Synthesis of IDDQ-Testable Circuits: Integrating Built-in Current Sensors

"On-Chip" I_{DDQ} testing by the incorporation of Built-In Current (BIC) sensors has some advantages over "off-chip" techniques. However, the integration of sensors poses analog design problems which are hard to be solved by a digital designer. The automatic incorporation of the sensors using parameterized BIC cells could be a promising alternative. The work reported here identifies partitioning criteria to guide the synthesis of I_{DDQ}-testable circuits. The circuit must be partitioned, such that the defective I_{DDQ} is observable, and the power supply voltage perturbation is within specified limits. In addition to these constraints, also cost criteria are considered: circuit extra delay, area overhead of the BIC sensors, connectivity costs of the test circuitry, and the test application time. The parameters are estimated based on logical as well as electrical level information of the target cell library to be used in the technology mapping phase of the synthesis process. The resulting cost function is optimized by an evolution-based algorithm. When run over large benchmark circuits our method gives significantly superior results to those obtained using simpler and less comprehensive partitioning methods.Postprint (published version

Compressed Passive Macromodeling

This paper presents an approach for the extraction of passive macromodels of large-scale interconnects from their frequency-domain scattering responses. Here, large scale is intended both in terms of number of electrical ports and required dynamic model order. For such structures, standard approaches based on rational approximation via vector fitting and passivity enforcement via model perturbation may fail because of excessive computational requirements, both in terms of memory size and runtime. Our approach addresses this complexity by first reducing the redundancy in the raw scattering responses through a projection and approximation process based on a truncated singular value decomposition. Then we formulate a compressed rational fitting and passivity enforcement framework which is able to obtain speedup factors up to 2 and 3 orders of magnitude with respect to standard approaches, with full control over the approximation errors. Numerical results on a large set of benchmark cases demonstrate the effectiveness of the proposed techniqu

Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, stress-induced carrier mobility variation in TSV-based 3D ICs is examined. In the third work, temperature inside TSV-based 3D ICs is investigated. In the final work, the quality trade-offs of TSV-based 3D-IC designs are explored. In the first work, a force-directed, 3D, and gate-level placement algorithm that efficiently handles TSVs is developed. The experiments based on synthesized benchmarks indicate that the developed algorithm helps generate GDSII layouts of 3D-IC designs that are optimized in terms of wirelength. In addition, the impact of TSVs on other physical aspects of 3D-IC designs is also studied by analyzing the GDSII layouts. In the second work, the model for carrier mobility variation caused by TSV and STI stresses is developed as well as the timing analysis flow considering the stresses. The impact of TSV and STI stresses on carrier mobility variation and performance of 3D ICs is studied. Furthermore, a TSV-stress-driven, force-directed, and 3D placement algorithm is developed. It exploits carrier mobility variation, caused by stress around TSVs after fabrication, to improve the timing and area objectives during placement. In addition, the impact of keep-out zone (KOZ) around TSVs on stress, carrier mobility variation, area, wirelength, and performance of 3D ICs is studied. In the third work, two temperature-aware global placement algorithms are developed. They exploit die-to-die thermal coupling in 3D ICs to improve temperature during placement. In addition, a framework used to evaluate the results from temperature-aware global placements is developed. The main component of the framework is a GDSII-level thermal analysis that considers all structures inside a TSV-based 3D IC while computing temperature. The developed placers are compared with several state-of-the-art placers published in recent literature. The experimental results indicate that the developed algorithms help improve the temperature of 3D ICs effectively. In the final work, three block-level design styles for TSV-based die-to-wafer bonded 3D ICs are discussed. Several 3D-IC layouts in the three styles are manually designed. The main difference among these layouts is the position of TSVs. Finally, the area, wirelength, timing, power, temperature, and mechanical stress of all layouts are compared to explore the trade-offs of layout quality.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Mukhopadhyay, Saibal; Committee Member: Swaminathan, Madhava

A New Paradigm in Split Manufacturing: Lock the FEOL, Unlock at the BEOL

Split manufacturing was introduced as an effective countermeasure against hardware-level threats such as IP piracy, overbuilding, and insertion of hardware Trojans. Nevertheless, the security promise of split manufacturing has been challenged by various attacks, which exploit the well-known working principles of physical design tools to infer the missing BEOL interconnects. In this work, we advocate a new paradigm to enhance the security for split manufacturing. Based on Kerckhoff's principle, we protect the FEOL layout in a formal and secure manner, by embedding keys. These keys are purposefully implemented and routed through the BEOL in such a way that they become indecipherable to the state-of-the-art FEOL-centric attacks. We provide our secure physical design flow to the community. We also define the security of split manufacturing formally and provide the associated proofs. At the same time, our technique is competitive with current schemes in terms of layout overhead, especially for practical, large-scale designs (ITC'99 benchmarks).Comment: DATE 2019 (https://www.date-conference.com/conference/session/4.5

An advanced Framework for efficient IC optimization based on analytical models engine

En base als reptes sorgits a conseqüència de l'escalat de la tecnologia, la present tesis desenvolupa i analitza un conjunt d'eines orientades a avaluar la sensibilitat a la propagació d'esdeveniments SET en circuits microelectrònics. S'han proposant varies mètriques de propagació de SETs considerant l'impacto dels emmascaraments lògic, elèctric i combinat lògic-elèctric. Aquestes mètriques proporcionen una via d'anàlisi per quantificar tant les regions més susceptibles a propagar SETs com les sortides més susceptibles de rebre'ls. S'ha desenvolupat un conjunt d'algorismes de cerca de camins sensibilitzables altament adaptables a múltiples aplicacions, un sistema lògic especific i diverses tècniques de simplificació de circuits. S'ha demostrat que el retard d'un camí donat depèn dels vectors de sensibilització aplicats a les portes que formen part del mateix, essent aquesta variació de retard comparable a la atribuïble a les variacions paramètriques del proces.En base a los desafíos surgidos a consecuencia del escalado de la tecnología, la presente tesis desarrolla y analiza un conjunto de herramientas orientadas a evaluar la sensibilidad a la propagación de eventos SET en circuitos microelectrónicos. Se han propuesto varias métricas de propagación de SETs considerando el impacto de los enmascaramientos lógico, eléctrico y combinado lógico-eléctrico. Estas métricas proporcionan una vía de análisis para cuantificar tanto las regiones más susceptibles a propagar eventos SET como las salidas más susceptibles a recibirlos. Ha sido desarrollado un conjunto de algoritmos de búsqueda de caminos sensibilizables altamente adaptables a múltiples aplicaciones, un sistema lógico especifico y diversas técnicas de simplificación de circuitos. Se ha demostrado que el retardo de un camino dado depende de los vectores de sensibilización aplicados a las puertas que forman parte del mismo, siendo esta variación de retardo comparable a la atribuible a las variaciones paramétricas del proceso.Based on the challenges arising as a result of technology scaling, this thesis develops and evaluates a complete framework for SET propagation sensitivity. The framework comprises a number of processing tools capable of handling circuits with high complexity in an efficient way. Various SET propagation metrics have been proposed considering the impact of logic, electric and combined logic-electric masking. Such metrics provide a valuable vehicle to grade either in-circuit regions being more susceptible of propagating SETs toward the circuit outputs or circuit outputs more susceptible to produce SET. A quite efficient and customizable true path finding algorithm with a specific logic system has been constructed and its efficacy demonstrated on large benchmark circuits. It has been shown that the delay of a path depends on the sensitization vectors applied to the gates within the path. In some cases, this variation is comparable to the one caused by process parameters variation

Renyi entropies as a measure of the complexity of counting problems

Counting problems such as determining how many bit strings satisfy a given Boolean logic formula are notoriously hard. In many cases, even getting an approximate count is difficult. Here we propose that entanglement, a common concept in quantum information theory, may serve as a telltale of the difficulty of counting exactly or approximately. We quantify entanglement by using Renyi entropies S(q), which we define by bipartitioning the logic variables of a generic satisfiability problem. We conjecture that S(q\rightarrow 0) provides information about the difficulty of counting solutions exactly, while S(q>0) indicates the possibility of doing an efficient approximate counting. We test this conjecture by employing a matrix computing scheme to numerically solve #2SAT problems for a large number of uniformly distributed instances. We find that all Renyi entropies scale linearly with the number of variables in the case of the #2SAT problem; this is consistent with the fact that neither exact nor approximate efficient algorithms are known for this problem. However, for the negated (disjunctive) form of the problem, S(q\rightarrow 0) scales linearly while S(q>0) tends to zero when the number of variables is large. These results are consistent with the existence of fully polynomial-time randomized approximate algorithms for counting solutions of disjunctive normal forms and suggests that efficient algorithms for the conjunctive normal form may not exist.Comment: 13 pages, 4 figure

Synthetic biology: advancing biological frontiers by building synthetic systems

Advances in synthetic biology are contributing to diverse research areas, from basic biology to biomanufacturing and disease therapy. We discuss the theoretical foundation, applications, and potential of this emerging field