Parameterized partial element equivalent circuit method for sensitivity analysis of multiport systems

This paper presents a new technique to perform parameterized sensitivity analyses of systems that depend on multiple design parameters, such as layout and substrate features. It uses the electromagnetic (EM) method called partial element equivalent circuit to compute state space matrices at a set of design space points. These EM matrices are interpolated as functions of the design parameters. The proposed interpolation scheme allows the computation of the derivatives of the matrices, which are needed to perform the sensitivity analysis. An extensive study of the required stability and passivity properties of the system involved in the parameterized sensitivity analysis is presented. Pertinent numerical results demonstrate the robustness, accuracy, and efficiency of the proposed methodology

Fast, non-monte-carlo estimation of transient performance variation due to device mismatch

This paper describes an efficient way of simulating the effects of device random mismatch on circuit transient characteristics, such as variations in delay or in frequency. The proposed method models DC random offsets as equivalent AC pseudo-noises and leverages the fast, linear periodically time-varying (LPTV) noise analysis available from RF circuit simulators. Therefore, the method can be considered as an extension to DC match analysis and offers a large speed-up compared to the traditional Monte-Carlo analysis. Although the assumed linear perturbation model is valid only for small variations, it enables easy ways to estimate correlations among variations and identify the most sensitive design parameters to mismatch, all at no additional simulation cost. Three benchmarks measuring the variations in the input offset voltage of a clocked comparator, the delay of a logic path, and the frequency of an oscillator demonstrate the speed improvement of about 100-1000x compared to a 1000-point Monte-Carlo method

Time-Domain Macromodeling of High Speed Distributed Networks

With the rapid growth in density, operating speeds and complexity of modern very-large-scale integration (VLSI) circuits, there is a growing demand on efficient and accurate modeling and simulation of high speed interconnects and packages in order to ensure the signal integrity, reliability and performance of electronic systems. Such models can be derived from the knowledge of the physical characteristics of the structure or based on the measured port-to-port response.In the first part of this thesis, a passive macromodeling technique based on Method of Characteristics (referred as Passive Method of Characteristics or PMoC) is described which is applicable for modeling of electrically long high-speed interconnect networks. This algorithm is based on extracting the propagation delay of the interconnect followed by a low order rational approximation to capture the attenuation effects. The key advantage of the algorithm is that the curve fitting to realize the macromodel depends only on per-unit-length (p.u.l.) parameters and not on the length of the transmission line. In this work, the PMoC is developed to model multiconductor transmission lines.Next, an efficient approach for time domain sensitivity analysis of lossy high speed interconnects in the presence of nonlinear terminations is presented based on PMoC. An important feature of the proposed method is that the sensitivities are obtained from the solution of the original network, leading to significant computational advantages. The sensitivity analysis is also used to optimize the physical parameters of the network to satisfy the required design constraints. A time-domain macromodel for lossy multiconductor transmission lines exposed to electromag¬netic interference is also described in this thesis based on PMoC. The algorithm provides an efficient mechanism to ensure the passivity of the macromodel for different line lengths. Numerical examples illustrate that when compared to other passive incident field coupling algorithms, the proposed method is efficient in modeling electrically long interconnects since delay extraction without segmentation is used to capture the frequency response.In addition, this thesis discusses macromodeling techniques for complex packaging structures based on the frequency-domain behavior of the system obtained from measurements or electromagnetic simulators. Such techniques approximate the transfer function of the interconnect network as a rational function which can be embedded with modern circuit simulators with integrated circuit emphasis (SPICE). One of the most popular tools for rational approximations of measured or simulated data is based on vector fitting (VF) algorithms. Nonetheless, the vector fitting algorithms usually suffer convergence issues and lack of accuracy when dealing with noisy measured data. As a part of this thesis, a methodology is presented to improve the convergence and accuracy issues of vector fitting algorithm based on instrumental variable technique. This methodology is based on obtaining the “instruments” in an iterative manner and do not increase the complexity of vector fitting to capture the frequency response and minimize the biasing

Architectural level delay and leakage power modelling of manufacturing process variation

PhD ThesisThe effect of manufacturing process variations has become a major issue regarding the estimation of circuit delay and power dissipation, and will gain more importance in the future as device scaling continues in order to satisfy market place demands for circuits with greater performance and functionality per unit area. Statistical modelling and analysis approaches have been widely used to reflect the effects of a variety of variational process parameters on system performance factor which will be described as probability density functions (PDFs). At present most of the investigations into statistical models has been limited to small circuits such as a logic gate. However, the massive size of present day electronic systems precludes the use of design techniques which consider a system to comprise these basic gates, as this level of design is very inefficient and error prone. This thesis proposes a methodology to bring the effects of process variation from transistor level up to architectural level in terms of circuit delay and leakage power dissipation. Using a first order canonical model and statistical analysis approach, a statistical cell library has been built which comprises not only the basic gate cell models, but also more complex functional blocks such as registers, FIFOs, counters, ALUs etc. Furthermore, other sensitive factors to the overall system performance, such as input signal slope, output load capacitance, different signal switching cases and transition types are also taken into account for each cell in the library, which makes it adaptive to an incremental circuit design. The proposed methodology enables an efficient analysis of process variation effects on system performance with significantly reduced computation time compared to the Monte Carlo simulation approach. As a demonstration vehicle for this technique, the delay and leakage power distributions of a 2-stage asynchronous micropipeline circuit has been simulated using this cell library. The experimental results show that the proposed method can predict the delay and leakage power distribution with less than 5% error and at least 50,000 times faster computation time compare to 5000-sample SPICE based Monte Carlo simulation. The methodology presented here for modelling process variability plays a significant role in Design for Manufacturability (DFM) by quantifying the direct impact of process variations on system performance. The advantages of being able to undertake this analysis at a high level of abstraction and thus early in the design cycle are two fold. First, if the predicted effects of process variation render the circuit performance to be outwith specification, design modifications can be readily incorporated to rectify the situation. Second, knowing what the acceptable limits of process variation are to maintain design performance within its specification, informed choices can be made regarding the implementation technology and manufacturer selected to fabricate the design

Enabling High-Dimensional Hierarchical Uncertainty Quantification by ANOVA and Tensor-Train Decomposition

Hierarchical uncertainty quantification can reduce the computational cost of stochastic circuit simulation by employing spectral methods at different levels. This paper presents an efficient framework to simulate hierarchically some challenging stochastic circuits/systems that include high-dimensional subsystems. Due to the high parameter dimensionality, it is challenging to both extract surrogate models at the low level of the design hierarchy and to handle them in the high-level simulation. In this paper, we develop an efficient ANOVA-based stochastic circuit/MEMS simulator to extract efficiently the surrogate models at the low level. In order to avoid the curse of dimensionality, we employ tensor-train decomposition at the high level to construct the basis functions and Gauss quadrature points. As a demonstration, we verify our algorithm on a stochastic oscillator with four MEMS capacitors and 184 random parameters. This challenging example is simulated efficiently by our simulator at the cost of only 10 minutes in MATLAB on a regular personal computer.Comment: 14 pages (IEEE double column), 11 figure, accepted by IEEE Trans CAD of Integrated Circuits and System

Computational Prototyping Tools and Techniques

Contains reports on five research projects.Industry Consortium (Mobil, Statoil, DNV Software, Shell, OTRC, Petrobras, NorskHydro, Exxon, Chevron, SAGA, NSWC)U.S. Navy - Office of Naval ResearchAnalog DevicesDefense Advanced Research Projects Agency Contract J-FBI-95-215Cadence Design SystemsHarris SemiconductorMAFET ConsortiumMotorola SemiconductorDefense Advanced Research Projects AgencyMultiuniversity Research InitiativeSemiconductor Research CorporationIBM Corporatio

Variability analysis of FinFET AC/RF performances through efficient physics-based simulations for the optimization of RF CMOS stages

A nearly insatiable appetite for the latest electronic device enables the electronic technology sector to maintain research momentum. The necessity for advancement with miniaturization of electronic devices is the need of the day. Aggressive downscaling of electronic devices face some fundamental limits and thus, buoy up the change in device geometry. MOSFETs have been the leading contender in the electronics industry for years, but the dire need for miniaturization is forcing MOSFET to be scaled to nano-scale and in sub-50 nm scale. Short channel effects (SCE) become dominant and adversely affect the performance of the MOSFET. So, the need for a novel structure was felt to suppress SCE to an acceptable level. Among the proposed devices, FinFETs (Fin Field Effect Transistors) were found to be most effective to counter-act SCE in electronic devices. Today, many industries are working on electronic circuits with FinFETs as their primary element.One of limitation which FinFET faces is device variability. The purpose of this work was to study the effect that different sources of parameter fluctuations have on the behavior and characteristics of FinFETs. With deep literature review, we have gained insight into key sources of variability. Different sources of variations, like random dopant fluctuation, line edge roughness, fin variations, workfunction variations, oxide thickness variation, and source/drain doping variations, were studied and their impact on the performance of the device was studied as well. The adverse effect of these variations fosters the great amount of research towards variability modeling. A proper modeling of these variations is required to address the device performance metric before the fabrication of any new generation of the device on the commercial scale. The conventional methods to address the characteristics of a device under variability are Monte-Carlo-like techniques. In Monte Carlo analysis, all process parameters can be varied individually or simultaneously in a more realistic approach. The Monte Carlo algorithm takes a random value within the range of each process parameter and performs circuit simulations repeatedly. The statistical characteristics are estimated from the responses. This technique is accurate but requires high computational resources and time. Thus, efforts are being put by different research groups to find alternative tools. If the variations are small, Green’s Function (GF) approach can be seen as a breakthrough methodology. One of the most open research fields regards "Variability of FinFET AC performances". One reason for the limited AC variability investigations is the lack of commercially available efficient simulation tools, especially those based on accurate physics-based analysis: in fact, the only way to perform AC variability analysis through commercial TCAD tools like Synopsys Sentaurus is through the so-called Monte Carlo approach, that when variations are deterministic, is more properly referred to as incremental analysis, i.e., repeated solutions of the device model with varying physical parameters. For each selected parameter, the model must be solved first in DC operating condition (working point, WP) and then linearized around the WP, hence increasing severely the simulation time. In this work, instead, we used GF approach, using our in-house Simulator "POLITO", to perform AC variability analysis, provided that variations are small, alleviating the requirement of double linearization and reducing the simulation time significantly with a slight trade-off in accuracy. Using this tool we have, for the first time addressed the dependency of FinFET AC parameters on the most relevant process variations, opening the way to its application to RF circuits. This work is ultimately dedicated to the successful implementation of RF stages in commercial applications by incorporating variability effects and controlling the degradation of AC parameters due to variability. We exploited the POLITO (in-house simulator) limited to 2D structures, but this work can be extended to the variability analysis of 3D FinFET structure. Also variability analysis of III-V Group structures can be addressed. There is also potentiality to carry out the sensitivity analysis for the other source of variations, e.g., thermal variations

Clock Distribution Network Optimization by Sequential Quadratic Programing

Clock mesh is widely used in microprocessor designs for achieving low clock skew and high process variation tolerance. Clock mesh optimization is a very diffcult problem to solve because it has a highly connected structure and requires accurate delay models which are computationally expensive. Existing methods on clock network optimization are either restricted to clock trees, which are easy to be separated into smaller problems, or naive heuristics based on crude delay models. A clock mesh sizing algorithm, which is aimed to minimize total mesh wire area with consideration of clock skew constraints, has been proposed in this research work. This algorithm is a systematic solution search through rigorous Sequential Quadratic Programming (SQP). The SQP is guided by an efficient adjoint sensitivity analysis which has near-SPICE(Simulation Program for Integrated Circuits Emphasis)-level accuracy and faster-than-SPICE speed. Experimental results on various benchmark circuits indicate that this algorithm leads to substantial wire area reduction while maintaining low clock skew in the clock mesh. The reduction in mesh area achieved is about 33%

Interconnect delay modeling under exponential input

Interconnect has become the dominating factor in determining the performance of VLSI deep submicron designs. With the rapid shrinking of feature size and development in the process technologies, it has been observed that the resistance per unit length of the interconnect continues to increase, capacitance per unit length remains roughly constant, and transistor or gate delay continues to decrease. This had led to the increasing dominance of interconnect delay over logic delay, and this trend is expected to continue. With this being the main bottleneck in realizing high speed circuits, complete understanding of the interconnect delay and thereby efficient and accurate delay circulation has assumed a greater significance in physical design, optimization and fast verification. In this thesis, a interconnect delay model under exponential input is presented. Because of its simple closed form expression, fast computation speed, and fidelity with respect to simulation, Elmore delay model remains popular. More accurate delay computation methods are typically central processing unit intensive and/or difficult to implement. To bridge this gap between accuracy and efficiency/simplicity, a new RC delay metric for interconnects which is as efficient as the Elmore metric, but more accurate, is proposed. However, there is no interconnect delay model considering exponential input waveform existing in the literature. The proposed Exponential Delay Metric uses exponential waveform as input and captures resistive shielding effects by modeling the downstream by a [pi]-model. An application of the delay model to perform interconnect optimization using wire sizing is also presented. Experimental results show that the proposed delay model is significantly more accurate than the existing interconnect delay models