Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Automatically Parallelizing Embedded Legacy Software on Soft-Core SoCs

Nowadays, embedded systems are utilized in many areas and become omnipresent, making people's lives more comfortable. Embedded systems have to handle more and more functionality in many products. To maintain the often required low energy consumption, multi-core systems provide high performance at moderate energy consumption. The development started with dual-core processors and has today reached many-core designs with dozens and hundreds of processor cores. However, existing applications can barely leverage the potential of that many cores. Legacy applications are usually written sequentially and thus typically use only one processor core. Thus, these applications do not benefit from the advantages provided by modern many-core systems. Rewriting those applications to use multiple cores requires new skills from developers and it is also time-consuming and highly error prone. Dozens of languages, APIs and compilers have already been presented in the past decades to aid the user with parallelizing applications. Fully automatic parallelizing compilers are seen as the holy grail, since the user effort is kept minimal. However, automatic parallelizers often cannot extract parallelism as good as user aided approaches. Most of these parallelization tools are designed for desktop and high-performance systems and are thus not tuned or applicable for low performance embedded systems. To improve this situation, this work presents an automatic parallelizer for embedded systems, which is able to mostly deliver better quality than user aided approaches and if not allows easy manual fine-tuning. Parallelization tools extract concurrently executable tasks from an application. These tasks can then be executed on different processor cores. Parallelization tools and automatic parallelizers in particular often struggle to efficiently map the extracted parallelism to an existing multi-core processor. This work uses soft-core processors on FPGAs, which makes it possible to realize custom multi-core designs in hardware, within a few minutes. This allows to adapt the multi-core processor to the characteristics of the extracted parallelism. Especially, core-interconnects for communication can be optimized to fit the communication pattern of the parallel application. Embedded applications are often structured as follows: receive input data, (multiple) data processing steps, data output. The multiple processing steps are often realized as consecutive loosely coupled transformations. These steps naturally already model the structure of a processing pipeline. It is the goal of this work to extract this kind of pipeline-parallelism from an application and map it to multiple cores to increase the overall throughput of the system. Multiple cores forming a chain with direct communication channels ideally fit this pattern. The previously described, so called pipeline-parallelism is a barely addressed concept in most parallelization tools. Also, current multi-core designs often do not support the hardware flexibility provided by soft-cores, targeted in this approach. The main contribution of this work is an automatic parallelizer which is able to map different processing steps from the source-code of a sequential application to different cores in a multi-core pipeline. Users only specify the required processing speed after parallelization. The developed tool tries to extract a matching parallelized software design along with a custom multi-core design out of sequential embedded legacy applications. The automatically created multi-core system already contains used peripherals extracted from the source-code and is ready to be used. The presented parallelizer implements multi-objective optimization to generate a minimal hardware design, just fulfilling the user defined requirement. To the best of my knowledge, the possibility to generate such a multi-core pipeline defined by the demands of the parallelized software has never been presented before. The approach is implemented for two soft-core processors and evaluation shows for both targets high speedups of 12x and higher at a reasonable hardware overhead. Compared to other automatic parallelizers, which mainly focus on speedups through latency reduction, significantly higher speedups can be achieved depending on the given application structure

A domain-extensible compiler with controllable automation of optimisations

In high performance domains like image processing, physics simulation or machine learning, program performance is critical. Programmers called performance engineers are responsible for the challenging task of optimising programs. Two major challenges prevent modern compilers targeting heterogeneous architectures from reliably automating optimisation. First, domain specific compilers such as Halide for image processing and TVM for machine learning are difficult to extend with the new optimisations required by new algorithms and hardware. Second, automatic optimisation is often unable to achieve the required performance, and performance engineers often fall back to painstaking manual optimisation. This thesis shows the potential of the Shine compiler to achieve domain-extensibility, controllable automation, and generate high performance code. Domain-extensibility facilitates adapting compilers to new algorithms and hardware. Controllable automation enables performance engineers to gradually take control of the optimisation process. The first research contribution is to add 3 code generation features to Shine, namely: synchronisation barrier insertion, kernel execution, and storage folding. Adding these features requires making novel design choices in terms of compiler extensibility and controllability. The rest of this thesis builds on these features to generate code with competitive runtime compared to established domain-specific compilers. The second research contribution is to demonstrate how extensibility and controllability are exploited to optimise a standard image processing pipeline for corner detection. Shine achieves 6 well-known image processing optimisations, 2 of them not being supported by Halide. Our results on 4 ARM multi-core CPUs show that the code generated by Shine for corner detection runs up to 1.4× faster than the Halide code. However, we observe that controlling rewriting is tedious, motivating the need for more automation. The final research contribution is to introduce sketch-guided equality saturation, a semiautomated technique that allows performance engineers to guide program rewriting by specifying rewrite goals as sketches: program patterns that leave details unspecified. We evaluate this approach by applying 7 realistic optimisations of matrix multiplication. Without guidance, the compiler fails to apply the 5 most complex optimisations even given an hour and 60GB of RAM. With the guidance of at most 3 sketch guides, each 10 times smaller than the complete program, the compiler applies the optimisations in seconds using less than 1GB