Technology and layout-related testing of static random-access memories

Static random-access memories (SRAMs) exhibit faults that are electrical in nature. Functional and electrical testing are performed to diagnose faulty operation. These tests are usually designed from simple fault models that describe the chip interface behavior without a thorough analysis of the chip layout and technology. However, there are certain technology and layout-related defects that are internal to the chip and are mostly time-dependent in nature. The resulting failures may or may not seriously degrade the input/output interface behavior. They may show up as electrical faults (such as a slow access fault) and/or functional faults (such as a pattern sensitive fault). However, these faults cannot be described properly with the functional fault models because these models do not take timing into account. Also, electrical fault models that describe merely the input/output interface behavior are inadequate to characterize every possible defect in the basic SRAM cell. Examples of faults produced by these defects are: (a) static data loss, (b) abnormally high currents drawn from the power supply, etc. Generating tests for such faults often requires a thorough understanding and analysis of the circuit technology and layout. In this article, we shall examine ways to characterize and test such faults. We shall divide such faults into two categories depending on the types of SRAMs they effect—silicon SRAMs and GaAs SRAMs.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/43015/1/10836_2004_Article_BF00972519.pd

Submicron Systems Architecture Project : Semiannual Technical Report

The Mosaic C is an experimental fine-grain multicomputer based on single-chip nodes. The Mosaic C chip includes 64KB of fast dynamic RAM, processor, packet interface, ROM for bootstrap and self-test, and a two-dimensional selftimed router. The chip architecture provides low-overhead and low-latency handling of message packets, and high memory and network bandwidth. Sixty-four Mosaic chips are packaged by tape-automated bonding (TAB) in an 8 x 8 array on circuit boards that can, in turn, be arrayed in two dimensions to build arbitrarily large machines. These 8 x 8 boards are now in prototype production under a subcontract with Hewlett-Packard. We are planning to construct a 16K-node Mosaic C system from 256 of these boards. The suite of Mosaic C hardware also includes host-interface boards and high-speed communication cables. The hardware developments and activities of the past eight months are described in section 2.1. The programming system that we are developing for the Mosaic C is based on the same message-passing, reactive-process, computational model that we have used with earlier multicomputers, but the model is implemented for the Mosaic in a way that supports finegrain concurrency. A process executes only in response to receiving a message, and may in execution send messages, create new processes, and modify its persistent variables before it either exits or becomes dormant in preparation for receiving another message. These computations are expressed in an object-oriented programming notation, a derivative of C++ called C+-. The computational model and the C+- programming notation are described in section 2.2. The Mosaic C runtime system, which is written in C+-, provides automatic process placement and highly distributed management of system resources. The Mosaic C runtime system is described in section 2.3

The 1992 4th NASA SERC Symposium on VLSI Design

Papers from the fourth annual NASA Symposium on VLSI Design, co-sponsored by the IEEE, are presented. Each year this symposium is organized by the NASA Space Engineering Research Center (SERC) at the University of Idaho and is held in conjunction with a quarterly meeting of the NASA Data System Technology Working Group (DSTWG). One task of the DSTWG is to develop new electronic technologies that will meet next generation electronic data system needs. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The NASA SERC is proud to offer, at its fourth symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories, the electronics industry, and universities. These speakers share insights into next generation advances that will serve as a basis for future VLSI design

State of the art survey of technologies applicable to NASA's aeronautics, avionics and controls program

The state of the art survey (SOAS) covers six technology areas including flightpath management, aircraft control system, crew station technology, interface & integration technology, military technology, and fundamental technology. The SOAS included contributions from over 70 individuals in industry, government, and the universities

Space station data system analysis/architecture study. Task 2: Options development DR-5. Volume 1: Technology options

The second task in the Space Station Data System (SSDS) Analysis/Architecture Study is the development of an information base that will support the conduct of trade studies and provide sufficient data to make key design/programmatic decisions. This volume identifies the preferred options in the technology category and characterizes these options with respect to performance attributes, constraints, cost, and risk. The technology category includes advanced materials, processes, and techniques that can be used to enhance the implementation of SSDS design structures. The specific areas discussed are mass storage, including space and round on-line storage and off-line storage; man/machine interface; data processing hardware, including flight computers and advanced/fault tolerant computer architectures; and software, including data compression algorithms, on-board high level languages, and software tools. Also discussed are artificial intelligence applications and hard-wire communications

Application of advanced technology to space automation

Automated operations in space provide the key to optimized mission design and data acquisition at minimum cost for the future. The results of this study strongly accentuate this statement and should provide further incentive for immediate development of specific automtion technology as defined herein. Essential automation technology requirements were identified for future programs. The study was undertaken to address the future role of automation in the space program, the potential benefits to be derived, and the technology efforts that should be directed toward obtaining these benefits

The 1991 3rd NASA Symposium on VLSI Design

Papers from the symposium are presented from the following sessions: (1) featured presentations 1; (2) very large scale integration (VLSI) circuit design; (3) VLSI architecture 1; (4) featured presentations 2; (5) neural networks; (6) VLSI architectures 2; (7) featured presentations 3; (8) verification 1; (9) analog design; (10) verification 2; (11) design innovations 1; (12) asynchronous design; and (13) design innovations 2

NASA Space Engineering Research Center Symposium on VLSI Design

The NASA Space Engineering Research Center (SERC) is proud to offer, at its second symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories and the electronics industry. These featured speakers share insights into next generation advances that will serve as a basis for future VLSI design. Questions of reliability in the space environment along with new directions in CAD and design are addressed by the featured speakers

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification