A parallel algorithm for switch-level timing simulation on a hypercube multiprocessor

The parallel approach to speeding up simulation is studied, specifically the simulation of digital LSI MOS circuitry on the Intel iPSC/2 hypercube. The simulation algorithm is based on RSIM, an event driven switch-level simulator that incorporates a linear transistor model for simulating digital MOS circuits. Parallel processing techniques based on the concepts of Virtual Time and rollback are utilized so that portions of the circuit may be simulated on separate processors, in parallel for as large an increase in speed as possible. A partitioning algorithm is also developed in order to subdivide the circuit for parallel processing

A fault-tolerant multiprocessor architecture for aircraft, volume 1

A fault-tolerant multiprocessor architecture is reported. This architecture, together with a comprehensive information system architecture, has important potential for future aircraft applications. A preliminary definition and assessment of a suitable multiprocessor architecture for such applications is developed

Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board

High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a useful analysis on mathematical approach which can be implemented to predict thermal behavior in Integrated Circuit (IC). The problem could be modeled as heat conduction equation. In this study, numerical approaches based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing heat conduction equation. From the numerical results obtained, it shows that AM method solves the governing heat conduction equation with minimum number of iterations and fastest computational time compared to the Gauss-Seidel (GS) method. It is in design phase when simulations and modeling are carried out to ensure high performance and reliability. The availability of thermal analysis tool for maximum temperature prediction would be of great value to designers of power device ICs

Parallel 3D Finite Element Power Semiconductor Device Simulator Based on Topologically Rectangular Grid

Eere we report on the development of a new parallel, scalable and portable 3D f ~ t e element power semiconductor device simulator. The emphasis in the design of this simulator is placed on the FE grid generation, on the optimised parallel generation and assembly of the discretization mahices, and on the development of a suitable, scalable linear solvers. For discretization use topologically rectangular FE grid based on non-rectangular bricks.

Center for Space Microelectronics Technology 1988-1989 technical report

The 1988 to 1989 Technical Report of the JPL Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center. Listed are 321 publications, 282 presentations, and 140 new technology reports and patents

Radiation-Induced Error Criticality in Modern HPC Parallel Accelerators

In this paper, we evaluate the error criticality of radiation-induced errors on modern High-Performance Computing (HPC) accelerators (Intel Xeon Phi and NVIDIA K40) through a dedicated set of metrics. We show that, as long as imprecise computing is concerned, the simple mismatch detection is not sufficient to evaluate and compare the radiation sensitivity of HPC devices and algorithms. Our analysis quantifies and qualifies radiation effects on applications’ output correlating the number of corrupted elements with their spatial locality. Also, we provide the mean relative error (dataset-wise) to evaluate radiation-induced error magnitude. We apply the selected metrics to experimental results obtained in various radiation test campaigns for a total of more than 400 hours of beam time per device. The amount of data we gathered allows us to evaluate the error criticality of a representative set of algorithms from HPC suites. Additionally, based on the characteristics of the tested algorithms, we draw generic reliability conclusions for broader classes of codes. We show that arithmetic operations are less critical for the K40, while Xeon Phi is more reliable when executing particles interactions solved through Finite Difference Methods. Finally, iterative stencil operations seem the most reliable on both architectures.This work was supported by the STIC-AmSud/CAPES scientific cooperation program under the EnergySFE research project grant 99999.007556/2015-02, EU H2020 Programme, and MCTI/RNP-Brazil under the HPC4E Project, grant agreement n° 689772. Tested K40 boards were donated thanks to Steve Keckler, Timothy Tsai, and Siva Hari from NVIDIA.Postprint (author's final draft

Intelligent Embedded Software: New Perspectives and Challenges

Intelligent embedded systems (IES) represent a novel and promising generation of embedded systems (ES). IES have the capacity of reasoning about their external environments and adapt their behavior accordingly. Such systems are situated in the intersection of two different branches that are the embedded computing and the intelligent computing. On the other hand, intelligent embedded software (IESo) is becoming a large part of the engineering cost of intelligent embedded systems. IESo can include some artificial intelligence (AI)-based systems such as expert systems, neural networks and other sophisticated artificial intelligence (AI) models to guarantee some important characteristics such as self-learning, self-optimizing and self-repairing. Despite the widespread of such systems, some design challenging issues are arising. Designing a resource-constrained software and at the same time intelligent is not a trivial task especially in a real-time context. To deal with this dilemma, embedded system researchers have profited from the progress in semiconductor technology to develop specific hardware to support well AI models and render the integration of AI with the embedded world a reality