrared MWIR monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapour phase deposition (VPD) PbSe-based medium wavelength IR (MWIR) detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. The work supports on the hypothesis that, by the use of the preceding design techniques, current standard inexpensive CMOS technologies fulfill all operational requirements of the VPD PbSe detector in terms of connectivity, reliability, functionality and scalability to integrate the device. The resulting monolithic PbSe-CMOS camera must consume very low power, operate at kHz frequencies, exhibit good uniformity and fit the CMOS read-out active pixels in the compact pitch of the focal plane, all while addressing the particular characteristics of the MWIR detector: high dark-to-signal ratios, large input parasitic capacitance values and remarkable mismatching in PbSe integration. In order to achieve these demands, this thesis proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation. The main aim is to potentiate the integration of PbSe-based infra-red (IR)-image sensing technologies so as to widen its use, not only in distinct scenarios, but also at different stages of PbSe-CMOS integration maturity. For this purpose, we posit to investigate a comprehensive set of functional blocks distributed in two parallel approaches: • Frame-based “Smart” MWIR imaging based on new DPS circuit topologies with gain and offset FPN correction capabilities. This research line exploits the detector pitch to offer fully-digital programmability at pixel level and complete functionality with input parasitic capacitance compensation and internal frame memory. • Frame-free “Compact”-pitch MWIR vision based on a novel DPS lossless analog integrator and configurable temporal difference, combined with asynchronous communication protocols inside the focal plane. This strategy is conceived to allow extensive pitch compaction and readout speed increase by the suppression of in-pixel digital filtering, and the use of dynamic bandwidth allocation in each pixel of the FPA. In order make the electrical validation of first prototypes independent of the expensive PbSe deposition processes at wafer level, investigation is extended as well to the development of affordable sensor emulation strategies and integrated test platforms specifically oriented to image read-out integrated circuits. DPS cells, imagers and test chips have been fabricated and characterized in standard 0.15μm 1P6M, 0.35μm 2P4M and 2.5μm 2P1M CMOS technologies, all as part of research projects with industrial partnership. The research has led to the first high-speed uncooled frame-based IR quantum imager monolithically fabricated in a standard VLSI CMOS technology, and has given rise to the Tachyon series [1], a new line of commercial IR cameras used in real-time industrial, environmental and transportation control systems. The frame-free architectures investigated in this work represent a firm step forward to push further pixel pitch and system bandwidth up to the limits imposed by the evolving PbSe detector in future generations of the device.La present tesi doctoral descriu la recerca i el desenvolupament d'una nova tecnologia monolítica d'imatgeria infraroja de longitud d'ona mitja (MWIR), no refrigerada i de baix cost, per a usos industrials d'alta velocitat. El treball pren el relleu dels últims avenços assolits pel soci industrial NIT S.L. en el camp dels detectors MWIR de PbSe depositats en fase vapor (VPD), afegint-hi coneixement fonamental en la investigació de noves tècniques de disseny de circuits VLSI analògics i mixtes pel desenvolupament del dispositiu integrat de lectura unit al detector pixelat. Es parteix de la hipòtesi que, mitjançant l'ús de les esmentades tècniques de disseny, les tecnologies CMOS estàndard satisfan tots els requeriments operacionals del detector VPD PbSe respecte a connectivitat, fiabilitat, funcionalitat i escalabilitat per integrar de forma econòmica el dispositiu. La càmera PbSe-CMOS resultant ha de consumir molt baixa potència, operar a freqüències de kHz, exhibir bona uniformitat, i encabir els píxels actius CMOS de lectura en el pitch compacte del pla focal de la imatge, tot atenent a les particulars característiques del detector: altes relacions de corrent d'obscuritat a senyal, elevats valors de capacitat paràsita a l'entrada i dispersions importants en el procés de fabricació. Amb la finalitat de complir amb els requisits previs, es proposen arquitectures de sensors de visió de molt baix acoblament interpíxel basades en l'ús d'una matriu de pla focal (FPA) de píxels actius exclusivament digitals. Cada píxel sensor digital (DPS) està equipat amb mòduls de comunicació d'alta velocitat, autopolarització, cancel·lació de l'offset, conversió analògica-digital (ADC) i correcció del soroll de patró fixe (FPN). El consum en cada cel·la es minimitza fent un ús exhaustiu del MOSFET operant en subllindar. L'objectiu últim és potenciar la integració de les tecnologies de sensat d'imatge infraroja (IR) basades en PbSe per expandir-ne el seu ús, no només a diferents escenaris, sinó també en diferents estadis de maduresa de la integració PbSe-CMOS. En aquest sentit, es proposa investigar un conjunt complet de blocs funcionals distribuïts en dos enfocs paral·lels: - Dispositius d'imatgeria MWIR "Smart" basats en frames utilitzant noves topologies de circuit DPS amb correcció de l'FPN en guany i offset. Aquesta línia de recerca exprimeix el pitch del detector per oferir una programabilitat completament digital a nivell de píxel i plena funcionalitat amb compensació de la capacitat paràsita d'entrada i memòria interna de fotograma. - Dispositius de visió MWIR "Compact"-pitch "frame-free" en base a un novedós esquema d'integració analògica en el DPS i diferenciació temporal configurable, combinats amb protocols de comunicació asíncrons dins del pla focal. Aquesta estratègia es concep per permetre una alta compactació del pitch i un increment de la velocitat de lectura, mitjançant la supressió del filtrat digital intern i l'assignació dinàmica de l'ample de banda a cada píxel de l'FPA. Per tal d'independitzar la validació elèctrica dels primers prototips respecte a costosos processos de deposició del PbSe sensor a nivell d'oblia, la recerca s'amplia també al desenvolupament de noves estratègies d'emulació del detector d'IR i plataformes de test integrades especialment orientades a circuits integrats de lectura d'imatge. Cel·les DPS, dispositius d'imatge i xips de test s'han fabricat i caracteritzat, respectivament, en tecnologies CMOS estàndard 0.15 micres 1P6M, 0.35 micres 2P4M i 2.5 micres 2P1M, tots dins el marc de projectes de recerca amb socis industrials. Aquest treball ha conduït a la fabricació del primer dispositiu quàntic d'imatgeria IR d'alta velocitat, no refrigerat, basat en frames, i monolíticament fabricat en tecnologia VLSI CMOS estàndard, i ha donat lloc a Tachyon, una nova línia de càmeres IR comercials emprades en sistemes de control industrial, mediambiental i de transport en temps real.Postprint (published version

Smart Sensor Networks For Sensor-Neural Interface

One in every fifty Americans suffers from paralysis, and approximately 23% of paralysis cases are caused by spinal cord injury. To help the spinal cord injured gain functionality of their paralyzed or lost body parts, a sensor-neural-actuator system is commonly used. The system includes: 1) sensor nodes, 2) a central control unit, 3) the neural-computer interface and 4) actuators. This thesis focuses on a sensor-neural interface and presents the research related to circuits for the sensor-neural interface. In Chapter 2, three sensor designs are discussed, including a compressive sampling image sensor, an optical force sensor and a passive scattering force sensor. Chapter 3 discusses the design of the analog front-end circuit for the wireless sensor network system. A low-noise low-power analog front-end circuit in 0.5μm CMOS technology, a 12-bit 1MS/s successive approximation register (SAR) analog-to-digital converter (ADC) in 0.18μm CMOS process and a 6-bit asynchronous level-crossing ADC realized in 0.18μm CMOS process are presented. Chapter 4 shows the design of a low-power impulse-radio ultra-wide-band (IR-UWB) transceiver (TRx) that operates at a data rate of up to 10Mbps, with a power consumption of 4.9pJ/bit transmitted for the transmitter and 1.12nJ/bit received for the receiver. In Chapter 5, a wireless fully event-driven electrogoniometer is presented. The electrogoniometer is implemented using a pair of ultra-wide band (UWB) wireless smart sensor nodes interfacing with low power 3-axis accelerometers. The two smart sensor nodes are configured into a master node and a slave node, respectively. An experimental scenario data analysis shows higher than 90% reduction of the total data throughput using the proposed fully event-driven electrogoniometer to measure joint angle movements when compared with a synchronous Nyquist-rate sampling system. The main contribution of this thesis includes: 1) the sensor designs that emphasize power efficiency and data throughput efficiency; 2) the fully event-driven wireless sensor network system design that minimizes data throughput and optimizes power consumption

CMOS IMAGE SENSORS FOR LAB-ON-A-CHIP MICROSYSTEM DESIGN

The work described herein serves as a foundation for the development of CMOS imaging in lab-on-a-chip microsystems. Lab-on-a-chip (LOC) systems attempt to emulate the functionality of a cell biology lab by incorporating multiple sensing modalidites into a single microscale system. LOC are applicable to drug development, implantable sensors, cell-based bio-chemical detectors and radiation detectors. The common theme across these systems is achieving performance under severe resource constraints including noise, bandwidth, power and size. The contributions of this work are in the areas of two core lab-on-a-chip imaging functions: object detection and optical measurements

Address-Event Based Stereo Vision with Bio-Inspired Silicon Retina Imagers

Artificial intelligenc

A Wide Linear Dynamic Range Image Sensor Based on Asynchronous Self-Reset and Tagging of Saturation Events

We report a high dynamic range (HDR) image sensor with a linear response that overcomes some of the limitations of sensors with pixels with self-reset operation. It operates similar to an active pixel sensor, but its pixels have a novel asynchronous event-based overflow detection mechanism. Whenever the pixel voltages at the integration capacitance reach a programmable threshold, the pixels self-reset and send out asynchronously an event indicating this. At the end of the integration period, the voltage at the integration capacitance is digitized and readout. Combining this information with the number of events fired by each pixel, it is possible to render linear HDR images. Event operation is transparent to the final user. There is no limitation for the number of self-resets of each pixel. The output data format is compatible with frame-based devices. The sensor was fabricated in the AMS 0.18- μm HV technology. A detailed system description and experimental results are provided in this paper. The sensor can render images with an intra-scene dynamic range of up to 130 dB with linear outputs. The pixels' pitch is 25 μm and the sensor power consumption is 58.6 mW.Universidad de Cádiz PR2016-072Ministerio de Economía y Competitividad TEC2015-66878-C3-1-RJunta de Andalucía TIC 2012-2338Office of Naval Research (USA) N00014141035

A spatial contrast retina with on-chip calibration for neuromorphic spike-based AER vision systems

We present a 32 32 pixels contrast retina microchip that provides its output as an address event representation (AER) stream. Spatial contrast is computed as the ratio between pixel photocurrent and a local average between neighboring pixels obtained with a diffuser network. This current-based computation produces an important amount of mismatch between neighboring pixels, because the currents can be as low as a few pico-amperes. Consequently, a compact calibration circuitry has been included to trimm each pixel. Measurements show a reduction in mismatch standard deviation from 57% to 6.6% (indoor light). The paper describes the design of the pixel with its spatial contrast computation and calibration sections. About one third of pixel area is used for a 5-bit calibration circuit. Area of pixel is 58 m 56 m, while its current consumption is about 20 nA at 1-kHz event rate. Extensive experimental results are provided for a prototype fabricated in a standard 0.35- m CMOS process.This work was supported by Spanish Research Grants TIC2003-08164-C03-01 (SAMANTA), TEC2006-11730-C03-01 (SAMANTA-II), and EU grant IST-2001-34124 (CAVIAR). JCS was supported by the I3P program of the Spanish Research Council. RSG was supported by a national grant from the Spanish Ministry of Education and Science.Peer reviewe