Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration

On Co-Optimization Of Constrained Satisfiability Problems For Hardware Software Applications

Manufacturing technology has permitted an exponential growth in transistor count and density. However, making efficient use of the available transistors in the design has become exceedingly difficult. Standard design flow involves synthesis, verification, placement and routing followed by final tape out of the design. Due to the presence of various undesirable effects like capacitive crosstalk, supply noise, high temperatures, etc., verification/validation of the design has become a challenging problem. Therefore, having a good design convergence may not be possible within the target time, due to a need for a large number of design iterations. Capacitive crosstalk is one of the major causes of design convergence problems in deep sub-micron era. With scaling, the number of crosstalk violations has been increasing because of reduced inter-wire distances. Consequently only the most severe crosstalk faults are fixed pre-silicon while the rest are tested post-silicon. Testing for capacitive crosstalk involves generation of input patterns which can be applied post-silicon to the integrated circuit and comparison of the output response. These patterns are generated at the gate/ Register Transfer Level (RTL) of abstraction using Automatic Test Pattern Generation (ATPG) tools. In this dissertation, anInteger Linear Programming (ILP) based ATPG technique for maximizing crosstalk induced delay increase at the victim net, for multiple aggressor crosstalk faults, is presented. Moreover, various solutions for pattern generation considering both zero as well as unit delay models is also proposed. With voltage scaling, power supply switching noise has become one of the leading causes of signal integrity related failures in deep sub-micron designs. Hence, during power supply network design and analysis of power supply switching noise, computation of peak supply current is an essential step. Traditional peak current estimation approaches involve addition of peak current associated with all the CMOS gates which are switching in a combinational circuit. Consequently, this approach does not take the Boolean and temporal relationships of the circuit into account. This work presents an ILP based technique for generation of an input pattern pair which maximizes switching supply currents for a combinational circuit in the presence of integer gate delays. The input pattern pair generated using the above approach can be applied post-silicon for power droop testing. With high level of integration, Multi-Processor Systems on Chip (MPSoC) feature multiple processor cores and accelerators on the same die, so as to exploit the instruction level parallelism in the application. For hardware-software co-design, application programming model is based on a Task Graph, which represents task dependencies and execution/transfer times for various threads and processes within an application. Mapping an application to an MPSoC traditionally involves representing it in the form of a task graph and employing static scheduling in order to minimize the schedule length. Dynamic system behavior is not taken into consideration during static scheduling, while dynamic scheduling requires the knowledge of task graph at runtime. A run-time task graph extraction heuristic to facilitate dynamic scheduling is also presented here. A novel game theory based approach uses this extracted task graph to perform run-time scheduling in order to minimize total schedule length. With increase in transistor density, power density has gone up substantially. This has lead to generation of regions with very high temperature called Hotspots. Hotspots lead to reliability and performance issues and affect design convergence. In current generation Integrated Circuits (ICs) temperature is controlled by reducing power dissipation using Dynamic Thermal Management (DTM) techniques like frequency and/or voltage scaling. These techniques are reactive in nature and have detrimental effects on performance. Here, a look-ahead based task migration technique is proposed, in order to utilize the multitude of cores available in an MPSoC to eliminate thermal emergencies. Our technique is based on temperature prediction, leveraging upon a novel wavelet based thermal modeling approach. Hence, this work addresses several optimization problems that can be reduced to constrained max-satisfiability, involving integer as well as Boolean constraints in hardware and software domains. Moreover, it provides domain specific heuristic solutions for each of them

Exploring the Mysteries of System-Level Test

System-level test, or SLT, is an increasingly important process step in today's integrated circuit testing flows. Broadly speaking, SLT aims at executing functional workloads in operational modes. In this paper, we consolidate available knowledge about what SLT is precisely and why it is used despite its considerable costs and complexities. We discuss the types or failures covered by SLT, and outline approaches to quality assessment, test generation and root-cause diagnosis in the context of SLT. Observing that the theoretical understanding for all these questions has not yet reached the level of maturity of the more conventional structural and functional test methods, we outline new and promising directions for methodical developments leveraging on recent findings from software engineering.Comment: 7 pages, 2 figure

Low-Capture-Power Test Generation for Scan-Based At-Speed Testing

Scan-based at-speed testing is a key technology to guarantee timing-related test quality in the deep submicron era. However, its applicability is being severely challenged since significant yield loss may occur from circuit malfunction due to excessive IR drop caused by high power dissipation when a test response is captured. This paper addresses this critical problem with a novel low-capture-power X-filling method of assigning 0\u27s and 1\u27s to unspecified (X) bits in a test cube obtained during ATPG. This method reduces the circuit switching activity in capture mode and can be easily incorporated into any test generation flow to achieve capture power reduction without any area, timing, or fault coverage impact. Test vectors generated with this practical method greatly improve the applicability of scan-based at-speed testing by reducing the risk of test yield lossIEEE International Conference on Test, 2005, 8 November 2005, Austin, TX, US

Test Strategies for Low Power Devices

Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German

Recent Trends and Perspectives on Defect-Oriented Testing

Electronics employed in modern safety-critical systems require severe qualification during the manufacturing process and in the field, to prevent fault effects from manifesting themselves as critical failures during mission operations. Traditional fault models are not sufficient anymore to guarantee the required quality levels for chips utilized in mission-critical applications. The research community and industry have been investigating new test approaches such as device-aware test, cell-aware test, path-delay test, and even test methodologies based on the analysis of manufacturing data to move the scope from OPPM to OPPB. This special session presents four contributions, from academic researchers and industry professionals, to enable better chip quality. We present results on various activities towards this objective, including device-aware test, software-based self-test, and memory test