Glass Patterning: Technologies and Applications

In this work, we review the progress in recent studies on glass patterning including technologies and applications. Four technologies for glass micromachining including wet etching, sandblasting, reactive ion etching, and glass reflow process are analyzed. Advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Various microsystem applications using the above glass patterning technologies like thermal sensors, hermetically packaged capacitive silicon resonators, optical modulator devices, glass microfluidics, micro-heaters, and vacuum-sealed capacitive micromachined ultrasonic transducer arrays are reported

Foldable substrates for micro-ultrasonic transducers

Ultrasound has broad range of applications from underwater examination, nondestructive testing of materials and medical diagnosis and treatment. The ultrasonic transducer plays an vital role in determining the resolution, sensitivity, as well as other diagnostic capabilities of an ultrasonic imaging system. Current piezoelectric transducer which dominates the medical field has limited applications compared to the capacitive ultrasonic transducer. The capacitive transducer is easy to fabricate compared to the piezoelectric transducer. In this work, the fabrication of a foldable substrate for a capacitive ultrasonic transducer has been discussed. The foldable substrate was fabricated using an ultrathin silicon wafer which is 50 µm thick by using the principle of polymer shrinkage. It is believed that the foldable substrate can be used in intravascular ultrasound (IVUS) and endoscopic ultrasound (EUS) applications for next generation biomedical imaging

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Fabrication of Capacitive Micromachined Ultrasonic Transducers based on Adhesive Wafer Bonding

Capacitive micromachined ultrasonic transducers (CMUTs) can be used for medical imaging, non-destructive testing or medical treatment applications. It can also be used as gravimetric sensors for gas sensing or immersion bio-sensing. Although various CMUT fabrication methods have been reported, there are still many challenges to address. Conventional fabrication methods can be categorized as either surface micromachining or the wafer bonding method. These methods have design trade-offs and limitations associated with process complexity, structural parameter optimization and wafer materials selection. For example, surface micromachining approaches can suffer from complicated fabrication processes. In addition, structural parameters cannot be fully optimized due to feasibility concerns during fabrication. In contrast, the development of wafer bonding techniques enabled CMUTs to be fabricated in a straightforward way and structural parameters can be easily optimized when compared with a surface micromachining approach. However, the yield of the traditional wafer bonded CMUTs is very sensitive to contaminations and the surface quality at the bonding interface. Although the difficulties of the wafer bonding process are not always reported, they definitely exist for every researcher who wants to fabricate their own CMUTs. As a result, this dissertation work aims to develop a CMUT fabrication process with fewer fabrication constraints, low-cost and low process temperature for CMOS integration. The developed CMUT fabrication processes reported in the thesis applied photosensitive polymer adhesive for wafer bonding in order to make a process with good tolerance to contaminations and defects on the wafer surface, present a wide range of material selection at the bonding interface and require low process temperature (less than 250°C). These features can benefit CMUT fabrication with increased yield better design flexibility and lower cost. Having maximum process temperature of 250°C, the developed processes can also be CMOS compatible. Furthermore, a novel CMUT structure, which can only be achieved by the reported technique, was developed showing more than doubled ultrasound receive sensitivity when compared with conventional CMUT structures. The fabrication processes were developed systematically and the details of process development will be presented in this thesis

Fiber inline pressure and acoustic sensor fabricated with femtosecond laser

Pressure and acoustic measurements are required in many industrial applications such as down-hole oil well monitoring, structural heath monitoring, engine monitoring, study of aerodynamics, etc. Conventional sensors are difficult to apply due to the high temperature, electromagnetic-interference noise and limited space in such environments. Fiber optic sensors have been developed since the last century and have proved themselves good candidates in such harsh environment. This dissertation aims to design, develop and demonstrate miniaturized fiber pressure/acoustic sensors for harsh environment applications through femtosecond laser fabrication. Working towards this objective, the dissertation explored two types of fiber inline microsensors fabricated by femtosecond laser: an extrinsic Fabry-Perot interferometric (EFPI) sensor with silica diaphragm for pressure/acoustic sensing, and an intrinisic Fabry-Perot interferometer (IFPI) for temperature sensing. The scope of the dissertation work consists of device design, device modeling/simulation, laser fabrication system setups, signal processing method development and sensor performance evaluation and demonstration. This research work provides theoretical and experimental evidences that the femtosecond laser fabrication technique is a valid tool to fabricate miniaturized fiber optic pressure and temperature sensors which possess advantages over currently developed sensors --Abstract, page iii

A micromachined zipping variable capacitor

Micro-electro-mechanical systems (MEMS) have become ubiquitous in recent years and are found in a wide range of consumer products. At present, MEMS technology for radio-frequency (RF) applications is maturing steadily, and significant improvements have been demonstrated over solid-state components.A wide range of RF MEMS varactors have been fabricated in the last fifteen years. Despite demonstrating tuning ranges and quality factors that far surpass solid-state varactors, certain challenges remain. Firstly, it is difficult to scale up capacitance values while preserving a small device footprint. Secondly, many highly-tunable MEMS varactors include complex designs or process flows.In this dissertation, a new micromachined zipping variable capacitor suitable for application at 0.1 to 5 GHz is reported. The varactor features a tapered cantilever that zips incrementally onto a dielectric surface when actuated electrostatically by a pulldown electrode. Shaping the cantilever using a width function allows stable actuation and continuous capacitance tuning. Compared to existing MEMS varactors, this device has a simple design that can be implemented using a straightforward process flow. In addition, the zipping varactor is particularly suited for incorporating a highpermittivity dielectric, allowing the capacitance values and tuning range to be scaled up. This is important for portable consumer electronics where a small device footprint is attractive.Three different modelling approaches have been developed for zipping varactor design. A repeatable fabrication process has also been developed for varactors with a silicon dioxide dielectric. In proof-of-concept devices, the highest continuous tuning range is 400% (24 to 121 fF) and the measured quality factors are 123 and 69 (0.1 and 0.7 pF capacitance, respectively) at 2 GHz. The varactors have a compact design and fit within an area of 500 by 100 µm

Integrated silicon pressure sensors using wafer bonding technology

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.Includes bibliographical references (p. 151-156).by Lalitha Parameswaran.Ph.D

A micromachined zipping variable capacitor

Micro-electro-mechanical systems (MEMS) have become ubiquitous in recent years and are found in a wide range of consumer products. At present, MEMS technology for radio-frequency (RF) applications is maturing steadily, and significant improvements have been demonstrated over solid-state components. A wide range of RF MEMS varactors have been fabricated in the last fifteen years. Despite demonstrating tuning ranges and quality factors that far surpass solid-state varactors, certain challenges remain. Firstly, it is difficult to scale up capacitance values while preserving a small device footprint. Secondly, many highly-tunable MEMS varactors include complex designs or process flows. In this dissertation, a new micromachined zipping variable capacitor suitable for application at 0.1 to 5 GHz is reported. The varactor features a tapered cantilever that zips incrementally onto a dielectric surface when actuated electrostatically by a pulldown electrode. Shaping the cantilever using a width function allows stable actuation and continuous capacitance tuning. Compared to existing MEMS varactors, this device has a simple design that can be implemented using a straightforward process flow. In addition, the zipping varactor is particularly suited for incorporating a highpermittivity dielectric, allowing the capacitance values and tuning range to be scaled up. This is important for portable consumer electronics where a small device footprint is attractive. Three different modelling approaches have been developed for zipping varactor design. A repeatable fabrication process has also been developed for varactors with a silicon dioxide dielectric. In proof-of-concept devices, the highest continuous tuning range is 400% (24 to 121 fF) and the measured quality factors are 123 and 69 (0.1 and 0.7 pF capacitance, respectively) at 2 GHz. The varactors have a compact design and fit within an area of 500 by 100 μm