Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect

Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias (TSVs) and inter-chip interconnects. Anisotropic Conductive Film (ACF) technology is one of the low-temperature, fine-pitch interconnect method, which has been considered as a potential replacement for solder interconnects in line with continuous scaling of the interconnects in the IC industry. However, the conventional ACF materials are facing challenges to accommodate the reduced pad and pitch size due to the micro-size particles and the particle agglomeration issue. A new interconnect material - Nanowire Anisotropic Conductive Film (NW-ACF), composed of high density copper nanowires of ~ 200 nm diameter and 10-30 µm length that are vertically distributed in a polymeric template, is developed in this work to tackle the constrains of the conventional ACFs and serves as an inter-chip interconnect solution for potential three-dimensional (3D) applications

Novel fine pitch interconnection methods using metallised polymer spheres

There is an ongoing demand for electronics devices with more functionality while reducing size and cost, for example smart phones and tablet personal computers. This requirement has led to significantly higher integrated circuit input/output densities and therefore the need for off-chip interconnection pitch reduction. Flip-chip processes utilising anisotropic conductive adhesives anisotropic conductive films (ACAs/ACFs) have been successfully applied in liquid crystal display (LCD) interconnection for more than two decades. However the conflict between the need for a high particle density, to ensure sufficient the conductivity, without increasing the probability of short circuits has remained an issue since the initial utilization of ACAs/ACFs for interconnection. But this issue has become even more severe with the challenge of ultra-fine pitch interconnection. This thesis advances a potential solution to this challenge where the conductive particles typically used in ACAs are selectively deposited onto the connections ensuring conductivity without bridging. The research presented in this thesis work has been undertaken to advance the fundamental understanding of the mechanical characteristics of micro-sized metal coated polymer particles (MCPs) and their application in fine or ultra-fine pitch interconnections. This included use of a new technique based on an in-situ nanomechanical system within SEM which was utilised to study MCP fracture and failure when undergoing deformation. Different loading conditions were applied to both uncoated polymer particles and MCPs, and the in-situ system enables their observation throughout compression. The results showed that both the polymer particles and MCP display viscoelastic characteristics with clear strain-rate hardening behaviour, and that the rate of compression therefore influences the initiation of cracks and their propagation direction. Selective particle deposition using electrophoretic deposition (EPD) and magnetic deposition (MD) of Ni/Au-MCPs have been evaluated and a fine or ultra-fine pitch deposition has been demonstrated, followed by a subsequent assembly process. The MCPs were successfully positively charged using metal cations and this charging mechanism was analysed. A new theory has been proposed to explain the assembly mechanism of EPD of Ni/Au coated particles using this metal cation based charging method. The magnetic deposition experiments showed that sufficient magnetostatic interaction force between the magnetized particles and pads enables a highly selective dense deposition of particles. Successful bonding to form conductive interconnections with pre-deposited particles have been demonstrated using a thermocompression flip-chip bonder, which illustrates the applicable capability of EPD of MCPs for fine or ultra-fine pitch interconnection

Rational design of electrically conductive polymer composites for electronic packaging

Electrically conductive polymer composites, i.e. polymers filled with conductive fillers, may display a broad range of electrical properties. A rational design of fillers, filler surface chemistry and filler loading can tune the electrical properties of the composites to meet the requirements of specific applications. In this dissertation, two studies were discussed. In the first study, highly conductive composites with electrical conductivity close to that of pure metals were developed as environmentally-friendly alternatives to tin/lead solder in electronic packaging. Conventional conductive composites with silver fillers have an electrical conductivity 1~2 orders of magnitude lower than that of pure, even at filler loadings as high as 80-90 wt.%. It is found that the low conductivity of the polymer composites mainly results from the thin layer of insulating lubricant on commercial silver flakes. In this work, by modifying the functional groups in polymer backbones, the lubricant layer on silver could be chemically reduced in-situ to generate silver nanoparticles. Furthermore, these nanoparticles could sinter to form metallurgical bonds during the curing of the polymer matrix. This resulted in a significant electrical conductivity enhancement up to 10 times, without sacrificing the processability of the composite or adding extraneous steps. This method was also applied to develop highly flexible/stretchable conductors as building block for flexible/stretchable electronics. In the second study, a moderately conductive carbon/polymer composite was developed for use in sensors to monitor the thermal aging of insulation components in nuclear power plants. During thermal aging, the polymer matrix of this composite shrank while the carbon fillers remained intact, leading to a slight increase in filler loading and a substantial decrease in the resistivity of the sensors. The resistivity change was used to correlate with the aging time and to predict the need for maintenance of the insulation component according to Arrhenius’ equation. This aging sensor realized real-time, non-destructive monitoring capability for the aging of the target insulation component for the first time.Ph.D

Microfluidics and Nanofluidics Handbook

The Microfluidics and Nanofluidics Handbook: Two-Volume Set comprehensively captures the cross-disciplinary breadth of the fields of micro- and nanofluidics, which encompass the biological sciences, chemistry, physics and engineering applications. To fill the knowledge gap between engineering and the basic sciences, the editors pulled together key individuals, well known in their respective areas, to author chapters that help graduate students, scientists, and practicing engineers understand the overall area of microfluidics and nanofluidics. Topics covered include Finite Volume Method for Numerical Simulation Lattice Boltzmann Method and Its Applications in Microfluidics Microparticle and Nanoparticle Manipulation Methane Solubility Enhancement in Water Confined to Nanoscale Pores Volume Two: Fabrication, Implementation, and Applications focuses on topics related to experimental and numerical methods. It also covers fabrication and applications in a variety of areas, from aerospace to biological systems. Reflecting the inherent nature of microfluidics and nanofluidics, the book includes as much interdisciplinary knowledge as possible. It provides the fundamental science background for newcomers and advanced techniques and concepts for experienced researchers and professionals