Investigation of a novel multiresonant beam energy harvester and a complex conjugate matching circuit

The aim of the work described in this thesis is firstly to improve the collection of vibration energy for piezoelectric cantilever harvesters, by a mechanical technique, so that the devices can harvest energy over a wider bandwidth. Secondly to investigate a new circuit topology for achieving complex conjugate load matching to the piezoelectric harvester. The thesis has been divided into two parts - the mechanical approach and the electrical approach. For the mechanical approach, a novel multiresonant beam, comprising piezoelectric fiber composites on a clamped-clamped beam and side mounted cantilevers, was proposed. The side cantilevers are tuned by tip masses to be resonant at different frequencies. A Rayleigh-Ritz model was developed to predict the vibration response of the proposed model multiresonant beam. This model showed that the bandwidth of the multiresonant beam was increased over that of a single cantilever harvester. A multiresonant beam for energy harvesting was experimentally tested and compared with a single cantilever energy harvester. The transmissibility and voltage responses were investigated, the beam showed a wide frequency response between 14.5Hz and 31Hz, whereas the single cantilever only showed one resonant frequency. Therefore the multiresonant beam system is feasible for wide band energy harvesting. For the electrical approach, the task was to investigate complex conjugate impedance matching for the piezoelectric energy harvesters, so that the output impedance from the piezoelectric harvester can be reduced, and maximum energy extracted from the device with a possibility of frequency tuning. A new amplified inductor circuit was proposed to enable the capacitive output impedance of the piezoelectric device to be cancelled. Experimental and software simulations are provided to verify the theoretical predictions. A prototype amplified inductor circuit was simulated and tested. The results showed that a variable effective inductance was achieved. However the circuit is lossy due to imperfections within the system, and needs further work to eliminate these imperfections.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM

Reliability-aware circuit design to mitigate impact of device defects and variability in emerging memristor-based applications

In the last decades, semiconductor industry has fostered a fast downscale in technology, propelling the large scale integration of CMOS-based systems. The benefits in miniaturization are numerous, highlighting faster switching frequency, lower voltage supply and higher device density. However, this aggressive scaling trend it has not been without challenges, such as leakage currents, yield reduction or the increase in the overall system power dissipation. New materials, changes in the device structures and new architectures are key to keep the miniaturization trend. It is foreseen that 2D integration will eventually come to an insurmountable physical and economic limit, in which new strategic directions are required, such as the development of new device structures, 3D architectures or heterogeneous systems that takes advantage of the best of different technologies, both the ones already consolidated as well as emergent ones that provide performance and efficiency improvements in applications. In this context, memristor arises as one of several candidates in the race to find suitable emergent devices. Memristor, a blend of the words memory and resistor, is a passive device postulated by Leon Chua in 1971. In contrast with the other fundamental passive elements, memristors have the distinctive feature of modifying their resistance according to the charge that passes through these devices, and remaining unaltered when charge no longer flows. Although when it appeared no physical device implementation was acknowledged, HP Labs claimed in 2008 the manufacture of the first real memristor. This milestone triggered an unexpectedly high research activity about memristors, both in searching new materials and structures as well as in potential applications. Nowadays, memristors are not only appreciated in memory systems by their nonvolatile storage properties, but in many other fields, such as digital computing, signal processing circuits, or non-conventional applications like neuromorphic computing or chaotic circuits. In spite of their promising features, memristors show a primarily downside: they show significant device variation and limited lifetime due degradation compared with other alternatives. This Thesis explores the challenges that memristor variation and malfunction imposes in potential applications. The main goal is to propose circuits and strategies that either avoid reliability problems or take advantage of them. Throughout a collection of scenarios in which reliability issues are present, their impact is studied by means of simulations. This thesis is contextualized and their objectives are exposed in Chapter 1. In Chapter 2 the memristor is introduced, at both conceptual and experimental levels, and different compact levels are presented to be later used in simulations. Chapter 3 deepens in the phenomena that causes the lack of reliability in memristors, and models that include these defects in simulations are provided. The rest of the Thesis covers different applications. Therefore, Chapter 4 exhibits nonvolatile memory systems, and specifically an online test method for faulty cells. Digital computing is presented in Chapter 5, where a solution for the yield reduction in logic operations due to memristors variability is proposed. Lastly, Chapter 6 reviews applications in the analog domain, and it focuses in the exploitation of results observed in faulty memristor-based interconnect mediums for chaotic systems synchronization purposes. Finally, the Thesis concludes in Chapter 7 along with perspectives about future work.Este trabajo desarrolla un novedoso dispositivo condensador basado en el uso de la nanotecnología. El dispositivo parte del concepto existente de metal-aislador-metal (MIM), pero en lugar de una capa aislante continua, se utilizan nanopartículas dieléctricas. Las nanopartículas son principalmente de óxido de silicio (sílice) y poliestireno (PS) y los valores de diámetro son 255nm y 295nm respectivamente. Las nanopartículas contribuyen a una alta relación superficie/volumen y están fácilmente disponibles a bajo costo. La tecnología de depósito desarrollada en este trabajo se basa en la técnica de electrospray, que es una tecnología de fabricación ascendente (bottom-up) que permite el procesamiento por lotes y logra un buen compromiso entre una gran superficie y un bajo tiempo de depósito. Con el objetivo de aumentar la superficie de depósito, la configuración de electrospray ha sido ajustada para permitir áreas de depósito de 1cm2 a 25cm2. El dispositivo fabricado, los llamados condensadores de metal aislante de nanopartículas (NP-MIM) ofrecen valores de capacidad más altos que un condensador convencional similar con una capa aislante continua. En el caso de los NP-MIM de sílice, se alcanza un factor de hasta 1000 de mejora de la capacidad, mientras que los NP-MIM de poliestireno exhibe una ganancia de capacidad en el rango de 11. Además, los NP-MIM de sílice muestran comportamientos capacitivos en específicos rangos de frecuencias que depende de la humedad y el grosor de la capa de nanopartículas, mientras que los NP-MIM de poliestireno siempre mantienen su comportamiento capacitivo. Los dispositivos fabricados se han caracterizado mediante medidas de microscopía electrónica de barrido (SEM) complementadas con perforaciones de haz de iones focalizados (FIB) para caracterizar la topografía de los NP-MIMs. Los dispositivos también se han caracterizado por medidas de espectroscopia de impedancia, a diferentes temperaturas y humedades. El origen de la capacitancia aumentada está asociado en parte a la humedad en las interfaces de las nanopartículas. Se ha desarrollado un modelo de un circuito basado en elementos distribuidos para ajustar y predecir el comportamiento eléctrico de los NP-MIMs. En resumen, esta tesis muestra el diseño, fabricación, caracterización y modelización de un nuevo y prometedor condensador nanopartículas metal-aislante-metal que puede abrir el camino al desarrollo de una nueva tecnología de supercondensadores MIM.Postprint (published version