Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Fast Repeater Tree Construction

Repeaters are used during physical design of chips to improve the electrical and timing properties of interconnections. They are added along Steiner trees that connect root gates to sinks, creating repeater trees. Their construction became a crucial part of chip design. We present a new algorithm to solve the repeater tree construction problem. We first present an extensive version of the Repeater Tree Problem. Our problem formulation encapsulates most of the constraints that have been studied so far. We also consider several aspects for the first time, for example, slew dependent required arrival times at repeater tree sinks. The employed technology, the properties of available repeaters and metal wires, the shape of the chip, the temperature, the voltages, and many other factors highly influence the results of repeater tree construction. To take all this into account, we extensively preprocess the environment to extract parameters for our algorithms. We first present an algorithm for Steiner tree creation and prove that our algorithm is able to create timing-efficient as well as cost-efficient trees. Our algorithm is based on a delay model that accurately describes the timing that one can achieve after repeater insertion upfront. Next, we deal with the problem of adding repeaters to a given Steiner tree. The predominantly used algorithms to solve this problem use dynamic programming. However, they have several drawbacks. Firstly, potential repeater positions along the Steiner tree have to be chosen upfront. Secondly, the algorithms strictly follow the given Steiner tree and miss optimization opportunities. Finally, dynamic programming causes high running times. We present our new buffer insertion algorithm, Fast Buffering, that overcomes these limitations. It is able to produce results with similar quality to a dynamic programming approach but a much better running time. In addition, we also present improvements to the dynamic programming approach that allows us to push the quality at the expense of a high running time. We have implemented our algorithms as part of the BonnTools physical design optimization suite developed at the Research Institute for Discrete Mathematics in cooperation with IBM. Our implementation deals with all tedious details of a grown real-world chip optimization environment. We have created extensive experimental results on challenging real-world test cases provided by our cooperation partner. Our algorithm can solve about 5.7 million instances per hour

Timing Closure in Chip Design

Achieving timing closure is a major challenge to the physical design of a computer chip. Its task is to find a physical realization fulfilling the speed specifications. In this thesis, we propose new algorithms for the key tasks of performance optimization, namely repeater tree construction; circuit sizing; clock skew scheduling; threshold voltage optimization and plane assignment. Furthermore, a new program flow for timing closure is developed that integrates these algorithms with placement and clocktree construction. For repeater tree construction a new algorithm for computing topologies, which are later filled with repeaters, is presented. To this end, we propose a new delay model for topologies that not only accounts for the path lengths, as existing approaches do, but also for the number of bifurcations on a path, which introduce extra capacitance and thereby delay. In the extreme cases of pure power optimization and pure delay optimization the optimum topologies regarding our delay model are minimum Steiner trees and alphabetic code trees with the shortest possible path lengths. We presented a new, extremely fast algorithm that scales seamlessly between the two opposite objectives. For special cases, we prove the optimality of our algorithm. The efficiency and effectiveness in practice is demonstrated by comprehensive experimental results. The task of circuit sizing is to assign millions of small elementary logic circuits to elements from a discrete set of logically equivalent, predefined physical layouts such that power consumption is minimized and all signal paths are sufficiently fast. In this thesis we develop a fast heuristic approach for global circuit sizing, followed by a local search into a local optimum. Our algorithms use, in contrast to existing approaches, the available discrete layout choices and accurate delay models with slew propagation. The global approach iteratively assigns slew targets to all source pins of the chip and chooses a discrete layout of minimum size preserving the slew targets. In comprehensive experiments on real instances, we demonstrate that the worst path delay is within 7% of its lower bound on average after a few iterations. The subsequent local search reduces this gap to 2% on average. Combining global and local sizing we are able to size more than 5.7 million circuits within 3 hours. For the clock skew scheduling problem we develop the first algorithm with a strongly polynomial running time for the cycle time minimization in the presence of different cycle times and multi-cycle paths. In practice, an iterative local search method is much more efficient. We prove that this iterative method maximizes the worst slack, even when restricting the feasible schedule to certain time intervals. Furthermore, we enhance the iterative local approach to determine a lexicographically optimum slack distribution. The clock skew scheduling problem is then generalized to allow for simultaneous data path optimization. In fact, this is a time-cost tradeoff problem. We developed the first combinatorial algorithm for computing time-cost tradeoff curves in graphs that may contain cycles. Starting from the lowest-cost solution, the algorithm iteratively computes a descent direction by a minimum cost flow computation. The maximum feasible step length is then determined by a minimum ratio cycle computation. This approach can be used in chip design for several optimization tasks, e.g. threshold voltage optimization or plane assignment. Finally, the optimization routines are combined into a timing closure flow. Here, the global placement is alternated with global performance optimization. Netweights are used to penalize the length of critical nets during placement. After the global phase, the performance is improved further by applying more comprehensive optimization routines on the most critical paths. In the end, the clock schedule is optimized and clocktrees are inserted. Computational results of the design flow are obtained on real-world computer chips

Layoutautomatisierung im analogen IC-Entwurf mit formalisiertem und nicht-formalisiertem Expertenwissen

After more than three decades of electronic design automation, most layouts for analog integrated circuits are still handcrafted in a laborious manual fashion today. Obverse to the highly automated synthesis tools in the digital domain (coping with the quantitative difficulty of packing more and more components onto a single chip – a desire well known as More Moore), analog layout automation struggles with the many diverse and heavily correlated functional requirements that turn the analog design problem into a More than Moore challenge. Facing this qualitative complexity, seasoned layout engineers rely on their comprehensive expert knowledge to consider all design constraints that uncompromisingly need to be satisfied. This usually involves both formally specified and nonformally communicated pieces of expert knowledge, which entails an explicit and implicit consideration of design constraints, respectively. Existing automation approaches can be basically divided into optimization algorithms (where constraint consideration occurs explicitly) and procedural generators (where constraints can only be taken into account implicitly). As investigated in this thesis, these two automation strategies follow two fundamentally different paradigms denoted as top-down automation and bottom-up automation. The major trait of top-down automation is that it requires a thorough formalization of the problem to enable a self-intelligent solution finding, whereas a bottom-up automatism –controlled by parameters– merely reproduces solutions that have been preconceived by a layout expert in advance. Since the strengths of one paradigm may compensate the weaknesses of the other, it is assumed that a combination of both paradigms –called bottom-up meets top-down– has much more potential to tackle the analog design problem in its entirety than either optimization-based or generator-based approaches alone. Against this background, the thesis at hand presents Self-organized Wiring and Arrangement of Responsive Modules (SWARM), an interdisciplinary methodology addressing the design problem with a decentralized multi-agent system. Its basic principle, similar to the roundup of a sheep herd, is to let responsive mobile layout modules (implemented as context-aware procedural generators) interact with each other inside a user-defined layout zone. Each module is allowed to autonomously move, rotate and deform itself, while a supervising control organ successively tightens the layout zone to steer the interaction towards increasingly compact (and constraint compliant) layout arrangements. Considering various principles of self-organization and incorporating ideas from existing decentralized systems, SWARM is able to evoke the phenomenon of emergence: although each module only has a limited viewpoint and selfishly pursues its personal objectives, remarkable overall solutions can emerge on the global scale. Several examples exhibit this emergent behavior in SWARM, and it is particularly interesting that even optimal solutions can arise from the module interaction. Further examples demonstrate SWARM’s suitability for floorplanning purposes and its application to practical place-and-route problems. The latter illustrates how the interacting modules take care of their respective design requirements implicitly (i.e., bottom-up) while simultaneously paying respect to high level constraints (such as the layout outline imposed top-down by the supervising control organ). Experimental results show that SWARM can outperform optimization algorithms and procedural generators both in terms of layout quality and design productivity. From an academic point of view, SWARM’s grand achievement is to tap fertile virgin soil for future works on novel bottom-up meets top-down automatisms. These may one day be the key to close the automation gap in analog layout design.Nach mehr als drei Jahrzehnten Entwurfsautomatisierung werden die meisten Layouts für analoge integrierte Schaltkreise heute immer noch in aufwändiger Handarbeit entworfen. Gegenüber den hochautomatisierten Synthesewerkzeugen im Digitalbereich (die sich mit dem quantitativen Problem auseinandersetzen, mehr und mehr Komponenten auf einem einzelnen Chip unterzubringen – bestens bekannt als More Moore) kämpft die analoge Layoutautomatisierung mit den vielen verschiedenen und stark korrelierten funktionalen Anforderungen, die das analoge Entwurfsproblem zu einer More than Moore Herausforderung machen. Angesichts dieser qualitativen Komplexität bedarf es des umfassenden Expertenwissens erfahrener Layouter um sämtliche Entwurfsconstraints, die zwingend eingehalten werden müssen, zu berücksichtigen. Meist beinhaltet dies formal spezifiziertes als auch nicht-formal übermitteltes Expertenwissen, was eine explizite bzw. implizite Constraint Berücksichtigung nach sich zieht. Existierende Automatisierungsansätze können grundsätzlich unterteilt werden in Optimierungsalgorithmen (wo die Constraint Berücksichtigung explizit erfolgt) und prozedurale Generatoren (die Constraints nur implizit berücksichtigen können). Wie in dieser Arbeit eruiert wird, folgen diese beiden Automatisierungsstrategien zwei grundlegend unterschiedlichen Paradigmen, bezeichnet als top-down Automatisierung und bottom-up Automatisierung. Wesentliches Merkmal der top-down Automatisierung ist die Notwendigkeit einer umfassenden Problemformalisierung um eine eigenintelligente Lösungsfindung zu ermöglichen, während ein bottom-up Automatismus –parametergesteuert– lediglich Lösungen reproduziert, die vorab von einem Layoutexperten vorgedacht wurden. Da die Stärken des einen Paradigmas die Schwächen des anderen ausgleichen können, ist anzunehmen, dass eine Kombination beider Paradigmen –genannt bottom-up meets top down– weitaus mehr Potenzial hat, das analoge Entwurfsproblem in seiner Gesamtheit zu lösen als optimierungsbasierte oder generatorbasierte Ansätze für sich allein. Vor diesem Hintergrund stellt die vorliegende Arbeit Self-organized Wiring and Arrangement of Responsive Modules (SWARM) vor, eine interdisziplinäre Methodik, die das Entwurfsproblem mit einem dezentralisierten Multi-Agenten-System angeht. Das Grundprinzip besteht darin, ähnlich dem Zusammentreiben einer Schafherde, reaktionsfähige mobile Layoutmodule (realisiert als kontextbewusste prozedurale Generatoren) in einer benutzerdefinierten Layoutzone interagieren zu lassen. Jedes Modul darf sich selbständig bewegen, drehen und verformen, wobei ein übergeordnetes Kontrollorgan die Zone schrittweise verkleinert, um die Interaktion auf zunehmend kompakte (und constraintkonforme) Layoutanordnungen hinzulenken. Durch die Berücksichtigung diverser Selbstorganisationsgrundsätze und die Einarbeitung von Ideen bestehender dezentralisierter Systeme ist SWARM in der Lage, das Phänomen der Emergenz hervorzurufen: obwohl jedes Modul nur eine begrenzte Sichtweise hat und egoistisch seine eigenen Ziele verfolgt, können sich auf globaler Ebene bemerkenswerte Gesamtlösungen herausbilden. Mehrere Beispiele veranschaulichen dieses emergente Verhalten in SWARM, wobei besonders interessant ist, dass sogar optimale Lösungen aus der Modulinteraktion entstehen können. Weitere Beispiele demonstrieren SWARMs Eignung zwecks Floorplanning sowie die Anwendung auf praktische Place-and-Route Probleme. Letzteres verdeutlicht, wie die interagierenden Module ihre jeweiligen Entwurfsanforderungen implizit (also: bottom-up) beachten, während sie gleichzeitig High-Level-Constraints berücksichtigen (z.B. die Layoutkontur, die top-down vom übergeordneten Kontrollorgan auferlegt wird). Experimentelle Ergebnisse zeigen, dass Optimierungsalgorithmen und prozedurale Generatoren von SWARM sowohl bezüglich Layoutqualität als auch Entwurfsproduktivität übertroffen werden können. Aus akademischer Sicht besteht SWARMs große Errungenschaft in der Erschließung fruchtbaren Neulands für zukünftige Arbeiten an neuartigen bottom-up meets top-down Automatismen. Diese könnten eines Tages der Schlüssel sein, um die Automatisierungslücke im analogen Layoutentwurf zu schließen

Integrated Circuits Parasitic Capacitance Extraction Using Machine Learning and its Application to Layout Optimization

The impact of parasitic elements on the overall circuit performance keeps increasing from one technology generation to the next. In advanced process nodes, the parasitic effects dominate the overall circuit performance. As a result, the accuracy requirements of parasitic extraction processes significantly increased, especially for parasitic capacitance extraction. Existing parasitic capacitance extraction tools face many challenges to cope with such new accuracy requirements that are set by semiconductor foundries (\u3c 5% error). Although field-solver methods can meet such requirements, they are very slow and have a limited capacity. The other alternative is the rule-based parasitic capacitance extraction methods, which are faster and have a high capacity; however, they cannot consistently provide good accuracy as they use a pre-characterized library of capacitance formulas that cover a limited number of layout patterns. On the other hand, the new parasitic extraction accuracy requirements also added more challenges on existing parasitic-aware routing optimization methods, where simplified parasitic models are used to optimize layouts. This dissertation provides new solutions for interconnect parasitic capacitance extraction and parasitic-aware routing optimization methodologies in order to cope with the new accuracy requirements of advanced process nodes as follows. First, machine learning compact models are developed in rule-based extractors to predict parasitic capacitances of cross-section layout patterns efficiently. The developed models mitigate the problems of the pre-characterized library approach, where each compact model is designed to extract parasitic capacitances of cross-sections of arbitrary distributed metal polygons that belong to a specific set of metal layers (i.e., layer combination) efficiently. Therefore, the number of covered layout patterns significantly increased. Second, machine learning compact models are developed to predict parasitic capacitances of middle-end-of-line (MEOL) layers around FINFETs and MOSFETs. Each compact model extracts parasitic capacitances of 3D MEOL patterns of a specific device type regardless of its metal polygons distribution. Therefore, the developed MEOL models can replace field-solvers in extracting MEOL patterns. Third, a novel accuracy-based hybrid parasitic capacitance extraction method is developed. The proposed hybrid flow divides a layout into windows and extracts the parasitic capacitances of each window using one of three parasitic capacitance extraction methods that include: 1) rule-based; 2) novel deep-neural-networks-based; and 3) field-solver methods. This hybrid methodology uses neural-networks classifiers to determine an appropriate extraction method for each window. Moreover, as an intermediate parasitic capacitance extraction method between rule-based and field-solver methods, a novel deep-neural-networks-based extraction method is developed. This intermediate level of accuracy and speed is needed since using only rule-based and field-solver methods (for hybrid extraction) results in using field-solver most of the time for any required high accuracy extraction. Eventually, a parasitic-aware layout routing optimization and analysis methodology is implemented based on an incremental parasitic extraction and a fast optimization methodology. Unlike existing flows that do not provide a mechanism to analyze the impact of modifying layout geometries on a circuit performance, the proposed methodology provides novel sensitivity circuit models to analyze the integrity of signals in layout routes. Such circuit models are based on an accurate matrix circuit representation, a cost function, and an accurate parasitic sensitivity extraction. The circuit models identify critical parasitic elements along with the corresponding layout geometries in a certain route, where they measure the sensitivity of a route’s performance to corresponding layout geometries very fast. Moreover, the proposed methodology uses a nonlinear programming technique to optimize problematic routes with pre-determined degrees of freedom using the proposed circuit models. Furthermore, it uses a novel incremental parasitic extraction method to extract parasitic elements of modified geometries efficiently, where the incremental extraction is used as a part of the routing optimization process to improve the optimization runtime and increase the optimization accuracy

Interconnect Planning for Physical Design of 3D Integrated Circuits

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary BibliographyDreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliograph