177,890 research outputs found

    Performance Analysis of Two-Hop Cooperative MIMO transmission with Relay Selection in Rayleigh Fading Channel

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    Wireless relaying is one of the promising solutions to overcome the channel impairments and provide high data rate coverage that appears for beyond 3G mobile communications. In this paper we present an end to end BER performance analysis of dual hop wireless communication systems equipped with multiple decode and forward relays over the Rayleigh fading channel with relay selection. We select the best relay based on end to end channel conditions. We apply orthogonal space time block coding (OSTBC) at source, and also present how the multiple antennas at the source terminal affects the end to end BER performance. This intermediate relay technique will cover long distance where destination is out of reach from source.Comment: 5 figures, 4th International Conference on Wireless Communications, Networking and Mobile Computing, 2008. WiCOM '0

    MODLEACH: A Variant of LEACH for WSNs

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    Wireless sensor networks are appearing as an emerging need for mankind. Though, Such networks are still in research phase however, they have high potential to be applied in almost every field of life. Lots of research is done and a lot more is awaiting to be standardized. In this work, cluster based routing in wireless sensor networks is studied precisely. Further, we modify one of the most prominent wireless sensor network's routing protocol "LEACH" as modified LEACH (MODLEACH) by introducing \emph{efficient cluster head replacement scheme} and \emph{dual transmitting power levels}. Our modified LEACH, in comparison with LEACH out performs it using metrics of cluster head formation, through put and network life. Afterwards, hard and soft thresholds are implemented on modified LEACH (MODLEACH) that boast the performance even more. Finally a brief performance analysis of LEACH, Modified LEACH (MODLEACH), MODLEACH with hard threshold (MODLEACHHT) and MODLEACH with soft threshold (MODLEACHST) is undertaken considering metrics of throughput, network life and cluster head replacements.Comment: IEEE 8th International Conference on Broadband and Wireless Computing, Communication and Applications (BWCCA'13), Compiegne, Franc

    Scale up your In-Memory Accelerator: Leveraging Wireless-on-Chip Communication for AIMC-based CNN Inference

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    Analog In-Memory Computing (AIMC) is emerging as a disruptive paradigm for heterogeneous computing, potentially delivering orders of magnitude better peak performance and efficiency over traditional digital signal processing architectures on Matrix-Vector multiplication. However, to sustain this throughput in real-world applications, AIMC tiles must be supplied with data at very high bandwidth and low latency; this poses an unprecedented pressure on the on-chip communication infrastructure, which becomes the system's performance and efficiency bottleneck. In this context, the performance and plasticity of emerging on-chip wireless communication paradigms provide the required breakthrough to up-scale on-chip communication in large AIMC devices. This work presents a many-tile AIMC architecture with inter-tile wireless communication that integrates multiple heterogeneous computing clusters, embedding a mix of parallel RISC-V cores and AIMC tiles. We perform an extensive design space exploration of the proposed architecture and discuss the benefits of exploiting emerging on-chip communication technologies such as wireless transceivers in the millimeter-wave and terahertz band

    Modeling Probability of Path Loss for DSDV, OLSR and DYMO above 802.11 and 802.11p

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    This paper presents path loss model along with framework for probability distribution function for VANETs. Furthermore, we simulate three routing protocols Destination Sequenced Distance Vector (DSDV), Optimized Link State Routing (OLSR) and Dynamic MANET On-demand (DYMO) in NS-2 to evaluate and compare their performance using two Mac-layer Protocols 802.11 and 802.11p. A novel approach of this work is modifications in existing parameters to achieve high efficiency. After extensive simulations, we observe that DSDV out performs with 802.11p while DYMO gives best performance with 802.11.Comment: IEEE 8th International Conference on Broadband and Wireless Computing, Communication and Applications (BWCCA'13), Compiegne, Franc

    Wireless Interconnects for Intra-chip & Inter-chip Transmission

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    With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6’’ silicon wafer with resistivity of 55Ω-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different configurations of antenna orientations and coolants. The return loss and transmission coefficients are simulated using ANSYS HFSS

    Wearable Communications in 5G: Challenges and Enabling Technologies

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    As wearable devices become more ingrained in our daily lives, traditional communication networks primarily designed for human being-oriented applications are facing tremendous challenges. The upcoming 5G wireless system aims to support unprecedented high capacity, low latency, and massive connectivity. In this article, we evaluate key challenges in wearable communications. A cloud/edge communication architecture that integrates the cloud radio access network, software defined network, device to device communications, and cloud/edge technologies is presented. Computation offloading enabled by this multi-layer communications architecture can offload computation-excessive and latency-stringent applications to nearby devices through device to device communications or to nearby edge nodes through cellular or other wireless technologies. Critical issues faced by wearable communications such as short battery life, limited computing capability, and stringent latency can be greatly alleviated by this cloud/edge architecture. Together with the presented architecture, current transmission and networking technologies, including non-orthogonal multiple access, mobile edge computing, and energy harvesting, can greatly enhance the performance of wearable communication in terms of spectral efficiency, energy efficiency, latency, and connectivity.Comment: This work has been accepted by IEEE Vehicular Technology Magazin
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