Materials and processes issues in fine pitch eutectic solder flip chip interconnection

New product designs within the electronics packaging industry continue to demand interconnects at shrinking geometry, both at the integrated circuit and supporting circuit board substrate level, thereby creating numerous manufacturing challenges. Flip chip on board (FCOB) applications are currently being driven by the need for reduced manufacturing costs and higher volume robust production capability. One of today’s low cost FCOB solutions has emerged as an extension of the existing infrastructure for surface mount technology and combines an under bump metallization (UBM) with a stencil printing solder bumping process, to generate mechanically robust joint structures with low electrical resistance between chip and board. Although electroless Ni plating of the UBM, and stencil printing for solder paste deposition have been widely used in commercial industrial applications, there still exists a number of technical issues related to these materials and processes as the joint geometry is further reduced. This paper reports on trials with electroless Ni plating and stencil paste printing and the correlation between process variables in the formation of bumps and the shear strength of said bumps at different geometries. The effect of precise control of tolerances in squeegees, stencils and wafer fixtures was examined to enable the optimization of the materials, processes, and tooling for reduction of bumping defects

JTEC Panel report on electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

W. M. Keck Foundation - 1999 Annual Report: Promising Directions

Contains president's message, summary of roundtable discussions with scientists on the potential for and the impediments to future research in science, engineering, and biomedicine, and list of board members and staff

Power-Scavenging MEMS Robots

This thesis includes the design, modeling, and testing of novel, power-scavenging, biologically inspired MEMS microrobots. Over one hundred 500-μm and 990-μm microrobots with two, four, and eight wings were designed, fabricated, characterized. These microrobots constitute the smallest documented attempt at powered flight. Each microrobot wing is comprised of downward-deflecting, laser-powered thermal actuators made of gold and polysilicon; the microrobots were fabricated in PolyMUMPs® (Polysilicon Multi-User MEMS Processes). Characterization results of the microrobots illustrate how wing-tip deflection can be maximized by optimizing the gold-topolysilicon ratio as well as the dimensions of the actuator-wings. From these results, an optimum actuator-wing configuration was identified. It also was determined that the actuator-wing configuration with maximum deflection and surface area yet minimum mass had the greatest lift-to-weight ratio. Powered testing results showed that the microrobots successfully scavenged power from a remote 660-nm laser. These microrobots also demonstrated rapid downward flapping, but none achieved flight. The results show that the microrobots were too heavy and lacked sufficient wing surface area. It was determined that a successfully flying microrobot can be achieved by adding a robust, light-weight material to the optimum actuator-wing configuration—similar to insect wings. The ultimate objective of the flying microrobot project is an autonomous, fully maneuverable flying microrobot that is capable of sensing and acting upon a target. Such a microrobot would be capable of precise lethality, accurate battle-damage assessment, and successful penetration of otherwise inaccessible targets

DIGITAL MUSEUM TECHNOLOGY FOR WORCESTER’S INDUSTRIAL HISTORY

Working alongside the Worcester Historical Museum (WHM), our group collected historical and technological information to aid the reconstruction of the Fuller Industrial History Gallery. Experts, scholarly literature, and digital platforms were surveyed to ascertain modern digital methods of museum display. This report also presents potential new artifacts for the Gallery with information regarding the evolution of the wire and metal trades industries especially Morgan Construction in the early 20th century and Kinefac in the late 20th and early 21st centuries. This IQP provides recommendations on smart technologies and industrial artifacts for inclusion in the renovated Gallery

The Hilltop 12-4-1998

https://dh.howard.edu/hilltop_902000/1228/thumbnail.jp