56,862 research outputs found

    A performance model of multicast communication in wormhole-routed networks on-chip

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    Collective communication operations form a part of overall traffic in most applications running on platforms employing direct interconnection networks. This paper presents a novel analytical model to compute communication latency of multicast as a widely used collective communication operation. The novelty of the model lies in its ability to predict the latency of the multicast communication in wormhole-routed architectures employing asynchronous multi-port routers scheme. The model is applied to the Quarc NoC and its validity is verified by comparing the model predictions against the results obtained from a discrete-event simulator developed using OMNET++

    A new degree six modified chordal ring network topology

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    The performance of a parallel or distributed network depends on the design of its interconnection topology. One good network interconnection topology that has been the focus of various researchers is the chordal ring. In this paper, a new degree six modified chordal ring is presented, the optimised degree six 3-modified chordal ring (CHR6o3), with the aim of comparing its performance parameters in terms of optimal diameter and optimal average path length to existing degree six chordal rings. Formulae to generate the data for each different chordal ring were derived from its corresponding tree visualisation or used from previous work. Network sizes tested were from 1200 to 12000 nodes. Large networks of CHR6o3 were shown to perform better than those of previous degree six chordal rings. This gives CHR6o3 an added advantage for its implementation in large distributive networks, such as Fibre to the Home (FTTH) networks, since it offers redundancies at higher network layers

    Shortest path routing algorithm for hierarchical interconnection network-on-chip

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    Interconnection networks play a significant role in efficient on-chip communication for multicore systems. This paper introduces a new interconnection topology called the Hierarchical Cross Connected Recursive network (HCCR) and a shortest path routing algorithm for the HCCR. Proposed topology offers a high degree of regularity, scalability, and symmetry with a reduced number of links and node degree. A unique address encoding scheme is proposed for hierarchical graphical representation of HCCR networks, and based on this scheme a shortest path routing algorithm is devised. The algorithm requires 5(k-1) time where k=logn4-2 and k>0, in worst case to determine the next node along the shortest path

    Power analysis with variable traffic loads for next generation interconnection networks

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    Power consumption is the most important factor for the consideration of next generation supercomputers. In addition, the requirement of power usages can be even scaled up to more than 300MW (which is nearly equal to the one nuclear power plant) with the conventional networks. On the other hand, hierarchical interconnection networks can be a possible solution to those issues. 3D-TTN is a hierarchical interconnection network where lowest level is configured as the 3Dtorus network, following the 2Dtorus network at the higher-level networks. The main focus for this paper is the power analysis with variable traffic load along with the fault tolerance, cost, packing density and message traffic density of 3D-TTN comparing against various other networks. In our early research, 3D-TTN has achieved near about 21% better diameter performance, 12% better average distance performance and eventually required about 32.48% less router power usage at the lowest level than the 5Dtorus network for 1% traffic load. This paper shows the power comparison with the router and link power rather than considering the router power only. Our analysis shows that 3DTTN will require about 39.96% less router and link power than the 5Dtorus network for 10% traffic. With 30% traffic load, 3DTTN will require about 38.42% less power than the 5Dtorus network for the on-chip network. Even considering some topological parameters, 3D-TTN could also achieve some desirable performance by comparing other networks

    Cycle-accurate evaluation of reconfigurable photonic networks-on-chip

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    There is little doubt that the most important limiting factors of the performance of next-generation Chip Multiprocessors (CMPs) will be the power efficiency and the available communication speed between cores. Photonic Networks-on-Chip (NoCs) have been suggested as a viable route to relieve the off- and on-chip interconnection bottleneck. Low-loss integrated optical waveguides can transport very high-speed data signals over longer distances as compared to on-chip electrical signaling. In addition, with the development of silicon microrings, photonic switches can be integrated to route signals in a data-transparent way. Although several photonic NoC proposals exist, their use is often limited to the communication of large data messages due to a relatively long set-up time of the photonic channels. In this work, we evaluate a reconfigurable photonic NoC in which the topology is adapted automatically (on a microsecond scale) to the evolving traffic situation by use of silicon microrings. To evaluate this system's performance, the proposed architecture has been implemented in a detailed full-system cycle-accurate simulator which is capable of generating realistic workloads and traffic patterns. In addition, a model was developed to estimate the power consumption of the full interconnection network which was compared with other photonic and electrical NoC solutions. We find that our proposed network architecture significantly lowers the average memory access latency (35% reduction) while only generating a modest increase in power consumption (20%), compared to a conventional concentrated mesh electrical signaling approach. When comparing our solution to high-speed circuit-switched photonic NoCs, long photonic channel set-up times can be tolerated which makes our approach directly applicable to current shared-memory CMPs
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