Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Architectural Techniques to Enable Reliable and Scalable Memory Systems

High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is because we rely on technology scaling to improve memory density, and at small feature sizes, memory cells tend to break easily. Today, memory reliability is seen as the key impediment towards using high-density devices, adopting new technologies, and even building the next Exascale supercomputer. To ensure even a bare-minimum level of reliability, present-day solutions tend to have high performance, power and area overheads. Ideally, we would like memory systems to remain robust, scalable, and implementable while keeping the overheads to a minimum. This dissertation describes how simple cross-layer architectural techniques can provide orders of magnitude higher reliability and enable seamless scalability for memory systems while incurring negligible overheads.Comment: PhD thesis, Georgia Institute of Technology (May 2017

L2C2: Last-level compressed-contents non-volatile cache and a procedure to forecast performance and lifetime

Several emerging non-volatile (NV) memory technologies are rising as interesting alternatives to build the Last-Level Cache (LLC). Their advantages, compared to SRAM memory, are higher density and lower static power, but write operations wear out the bitcells to the point of eventually losing their storage capacity. In this context, this paper presents a novel LLC organization designed to extend the lifetime of the NV data array and a procedure to forecast in detail the capacity and performance of such an NV-LLC over its lifetime. From a methodological point of view, although different approaches are used in the literature to analyze the degradation of an NV-LLC, none of them allows to study in detail its temporal evolution. In this sense, this work proposes a forecasting procedure that combines detailed simulation and prediction, allowing an accurate analysis of the impact of different cache control policies and mechanisms (replacement, wear-leveling, compression, etc.) on the temporal evolution of the indices of interest, such as the effective capacity of the NV-LLC or the system IPC. We also introduce L2C2, a LLC design intended for implementation in NV memory technology that combines fault tolerance, compression, and internal write wear leveling for the first time. Compression is not used to store more blocks and increase the hit rate, but to reduce the write rate and increase the lifetime during which the cache supports near-peak performance. In addition, to support byte loss without performance drop, L2C2 inherently allows N redundant bytes to be added to each cache entry. Thus, L2C2+N, the endurance-scaled version of L2C2, allows balancing the cost of redundant capacity with the benefit of longer lifetime. For instance, as a use case, we have implemented the L2C2 cache with STT-RAM technology. It has affordable hardware overheads compared to that of a baseline NV-LLC without compression in terms of area, latency and energy consumption, and increases up to 6-37 times the time in which 50% of the effective capacity is degraded, depending on the variability in the manufacturing process. Compared to L2C2, L2C2+6 which adds 6 bytes of redundant capacity per entry, that means 9.1% of storage overhead, can increase up to 1.4-4.3 times the time in which the system gets its initial peak performance degraded

The Design of A High Capacity and Energy Efficient Phase Change Main Memory

Higher energy-efficiency has become essential in servers for a variety of reasons that range from heavy power and thermal constraints, environmental issues and financial savings. With main memory responsible for at least 30% of the energy consumed by a server, a low power main memory is fundamental to achieving this energy efficiency DRAM has been the technology of choice for main memory for the last three decades primarily because it traditionally combined relatively low power, high performance, low cost and high density. However, with DRAM nearing its density limit, alternative low-power memory technologies, such as Phase-change memory (PCM), have become a feasible replacement. PCM limitations, such as limited endurance and low write performance, preclude simple drop-in replacement and require new architectures and algorithms to be developed. A PCM main memory architecture (PMMA) is introduced in this dissertation, utilizing both DRAM and PCM, to create an energy-efficient main memory that is able to replace a DRAM-only memory. PMMA utilizes a number of techniques and architectural changes to achieve a level of performance that is par with DRAM. PMMA achieves gains in energy-delay of up to 65%, with less than 5% of performance loss and extremely high energy gains. To address the other major shortcoming of PCM, namely limited endurance, a novel, low- overhead wear-leveling algorithm that builds on PMMA is proposed that increases the lifetime of PMMA to match the expected server lifetime so that both server and memory subsystems become obsolete at about the same time. We also study how to better use the excess capacity, traditionally available on PCM devices, to obtain the highest lifetime possible. We show that under specific endurance distributions, the naive choice does not achieve the highest lifetime. We devise rules that empower the designer to select algorithms and parameters to achieve higher lifetime or simplify the design knowing the impact on the lifetime. The techniques presented also apply to other storage class memories (SCM) memories that suffer from limited endurance

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Fault- and Yield-Aware On-Chip Memory Design and Management

Ever decreasing device size causes more frequent hard faults, which becomes a serious burden to processor design and yield management. This problem is particularly pronounced in the on-chip memory which consumes up to 70% of a processor' s total chip area. Traditional circuit-level techniques, such as redundancy and error correction code, become less effective in error-prevalent environments because of their large area overhead. In this work, we suggest an architectural solution to building reliable on-chip memory in the future processor environment. Our approaches have two parts, a design framework and architectural techniques for on-chip memory structures. Our design framework provides important architectural evaluation metrics such as yield, area, and performance based on low level defects and process variations parameters. Processor architects can quickly evaluate their designs' characteristics in terms of yield, area, and performance. With the framework, we develop architectural yield enhancement solutions for on-chip memory structures including L1 cache, L2 cache and directory memory. Our proposed solutions greatly improve yield with negligible area and performance overhead. Furthermore, we develop a decoupled yield model of compute cores and L2 caches in CMPs, which show that there will be many more L2 caches than compute cores in a chip. We propose efficient utilization techniques for excess caches. Evaluation results show that excess caches significantly improve overall performance of CMPs

Doctor of Philosophy in Computing

dissertationThe demand for main memory capacity has been increasing for many years and will continue to do so. In the past, Dynamic Random Access Memory (DRAM) process scaling has enabled this increase in memory capacity. Along with continued DRAM scaling, the emergence of new technologies like 3D-stacking, buffered Dual Inline Memory Modules (DIMMs), and crosspoint nonvolatile memory promise to continue this trend in the years ahead. However, these technologies will bring with them their own gamut of problems. In this dissertation, I look at the problems facing these technologies from a current delivery perspective. 3D-stacking increases memory capacity available per package, but the increased current requirement means that more pins on the package have to be now dedicated to provide Vdd/Vss, hence increasing cost. At the system level, using buffered DIMMs to increase the number of DRAM ranks increases the peak current requirements of the system if all the DRAM chips in the system are Refreshed simultaneously. Crosspoint memories promise to greatly increase bit densities but have long read latencies because of sneak currents in the cross-bar. In this dissertation, I provide architectural solutions to each of these problems. We observe that smart data placement by the architecture and the Operating System (OS) is a vital ingredient in all of these solutions. We thereby mitigate major bottlenecks in these technologies, hence enabling higher memory densities

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd

Exploiting Adaptive Techniques to Improve Processor Energy Efficiency

Rapid device-miniaturization keeps on inducing challenges in building energy efficient microprocessors. As the size of the transistors continuously decreasing, more uncertainties emerge in their operations. On the other hand, integrating more and more transistors on a single chip accentuates the need to lower its supply-voltage. This dissertation investigates one of the primary device uncertainties - timing error, in microprocessor performance bottleneck in NTC era. Then it proposes various innovative techniques to exploit these opportunities to maintain processor energy efficiency, in the context of emerging challenges. Evaluated with the cross-layer methodology, the proposed approaches achieve substantial improvements in processor energy efficiency, compared to other start-of-art techniques

Exploiting Natural On-chip Redundancy for Energy Efficient Memory and Computing

Power density is currently the primary design constraint across most computing segments and the main performance limiting factor. For years, industry has kept power density constant, while increasing frequency, lowering transistors supply (Vdd) and threshold (Vth) voltages. However, Vth scaling has stopped because leakage current is exponentially related to it. Transistor count and integration density keep doubling every process generation (Moore’s Law), but the power budget caps the amount of hardware that can be active at the same time, leading to dark silicon. With each new generation, there are more resources available, but we cannot fully exploit their performance potential. In the last years, different research trends have explored how to cope with dark silicon and unlock the energy efficiency of the chips, including Near-Threshold voltage Computing (NTC) and approximate computing. NTC aggressively lowers Vdd to values near Vth. This allows a substantial reduction in power, as dynamic power scales quadratically with supply voltage. The resultant power reduction could be used to activate more chip resources and potentially achieve performance improvements. Unfortunately, Vdd scaling is limited by the tight functionality margins of on-chip SRAM transistors. When scaling Vdd down to values near-threshold, manufacture-induced parameter variations affect the functionality of SRAM cells, which eventually become not reliable. A large amount of emerging applications, on the other hand, features an intrinsic error-resilience property, tolerating a certain amount of noise. In this context, approximate computing takes advantage of this observation and exploits the gap between the level of accuracy required by the application and the level of accuracy given by the computation, providing that reducing the accuracy translates into an energy gain. However, deciding which instructions and data and which techniques are best suited for approximation still poses a major challenge. This dissertation contributes in these two directions. First, it proposes a new approach to mitigate the impact of SRAM failures due to parameter variation for effective operation at ultra-low voltages. We identify two levels of natural on-chip redundancy: cache level and content level. The first arises because of the replication of blocks in multi-level cache hierarchies. We exploit this redundancy with a cache management policy that allocates blocks to entries taking into account the nature of the cache entry and the use pattern of the block. This policy obtains performance improvements between 2% and 34%, with respect to block disabling, a technique with similar complexity, incurring no additional storage overhead. The latter (content level redundancy) arises because of the redundancy of data in real world applications. We exploit this redundancy compressing cache blocks to fit them in partially functional cache entries. At the cost of a slight overhead increase, we can obtain performance within 2% of that obtained when the cache is built with fault-free cells, even if more than 90% of the cache entries have at least a faulty cell. Then, we analyze how the intrinsic noise tolerance of emerging applications can be exploited to design an approximate Instruction Set Architecture (ISA). Exploiting the ISA redundancy, we explore a set of techniques to approximate the execution of instructions across a set of emerging applications, pointing out the potential of reducing the complexity of the ISA, and the trade-offs of the approach. In a proof-of-concept implementation, the ISA is shrunk in two dimensions: Breadth (i.e., simplifying instructions) and Depth (i.e., dropping instructions). This proof-of-concept shows that energy can be reduced on average 20.6% at around 14.9% accuracy loss