DTAPO: Dynamic thermal-aware performance optimization for dark silicon many-core systems

Future many-core systems need to handle high power density and chip temperature effectively. Some cores in many-core systems need to be turned off or ‘dark’ to manage chip power and thermal density. This phenomenon is also known as the dark silicon problem. This problem prevents many-core systems from utilizing and gaining improved performance from a large number of processing cores. This paper presents a dynamic thermal-aware performance optimization of dark silicon many-core systems (DTaPO) technique for optimizing dark silicon a many-core system performance under temperature constraint. The proposed technique utilizes both task migration and dynamic voltage frequency scaling (DVFS) for optimizing the performance of a many-core system while keeping system temperature in a safe operating limit. Task migration puts hot cores in low-power states and moves tasks to cooler dark cores to aggressively reduce chip temperature while maintaining high overall system performance. To reduce task migration overhead due to cold start, the source core (i.e., active core) keeps its L2 cache content during the initial migration phase. The destination core (i.e., dark core) can access it to reduce the impact of cold start misses. Moreover, the proposed technique limits tasks migration among cores that share the last level cache (LLC). In the case of major thermal violation and no cooler cores being available, DVFS is used to reduce the hot cores temperature gradually by reducing their frequency. Experimental results for different threshold temperatures show that DTaPO can keep the average system temperature below the thermal limit. Affirmatively, the execution time penalty is reduced by up to 18% compared with using only DVFS for all thermal thresholds. Moreover, the average peak temperature is reduced by up to 10.8◦ C. In addition, the experimental results show that DTaPO improves the system’s performance by up to 80% compared to optimal sprinting patterns (OSP) and reduces the temperature by up to 13.6◦ C

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

A survey of system level power management schemes in the dark-silicon era for many-core architectures

Power consumption in Complementary Metal Oxide Semiconductor (CMOS) technology has escalated to a point that only a fractional part of many-core chips can be powered-on at a time. Fortunately, this fraction can be increased at the expense of performance through the dark-silicon solution. However, with many-core integration set to be heading towards its thousands, power consumption and temperature increases per time, meaning the number of active nodes must be reduced drastically. Therefore, optimized techniques are demanded for continuous advancement in technology. Existing efforts try to overcome this challenge by activating nodes from different parts of the chip at the expense of communication latency. Other efforts on the other hand employ run-time power management techniques to manage the power performance of the cores trading-off performance for power. We found out that, for a significant amount of power to saved and high temperature to be avoided, focus should be on reducing the power consumption of all the on-chip components. Especially, the memory hierarchy and the interconnect. Power consumption can be minimized by, reducing the size of high leakage power dissipating elements, turning-off idle resources and integrating power saving materials