Enhancing Variation-aware Analog Circuits Sizing

Today's analog design and verification face significant challenges due to circuit complexity and short time-to-market windows. Moreover, variations in design parameters have an adversely impact on the correctness and performance of analog circuits. Circuit sizing consists in determining the device sizes and biasing voltages and currents such that the circuit satisfies its specifications. Traditionally, analog circuit sizing has been carried out by optimization-based methods, which of course will still be important in the future. Unfortunately, these techniques cannot guarantee an exhaustive coverage of the design search space and hence, are not able to ensure the non-existence of higher quality design solutions. The sizing problem becomes more complicated and computationally expensive under design parameters fluctuation. Indeed, existing yield analysis methods are computationally expensive and still encounter issues in problems with a high-dimensional process parameter space. In this thesis, we present new approaches for enhancing variation-aware analog circuit sizing. The circuit sizing problem is encoded using nonlinear constraints. A new algorithm using Satisfiability Modulo Theory (SMT) solving techniques exhaustively explores the analog design space and computes a continuous set of feasible sizing solutions. Next, a yield optimization stage aims to select the candidate design solution with the highest yield rate in the presence of process parameters variation. For this purpose, a novel method for the computation of parametric yield is proposed. The method combines the advantages of sparse regression and SMT solving techniques. The key idea is to characterize the failure regions as a collection of hyperrectangles in the parameters space. The yield estimation is based on a geometric calculation of probabilistic volumes subtended by the located hyperrectangles. The method can provide very large speed-up over Monte Carlo methods, when a high prediction accuracy is required. A new approach for improving analog yield optimization is also proposed. The optimization is performed in two steps. First, a global optimization phase samples the most potential optimal sub-regions of the feasible design space. The global search locates a design point near the optimal solution. Second, a local optimization phase uses the near optimal solution as a starting point. Also, it constructs linear interpolating models of the yield to explore the basin of convergence and to reach the global optimum. We illustrate the efficiency of the proposed methods on various analog circuits. The application of the yield analysis method on an integrated ring oscillator and a 6T static RAM proves that it is suitable for handling problems with tens of process parameters and can provide speedup of 5X-2000X over Monte Carlo methods. Furthermore, the application of our yield optimization methodology on the examples of a two-stage amplifier and a cascode amplifier shows that our approach can achieve higher quality in analog synthesis and unrivaled coverage of the analog design space when compared to traditional optimization techniques

Analog design for manufacturability: lithography-aware analog layout retargeting

As transistor sizes shrink over time in the advanced nanometer technologies, lithography effects have become a dominant contributor of integrated circuit (IC) yield degradation. Random manufacturing variations, such as photolithographic defect or spot defect, may cause fatal functional failures, while systematic process variations, such as dose fluctuation and defocus, can result in wafer pattern distortions and in turn ruin circuit performance. This dissertation is focused on yield optimization at the circuit design stage or so-called design for manufacturability (DFM) with respect to analog ICs, which has not yet been sufficiently addressed by traditional DFM solutions. On top of a graph-based analog layout retargeting framework, in this dissertation the photolithographic defects and lithography process variations are alleviated by geometrical layout manipulation operations including wire widening, wire shifting, process variation band (PV-band) shifting, and optical proximity correction (OPC). The ultimate objective of this research is to develop efficient algorithms and methodologies in order to achieve lithography-robust analog IC layout design without circuit performance degradation

Optimal Area Allocation for Yield Enhancement of DAC

Práce seznamuje s metodami návrhu pro zvýšení výtěžnosti a omezení chyb ve shodných strukturách. Systematické a náhodné chyby jsou shledány zdrojem neshod mezi strukturami. Je představen model náhodných chyb za využití log-normálové hustoty pravděpodobnosti. Pomocí nové metodologie založené na celočíselném pogramování (celočíselné optimalizaci) je navržena optimalizace parametrické výtěžnosti integrovaných obvodů. Je představen algoritmus generování optimální topologie. Topologie je demonstrována na R-2R D/A převodníku a výsledky jsou porovnány s jivým řešením.Recent research in yield enhancement techniques and mitigation of device mismatch is presented. Systematic and random mismatch is studied and identified as the cause of device mismatch. Model based on log-normal PDF is introduced. Optimization of IC parameter yield is suggested and conducted with help of a new methodology based on mathematical programming. An algorithm for the impact based area allocation of critical matched devices is shown as well as algorithms for common centroid layout of different sized devices. Newly developed algorithms are presented on binary weighted R-2R DAC as it is a common IC and comparison to other solutions is given

Embracing Low-Power Systems with Improvement in Security and Energy-Efficiency

As the economies around the world are aligning more towards usage of computing systems, the global energy demand for computing is increasing rapidly. Additionally, the boom in AI based applications and services has already invited the pervasion of specialized computing hardware architectures for AI (accelerators). A big chunk of research in the industry and academia is being focused on providing energy efficiency to all kinds of power hungry computing architectures. This dissertation adds to these efforts. Aggressive voltage underscaling of chips is one the effective low power paradigms of providing energy efficiency. This dissertation identifies and deals with the reliability and performance problems associated with this paradigm and innovates novel energy efficient approaches. Specifically, the properties of a low power security primitive have been improved and, higher performance has been unlocked in an AI accelerator (Google TPU) in an aggressively voltage underscaled environment. And, novel power saving opportunities have been unlocked by characterizing the usage pattern of a baseline TPU with rigorous mathematical analysis

Design and application of reconfigurable circuits and systems

Open Acces

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations