212 research outputs found

    Networks on Chips: Structure and Design Methodologies

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    Power efficient resilient microarchitectures for PVT variability mitigation

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    Nowadays, the high power density and the process, voltage, and temperature variations became the most critical issues that limit the performance of the digital integrated circuits because of the continuous scaling of the fabrication technology. Dynamic voltage and frequency scaling technique is used to reduce the power consumption while different time relaxation techniques and error recovery microarchitectures are used to tolerate the process, voltage, and temperature variations. These techniques reduce the throughput by scaling down the frequency or flushing and restarting the errant pipeline. This thesis presents a novel resilient microarchitecture which is called ERSUT-based resilient microarchitecture to tolerate the induced delays generated by the voltage scaling or the process, voltage, and temperature variations. The resilient microarchitecture detects and recovers the induced errors without flushing the pipeline and without scaling down the operating frequency. An ERSUT-based resilient 16 × 16 bit MAC unit, implemented using Global Foundries 65 nm technology and ARM standard cells library, is introduced as a case study with 18.26% area overhead and up to 1.5x speedup. At the typical conditions, the maximum frequency of the conventional MAC unit is about 375 MHz while the resilient MAC unit operates correctly at a frequency up to 565 MHz. In case of variations, the resilient MAC unit tolerates induced delays up to 50% of the clock period while keeping its throughput equal to the conventional MAC unit’s maximum throughput. At 375 MHz, the resilient MAC unit is able to scale down the supply voltage from 1.2 V to 1.0 V saving about 29% of the power consumed by the conventional MAC unit. A double-edge-triggered microarchitecture is also introduced to reduce the power consumption extremely by reducing the frequency of the clock tree to the half while preserving the same maximum throughput. This microarchitecture is applied to different ISCAS’89 benchmark circuits in addition to the 16x16 bit MAC unit and the average power reduction of all these circuits is 63.58% while the average area overhead is 31.02%. All these circuits are designed using Global Foundries 65nm technology and ARM standard cells library. Towards the full automation of the ERSUT-based resilient microarchitecture, an ERSUT-based algorithm is introduced in C++ to accelerate the design process of the ERSUT-based microarchitecture. The developed algorithm reduces the design-time efforts dramatically and allows the ERSUT-based microarchitecture to be adopted by larger industrial designs. Depending on the ERSUT-based algorithm, a validation study about applying the ERSUT-based microarchitecture on the MAC unit and different ISCAS’89 benchmark circuits with different complexity weights is introduced. This study shows that 72% of these circuits tolerates more than 14% of their clock periods and 54.5% of these circuits tolerates more than 20% while 27% of these circuits tolerates more than 30%. Consequently, the validation study proves that the ERSUT-based resilient microarchitecture is a valid applicable solution for different circuits with different complexity weights

    Unreliable Silicon: Circuit through System-Level Techniques for Mitigating the Adverse Effects of Process Variation, Device Degradation and Environmental Conditions.

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    Designing and manufacturing integrated circuits in advanced, highly-scaled processing technologies that meet stringent specification sets is an increasingly unreliable proposition. Dimensional processing variations, time and stress dependent device degradation and potentially varying environmental conditions exacerbate deviations in performance, power and even functionality of integrated circuits. This work explores a system-level adaptive design philosophy intended to mitigate the power and performance impact of unreliable silicon devices and presents enabling circuits for SRAM variation mitigation and in-situ measurement of device degradation in 130nm and 45nm processing technologies. An adaptation of RAZOR-based DVS designed for on-chip memory power reduction and reliability lifetime improvement enables the elimination of 250 mV of voltage margin in a 1.8V design, with up to 500 mV of reduction when allowing 5% of memory operations to use multiple cycles. A novel PID-controlled dynamic reliability management (DRM) system is presented, allowing user-specified circuit lifetime to be dynamically managed via dynamic voltage and frequency scaling. Peak performance improvement of 20-35% is achievable in typical processing systems by allowing brief periods of elevated voltage operation through the real-time DRM system, while minimizing voltage during non-critical periods of operation to maximize circuit lifetime. A probabilistic analysis of oxide breakdown using the percolation model indicates the need for 1000-2000 integrated in-situ sensors to achieve oxide lifetime prediction error at or under 10%. The conclusions from the oxide analysis are used to guide the design of a series of novel on-chip reliability monitoring circuits for use in a real-time DRM system. A 130nm in-situ oxide breakdown measurement sensor presented is the first published design of an oxide-breakdown oriented circuit and is compatible with standard-cell style automatic “place and route” design styles used in the majority of application specific integrated circuit designs. Measured results show increases in gate oxide leakage of 14-35% after accelerated stress testing. A second generation design of the on-chip oxide degradation sensor is presented that reduces stress mode power consumption by 111,785X over the initial design while providing an ideal 1:1 mapping of gate leakage to output frequency in extracted simulations.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/60701/1/ekarl_1.pd

    Network-on-Chip

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    Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

    Digital desing for neuroporphic bio-inspired vision processing.

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    Artificial Intelligence (AI) is an exciting technology that flourished in this century. One of the goals for this technology is to give learning ability to computers. Currently, machine intelligence surpasses human intelligence in specific domains. Besides some conventional machine learning algorithms, Artificial Neural Networks (ANNs) is arguably the most exciting technology that is used to bring this intelligence to the computer world. Due to ANN’s advanced performance, increasing number of applications that need kind of intelligence are using ANN. Neuromorphic engineers are trying to introduce bio-inspired hardware for efficient implementation of neural networks. This hardware should be able to simulate a vast number of neurons in real-time with complex synaptic connectivity while consuming little power. The work that has been done in this thesis is hardware oriented, so it is necessary for the reader to have a good understanding of the hardware that is used for developments in this thesis. In this chapter, we provide a brief overview of the hardware platforms that are used in this thesis. Afterward, we explain briefly the contributions of this thesis to the bio-inspired processing research line

    A Robust Self-calibrating Transmission Scheme for On-Chip Networks

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    Systems-on-Chip (SoC) design involves several challenges, stemming from the extreme miniaturization of the physical features and from the large number of devices and wires on a chip. Since most SoCs are used within embedded systems, specific concerns are increasingly related to correct, reliable, and robust operation. We believe that in the future most SoCs will be assembled by using large-scale macro-cells and interconnected by means of on-chip networks. We examine some physical properties of on-chip interconnect busses, with the goal of achieving fast, reliable, and low-energy communication. These objectives are reached by dynamically scaling down the voltage swing, while ensuring data integrity-in spite of the decreased signal to noise ratio-by means of encoding and retransmission schemes. In particular, we describe a closed-loop voltage swing controller that samples the error retransmission rate to determine the operational voltage swing. We present a control policy which achieves our goals with minimal complexity; such simplicity is demonstrated by implementing the policy in a synthesizable controller. Such a controller is an embodiment of a self-calibrating circuit that compensates for significant manufacturing parameter deviations and environmental variations. Experimental results show that energy savings amount up to 42%, while at the same time meeting performance requirements

    Multilayer Modeling and Design of Energy Managed Microsystems

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    Aggressive energy reduction is one of the key technological challenges that all segments of the semiconductor industry have encountered in the past few years. In addition, the notion of environmental awareness and designing “green” products is yet another major driver for ultra low energy design of electronic systems. Energy management is one of the unique solutions that can address the simultaneous requirements of high-performance, (ultra) low energy and greenness in many classes of computing systems; including high-performance, embedded and wireless. These considerations motivate the focus of this dissertation on the energy efficiency improvement of Energy Managed Microsystems (EMM or EM2). The aim is to maximize the energy efficiency and/or the operational lifetime of these systems. In this thesis we propose solutions that are applicable to many classes of computing systems including high-performance and mobile computing systems. These solutions contribute to make such technologies “greener”. The proposed solutions are multilayer, since they belong to, and may be applicable to, multiple design abstraction layers. The proposed solutions are orthogonal to each other, and if deployed simultaneously in a vertical system integration approach, when possible, the net benefit may be as large as the multiplication of the individual benefits. At high-level, this thesis initially focuses on the modeling and design of interconnections for EM2. For this purpose, a design flow has been proposed for interconnections in EM2. This flow allows designing interconnects with minimum energy requirements that meet all the considered performance objectives, in all specified system operating states. Later, models for energy performance estimation of EM2 are proposed. By energy performance, we refer to the improvements of energy savings of the computing platforms, obtained when some enhancements are applied to those platforms. These models are based on the components of the application profile. The adopted method is inspired by Amdahl’s law, which is driven by the fact that ‘energy’ is ‘additive’, as ‘time’ is ‘additive’. These models can be used for the design space exploration of EM2. The proposed models are high-level and therefore they are easy to use and show fair accuracy, 9.1% error on average, when compared to the results of the implemented benchmarks. Finally, models to estimate energy consumption of EM2 according to their “activity” are proposed. By “activity” we mean the rate at which EM2 perform a set of predefined application functions. Good estimations of energy requirements are very useful when designing and managing the EM2 activity, in order to extend their battery lifetime. The study of the proposed models on some Wireless Sensor Network (WSN) application benchmark confirms a fair accuracy for the energy estimation models, 3% error on average on the considered benchmarks

    An Energy-Efficient System with Timing-Reliable Error-Detection Sequentials

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    A new type of energy-efficient digital system that integrate EDS and DVS circuits has been developed. In these systems, EDS-monitored paths convert the PVT variations into timing variations. Nevertheless, the conversion can suffer from the reliability issue (extrinsic EDS-reliability). EDS circuits detect the unfavorable timing variations (so called ``error'') and guide DVS circuits to adjust the operating voltage to a proper lower level to save the energy. However, the error detection is generally susceptible to the metastability problem (intrinsic EDS-reliability) due to the synchronizer in EDS circuits. The MTBF due to metastability is exponentially related to the synchronizer delay. This dissertation proposes a new EDS circuit deployment strategy to enhance the extrinsic EDS-reliability. This strategy requires neither buffer insertion nor an extra clock and is applicable for FPGA implementations. An FPGA-based Discrete Cosine Transform with EDS and DVS circuits deployed in this fashion demonstrates up to 16.5\% energy savings over a conventional design at equivalent frequency setting and image quality, with a 0.8\% logic element and 3.5\% maximum frequency penalties. VBSs are proposed to improve the synchronizer delay under single low-voltage supply environments. A VBS consists of a Jamb latch and a switched-capacitor-based charge pump that provides a voltage boost to the Jamb Latch to speed up the metastability resolution. The charge pump can be either CVBS or MVBS. A new methodology for extracting the metastability parameters of synchronizers under changing biasing currents is proposed. For a 1-year MTBF specification, MVBS and CVBS show 2.0 to 2.7 and 5.1 to 9.8 times the delay improvement over the basic Jamb latch, respectively, without large power consumption. Optimization techniques including transistor sizing, FBB and dynamic implementation are further applied. For a common MTBF specification at typical PVT conditions, the optimized MVBS and CVBS show 2.97 to 7.57 and 4.14 to 8.13 times the delay improvement over the basic Jamb latch, respectively. In post-Layout simulations, MVBS and CVBS are 1.84 and 2.63 times faster than the basic Jamb latch, respectively

    Power efficient and power attacks resistant system design and analysis using aggressive scaling with timing speculation

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    Growing usage of smart and portable electronic devices demands embedded system designers to provide solutions with better performance and reduced power consumption. Due to the new development of IoT and embedded systems usage, not only power and performance of these devices but also security of them is becoming an important design constraint. In this work, a novel aggressive scaling based on timing speculation is proposed to overcome the drawbacks of traditional DVFS and provide security from power analysis attacks at the same time. Dynamic voltage and frequency scaling (DVFS) is proven to be the most suitable technique for power efficiency in processor designs. Due to its promising benefits, the technique is still getting researchers attention to trade off power and performance of modern processor designs. The issues of traditional DVFS are: 1) Due to its pre-calculated operating points, the system is not able to suit to modern process variations. 2) Since Process Voltage and Temperature (PVT) variations are not considered, large timing margins are added to guarantee a safe operation in the presence of variations. The research work presented here addresses these issues by employing aggressive scaling mechanisms to achieve more power savings with increased performance. This approach uses in-situ timing error monitoring and recovering mechanisms to reduce extra timing margins and to account for process variations. A novel timing error detection and correction mechanism, to achieve more power savings or high performance, is presented. This novel technique has also been shown to improve security of processors against differential power analysis attacks technique. Differential power analysis attacks can extract secret information from embedded systems without knowing much details about the internal architecture of the device. Simulated and experimental data show that the novel technique can provide a performance improvement of 24% or power savings of 44% while occupying less area and power overhead. Overall, the proposed aggressive scaling technique provides an improvement in power consumption and performance while increasing the security of processors from power analysis attacks.N/
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