Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Choose-Your-Own Adventure: A Lightweight, High-Performance Approach To Defect And Variation Mitigation In Reconfigurable Logic

For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, combined with simple test-based selection, produce limited per-chip specialization to counter yield loss, increased delay, and increased energy costs that come from fabrication defects and variation. This lightweight approach achieves much of the benefit of knowledge-based full specialization while reducing to practical, palatable levels the computational, testing, and load-time costs that obstruct the application of the knowledge-based approach. In practice this may more than double the power-limited computational capabilities of dies fabricated with 22nm technologies. Contributions of this work: • Choose-Your-own-Adventure (CYA), a novel, lightweight, scalable methodology to achieve defect and variation mitigation • Implementation of CYA, including preparatory components (generation of diverse alternative paths) and FPGA load-time components • Detailed performance characterization of CYA – Comparison to conventional loading and dynamic frequency and voltage scaling (DFVS) – Limit studies to characterize the quality of the CYA implementation and identify potential areas for further optimizatio

Hybrid FPGA: Architecture and Interface

Hybrid FPGAs (Field Programmable Gate Arrays) are composed of general-purpose logic resources with different granularities, together with domain-specific coarse-grained units. This thesis proposes a novel hybrid FPGA architecture with embedded coarse-grained Floating Point Units (FPUs) to improve the floating point capability of FPGAs. Based on the proposed hybrid FPGA architecture, we examine three aspects to optimise the speed and area for domain-specific applications. First, we examine the interface between large coarse-grained embedded blocks (EBs) and fine-grained elements in hybrid FPGAs. The interface includes parameters for varying: (1) aspect ratio of EBs, (2) position of the EBs in the FPGA, (3) I/O pins arrangement of EBs, (4) interconnect flexibility of EBs, and (5) location of additional embedded elements such as memory. Second, we examine the interconnect structure for hybrid FPGAs. We investigate how large and highdensity EBs affect the routing demand for hybrid FPGAs over a set of domain-specific applications. We then propose three routing optimisation methods to meet the additional routing demand introduced by large EBs: (1) identifying the best separation distance between EBs, (2) adding routing switches on EBs to increase routing flexibility, and (3) introducing wider channel width near the edge of EBs. We study and compare the trade-offs in delay, area and routability of these three optimisation methods. Finally, we employ common subgraph extraction to determine the number of floating point adders/subtractors, multipliers and wordblocks in the FPUs. The wordblocks include registers and can implement fixed point operations. We study the area, speed and utilisation trade-offs of the selected FPU subgraphs in a set of floating point benchmark circuits. We develop an optimised coarse-grained FPU, taking into account both architectural and system-level issues. Furthermore, we investigate the trade-offs between granularities and performance by composing small FPUs into a large FPU. The results of this thesis would help design a domain-specific hybrid FPGA to meet user requirements, by optimising for speed, area or a combination of speed and area

TIME-MULTIPLEXED INTERCONNECTION NETWORK FOR FIELD-PROGRAMMABLE GATE ARRAYS

Ph.DDOCTOR OF PHILOSOPH

Demonstration of monolithically integrated graphene interconnects for low-power CMOS applications

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 129-141).In recent years, interconnects have become an increasingly difficult design challenge as their relative performance has not improved at the same pace with transistor scaling. The specifications for complex features, clock frequency, supply current, and number of I/O resources have added even greater demands for interconnect performance. Furthermore, the resistivity of copper begins to degrade at smaller line widths due to increased scattering effects. Graphene has gathered much interest as an interconnect material due to its high mobility, high current carrying capacity, and high thermal conductivity. DC characterization of sub-50 nm graphene interconnects has been reported but very few studies exist on evaluating their performance when integrated with CMOS. Integrating graphene with CMOS is a critical step in establishing a path for graphene electronics. In this thesis, we characterize the performance of integrated graphene interconnects and demonstrate two prototype CMOS chips. A 0.35 prm CMOS chip implements an array of transmitter/receivers to analyze end-to-end data communication on graphene wires. Graphene sheets are synthesized by chemical vapor deposition, which are then subsequently transferred and patterned into narrow wires up to 1 mm in length. A low-swing signaling technique is applied, which results in a transmitter energy of 0.3-0.7 pJ/bit/mm, and a total energy of 2.4-5.2 pJ/bit/mm. We demonstrate a minimum voltage swing of 100 mV and bit error rates below 2x10-10. Despite the high sheet resistivity of graphene, integrated graphene links run at speeds up to 50 Mbps. Finally, a subthreshold FPGA was implemented in 0.18 pm CMOS. We demonstrate reliable signal routing on 4-layer graphene wires which replaces parts of the interconnect fabric. The FPGA test chip includes a 5x5 logic array and a TDC-based tester to monitor the delay of graphene wires. The graphene wires have 2.8x lower capacitance than the reference metal wires, resulting in up to 2.11x faster speeds and 1.54x lower interconnect energy when driven by a low-swing voltage of 0.4 V. This work presents the first graphene-based system application and demonstrates the potential of using low capacitance graphene wires for ultra-low power electronics.by Kyeong-Jae Lee.Ph.D

FPGA Architecture Optimization Using Geometric Programming

Volume 4 No 13 of the periodical Progression. Published November, February, May and August by The Radiant Healing Centre. SPCL PER BT 732 P76 V.1,1932-V.5,193

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

The energy consumption of field-programmable gate arrays (FPGA) is dominated by leakage currents and dynamic energy associated with programmable interconnect. An FPGA built entirely from nanoelectromechanical (NEM) relays can effectively eliminate leakage energy losses, reduce the interconnect dynamic energy, operate at temperatures &gt;225 °C and tolerate radiation doses in excess of 100 Mrad, while hybrid FPGAs comprising both complementary metal-oxide-semiconductor (CMOS) transistors and NEM relays (NEM-CMOS) have the potential to realize improvements in performance and energy efficiency. Large-scale integration of NEM relays, however, poses a significant engineering challenge due to the presence of moving parts. We discuss the design of FPGAs utilizing NEM relays based on a heterogeneous 3-D integration scheme, and carry out a scaling study to quantify key metrics related to performance and energy efficiency in both NEM-only and NEM-CMOS FPGAs. We show how the integration scheme has a profound effect on these metrics by changing the length of global wires. The scaling regime beyond which net performance and energy benefits is seen in NEM-CMOS over a baseline 90 nm CMOS technology is defined by an effective relay beam length of 0.5 μm , on-resistance of 200 kΩ , and a via pitch of 0.4 μm , all achievable with existing process technology. For ultra-low energy applications that are not performance critical, NEM-only FPGAs can provide close to 15× improvement in energy efficiency.QC 20180412</p