Engineering Education and Research Using MATLAB

MATLAB is a software package used primarily in the field of engineering for signal processing, numerical data analysis, modeling, programming, simulation, and computer graphic visualization. In the last few years, it has become widely accepted as an efficient tool, and, therefore, its use has significantly increased in scientific communities and academic institutions. This book consists of 20 chapters presenting research works using MATLAB tools. Chapters include techniques for programming and developing Graphical User Interfaces (GUIs), dynamic systems, electric machines, signal and image processing, power electronics, mixed signal circuits, genetic programming, digital watermarking, control systems, time-series regression modeling, and artificial neural networks

Efficient Modelling and Simulation Methodology for the Design of Heterogeneous Mixed-Signal Systems on Chip

Systems on Chip (SoCs) and Systems in Package (SiPs) are key parts of a continuously broadening range of products, from chip cards and mobile phones to cars. Besides an increasing amount of digital hardware and software for data processing and storage, they integrate more and more analogue/RF circuits, sensors, and actuators to interact with their (analogue) environment. This trend towards more complex and heterogeneous systems with more intertwined functionalities is made possible by the continuous advances in the manufacturing technologies and pushed by market demand for new products and product variants. Therefore, the reuse and retargeting of existing component designs becomes more and more important. However, all these factors make the design process increasingly complex and multidisciplinary. Nowadays, the design of the individual components is usually well understood and optimised through the usage of a diversity of CAD/EDA tools, design languages, and data formats. These are based on applying specific modelling/abstraction concepts, description formalisms (also called Models of Computation (MoCs)) and analysis/simulation methods. The designer has to bridge the gaps between tools and methodologies using manual conversion of models and proprietary tool couplings/integrations, which is error-prone and time-consuming. A common design methodology and platform to manage, exchange, and collaboratively develop models of different formats and of different levels of abstraction is missing. The verification of the overall system is a big problem, as it requires the availability of compatible models for each component at the right level of abstraction to achieve satisfying results with respect to the system functionality and test coverage, but at the same time acceptable simulation performance in terms of accuracy and speed. Thus, the big challenge is the parallel integration of these very different part design processes. Therefore, the designers need a common design and simulation platform to create and refine an executable specification of the overall system (a virtual prototype) on a high level of abstraction, which supports different MoCs. This makes possible the exploration of different architecture options, estimation of the performance, validation of re-used parts, verification of the interfaces between heterogeneous components and interoperability with other systems as well as the assessment of the impacts of the future working environment and the manufacturing technologies used to realise the system. For embedded Analogue and Mixed-Signal (AMS) systems, the C++-based SystemC with its AMS extensions, to which recent standardisation the author contributed, is currently establishing itself as such a platform. This thesis describes the author's contribution to solve the modelling and simulation challenges mentioned above in three thematic phases. In the first phase, the prototype of a web-based platform to collect models from different domains and levels of abstraction together with their associated structural and semantical meta information has been developed and is called ModelLib. This work included the implementation of a hierarchical access control mechanism, which is able to protect the Intellectual Property (IP) constituted by the model at different levels of detail. The use cases developed for this tool show how it can support the AMS SoC design process by fostering the reuse and collaborative development of models for tasks like architecture exploration, system validation, and creation of more and more elaborated models of the system. The experiences from the ModelLib development delivered insight into which aspects need to be especially addressed throughout the development of models to make them reusable: mainly flexibility, documentation, and validation. This was the starting point for the development of an efficient modelling methodology for the top-down design and bottom-up verification of RF Systems based on the systematic usage of behavioural models in the second phase. One outcome is the developed library of well documented, parameterisable, and pin-accurate VHDL-AMS models of typical analogue/digital/RF components of a transceiver. The models offer the designer two sets of parameters: one based on the performance specifications and one based on the device parameters back-annotated from the transistor-level implementation. The abstraction level used for the description of the respective analogue/digital/RF component behaviour has been chosen to achieve a good trade-off between accuracy, fidelity, and simulation performance. The pin-accurate model interfaces facilitate the integration of transistor-level models for the validation of the behavioural models or the verification of a component implementation in the system context. These properties make the models suitable for different design tasks such as architecture exploration or overall system validation. This is demonstrated on a model of a binary Frequency-Shift Keying (FSK) transmitter parameterised to meet very different target specifications. This project showed also the limits in terms of abstraction and simulation performance of the "classical" AMS Hardware Description Languages (HDLs). Therefore, the third and last phase was dedicated to further raise the abstraction level for the description of complex and heterogeneous AMS SoCs and thus enable their efficient simulation using different synchronised MoCs. This work uses the C++-based simulation framework SystemC with its AMS extensions. New modelling capabilities going beyond the standardised SystemC AMS extensions have been introduced to describe energy conserving multi-domain systems in a formal and consistent way at a high level of abstraction. To this end, all constants, variables, and parameters of the system model, which represent a physical quantity, can now declare their dimension and associated system of units as an intrinsic part of their data type. Assignments to them need to contain besides the value also the correct measurement unit. This allows a much more precise but still compact definition of the models' interfaces and equations. Thus, the C++ compiler can check the correct assembly of the components and the coherency of the equations by means of dimensional analysis. The implementation is based on the Boost.Units library, which employs template metaprogramming techniques. A dedicated filter for the measurement units data types has been implemented to simplify the compiler messages and thus facilitate the localisation of unit errors. To ensure the reusability of models despite precisely defined interfaces, their interfaces and behaviours need to be parametrisable in a well-defined manner. The enabling implementation techniques for this have been demonstrated with the developed library of generic block diagram component models for the Timed Data Flow (TDF) MoC of the SystemC AMS extensions. These techniques are also the key to integrate a new MoC based on the bond graph formalism into the SystemC AMS extensions. Bond graphs facilitate the unified description of the energy conserving parts of heterogeneous systems with the help of a small set of modelling primitives parametrisable to the physical domain. The resulting models have a simulation performance comparable to an equivalent signal flow model

Advanced DSP Techniques for High-Capacity and Energy-Efficient Optical Fiber Communications

The rapid proliferation of the Internet has been driving communication networks closer and closer to their limits, while available bandwidth is disappearing due to an ever-increasing network load. Over the past decade, optical fiber communication technology has increased per fiber data rate from 10 Tb/s to exceeding 10 Pb/s. The major explosion came after the maturity of coherent detection and advanced digital signal processing (DSP). DSP has played a critical role in accommodating channel impairments mitigation, enabling advanced modulation formats for spectral efficiency transmission and realizing flexible bandwidth. This book aims to explore novel, advanced DSP techniques to enable multi-Tb/s/channel optical transmission to address pressing bandwidth and power-efficiency demands. It provides state-of-the-art advances and future perspectives of DSP as well

A Low-Power DSP Architecture for a Fully Implantable Cochlear Implant System-on-a-Chip.

The National Science Foundation Wireless Integrated Microsystems (WIMS) Engineering Research Center at the University of Michigan developed Systems-on-a-Chip to achieve biomedical implant and environmental monitoring functionality in low-milliwatt power consumption and 1-2 cm3 volume. The focus of this work is implantable electronics for cochlear implants (CIs), surgically implanted devices that utilize existing nerve connections between the brain and inner-ear in cases where degradation of the sensory hair cells in the cochlea has occurred. In the absence of functioning hair cells, a CI processes sound information and stimulates the nderlying nerve cells with currents from implanted electrodes, enabling the patient to understand speech. As the brain of the WIMS CI, the WIMS microcontroller unit (MCU) delivers the communication, signal processing, and storage capabilities required to satisfy the aggressive goals set forth. The 16-bit MCU implements a custom instruction set architecture focusing on power-efficient execution by providing separate data and address register windows, multi-word arithmetic, eight addressing modes, and interrupt and subroutine support. Along with 32KB of on-chip SRAM, a low-power 512-byte scratchpad memory is utilized by the WIMS custom compiler to obtain an average of 18% energy savings across benchmarks. A synthesizable dynamic frequency scaling circuit allows the chip to select a precision on-chip LC or ring oscillator, and perform clock scaling to minimize power dissipation; it provides glitch-free, software-controlled frequency shifting in 100ns, and dissipates only 480μW. A highly flexible and expandable 16-channel Continuous Interleaved Sampling Digital Signal Processor (DSP) is included as an MCU peripheral component. Modes are included to process data, stimulate through electrodes, and allow experimental stimulation or processing. The entire WIMS MCU occupies 9.18mm2 and consumes only 1.79mW from 1.2V in DSP mode. This is the lowest reported consumption for a cochlear DSP. Design methodologies were analyzed and a new top-down design flow is presented that encourages hardware and software co-design as well as cross-domain verification early in the design process. An O(n) technique for energy-per-instruction estimations both pre- and post-silicon is presented that achieves less than 4% error across benchmarks. This dissertation advances low-power system design while providing an improvement in hearing recovery devices.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91488/1/emarsman_1.pd

Measurements, Models, Systems and Design

531 s.

Innovative Technologies and Services for Smart Cities

A smart city is a modern technology-driven urban area which uses sensing devices, information, and communication technology connected to the internet of things (IoTs) for the optimum and efficient utilization of infrastructures and services with the goal of improving the living conditions of citizens. Increasing populations, lower budgets, limited resources, and compatibility of the upgraded technologies are some of the few problems affecting the implementation of smart cities. Hence, there is continuous advancement regarding technologies for the implementation of smart cities. The aim of this Special Issue is to report on the design and development of integrated/smart sensors, a universal interfacing platform, along with the IoT framework, extending it to next-generation communication networks for monitoring parameters of interest with the goal of achieving smart cities. The proposed universal interfacing platform with the IoT framework will solve many challenging issues and significantly boost the growth of IoT-related applications, not just in the environmental monitoring domain but in the other key areas, such as smart home, assistive technology for the elderly care, smart city with smart waste management, smart E-metering, smart water supply, intelligent traffic control, smart grid, remote healthcare applications, etc., signifying benefits for all countries