375 research outputs found
A FPGA-Based Reconfigurable Software Architecture for Highly Dependable Systems
Nowadays, systems-on-chip are commonly equipped with reconfigurable hardware. The use of hybrid architectures based on a mixture of general purpose processors and reconfigurable components has gained importance across the scientific community allowing a significant improvement of computational performance. Along with the demand for performance, the great sensitivity of reconfigurable hardware devices to physical defects lead to the request of highly dependable and fault tolerant systems. This paper proposes an FPGA-based reconfigurable software architecture able to abstract the underlying hardware platform giving an homogeneous view of it. The abstraction mechanism is used to implement fault tolerance mechanisms with a minimum impact on the system performanc
DeSyRe: on-Demand System Reliability
The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints
Software-Based Self-Test of Set-Associative Cache Memories
Embedded microprocessor cache memories suffer from limited observability and controllability creating problems during in-system tests. This paper presents a procedure to transform traditional march tests into software-based self-test programs for set-associative cache memories with LRU replacement. Among all the different cache blocks in a microprocessor, testing instruction caches represents a major challenge due to limitations in two areas: 1) test patterns which must be composed of valid instruction opcodes and 2) test result observability: the results can only be observed through the results of executed instructions. For these reasons, the proposed methodology will concentrate on the implementation of test programs for instruction caches. The main contribution of this work lies in the possibility of applying state-of-the-art memory test algorithms to embedded cache memories without introducing any hardware or performance overheads and guaranteeing the detection of typical faults arising in nanometer CMOS technologie
Programmable built-in self-testing of embedded RAM clusters in system-on-chip architectures
Multiport memories are widely used as embedded cores in all communication system-on-chip devices. Due to their high complexity and very low accessibility, built-in self-test (BIST) is the most common solution implemented to test the different memories embedded in the system. This article presents a programmable BIST architecture based on a single microprogrammable BIST processor and a set of memory wrappers designed to simplify the test of a system containing a large number of distributed multiport memories of different sizes (number of bits, number of words), access protocols (asynchronous, synchronous), and timing
Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip
Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips.
To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability.
Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield.
With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle.
To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired.
In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements
IEEE Standard 1500 Compliance Verification for Embedded Cores
Core-based design and reuse are the two key elements for an efficient system-on-chip (SoC) development. Unfortunately, they also introduce new challenges in SoC testing, such as core test reuse and the need of a common test infrastructure working with cores originating from different vendors. The IEEE 1500 Standard for Embedded Core Testing addresses these issues by proposing a flexible hardware test wrapper architecture for embedded cores, together with a core test language (CTL) used to describe the implemented wrapper functionalities. Several intellectual property providers have already announced IEEE Standard 1500 compliance in both existing and future design blocks. In this paper, we address the problem of guaranteeing the compliance of a wrapper architecture and its CTL description to the IEEE Standard 1500. This step is mandatory to fully trust the wrapper functionalities in applying the test sequences to the core. We present a systematic methodology to build a verification framework for IEEE Standard 1500 compliant cores, allowing core providers and/or integrators to verify the compliance of their products (sold or purchased) to the standar
FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE
The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test
(DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification
Innovative Techniques for Testing and Diagnosing SoCs
We rely upon the continued functioning of many electronic devices for our everyday welfare,
usually embedding integrated circuits that are becoming even cheaper and smaller
with improved features. Nowadays, microelectronics can integrate a working computer
with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC).
SoCs are also employed on automotive safety-critical applications, but need to be tested
thoroughly to comply with reliability standards, in particular the ISO26262 functional
safety for road vehicles.
The goal of this PhD. thesis is to improve SoC reliability by proposing innovative
techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals,
and GPUs. The proposed approaches in the sequence appearing in this thesis are described
as follows:
1. Embedded Memory Diagnosis: Memories are dense and complex circuits which
are susceptible to design and manufacturing errors. Hence, it is important to understand
the fault occurrence in the memory array. In practice, the logical and physical
array representation differs due to an optimized design which adds enhancements to
the device, namely scrambling. This part proposes an accurate memory diagnosis
by showing the efforts of a software tool able to analyze test results, unscramble
the memory array, map failing syndromes to cell locations, elaborate cumulative
analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing
syndromes were analyzed as case studies gathered on an industrial automotive
32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually,
and results were confirmed by real photos taken from a microscope.
2. Functional Test Pattern Generation: The key for a successful test is the pattern applied
to the device. They can be structural or functional; the former usually benefits
from embedded test modules targeting manufacturing errors and is only effective
before shipping the component to the client. The latter, on the other hand, can be
applied during mission minimally impacting on performance but is penalized due
to high generation time. However, functional test patterns may benefit for having
different goals in functional mission mode. Part III of this PhD thesis proposes
three different functional test pattern generation methods for CPU cores embedded
in SoCs, targeting different test purposes, described as follows:
a. Functional Stress Patterns: Are suitable for optimizing functional stress during
I
Operational-life Tests and Burn-in Screening for an optimal device reliability
characterization
b. Functional Power Hungry Patterns: Are suitable for determining functional
peak power for strictly limiting the power of structural patterns during manufacturing
tests, thus reducing premature device over-kill while delivering high test
coverage
c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns
with functional ones, allowing its execution periodically during mission.
In addition, an external hardware communicating with a devised SBST was proposed.
It helps increasing in 3% the fault coverage by testing critical Hardly
Functionally Testable Faults not covered by conventional SBST patterns.
An automatic functional test pattern generation exploiting an evolutionary algorithm
maximizing metrics related to stress, power, and fault coverage was employed
in the above-mentioned approaches to quickly generate the desired patterns. The
approaches were evaluated on two industrial cases developed by STMicroelectronics;
8051-based and a 32-bit Power Architecture SoCs. Results show that generation
time was reduced upto 75% in comparison to older methodologies while
increasing significantly the desired metrics.
3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices
are suitable for generating structural patterns, testing and activating mitigation techniques,
and validating robust hardware and software applications. GPGPUs are
known for fast parallel computation used in high performance computing and advanced
driver assistance where reliability is the key point. Moreover, GPGPU manufacturers
do not provide design description code due to content secrecy. Therefore,
commercial fault injectors using the GPGPU model is unfeasible, making radiation
tests the only resource available, but are costly. In the last part of this thesis, we
propose a software implemented fault injector able to inject bit-flip in memory elements
of a real GPGPU. It exploits a software debugger tool and combines the
C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in
program variables. The goal is to validate robust parallel algorithms by studying
fault propagation or activating redundancy mechanisms they possibly embed. The
effectiveness of the tool was evaluated on two robust applications: redundant parallel
matrix multiplication and floating point Fast Fourier Transform
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