149 research outputs found
Dependable reconfigurable multi-sensor poles for security
Wireless sensor network poles for security monitoring under harsh environments require a very high dependability as they are safety-critical [1]. An example of a multi-sensor pole is shown. Crucial attribute in these systems for security, especially in harsh environment, is a high robustness and guaranteed availability during lifetime. This environment could include molest. In this paper, two approaches are used which are applied simultaneously but are developed in different projects. \u
On-chip delay measurement for in-field test of FPGAs
Avoidance of delay-related failures due to aging phenomena is an important issue of current VLSI systems. Delay measurement in field is effective for detection of aging-induced delay increase. This paper proposes a delay measurement method using BIST (Built-In Self-Test) in an FPGA. The proposed method consists of variable test timing generation using an embedded PLL, BIST-based delay measurement, and correction of the measured delay with reflecting temperature variance in field. In on-chip delay measurement of the proposed method, the fastest operating speed is checked by repeating delay test with several test timings. Because circuit delay is influenced by temperature during measurement, the measured delay is then corrected according to the temperature during testing. Based on test log including the corrected delay, delay degradation and aging detection can be grasped. In evaluation experiments of the propose method implemented on an Intel Cyclone IV FPGA device (60nm technology), variable test timing generation realized 96 ps timing step resolution (that is below 1% of the system clock), correction process for measured delay could reduce influence of temperature variation. Furthermore, its feasibility of the proposed method for aging detection is discussed in this paper.24th IEEE Pacific Rim International Symposium on Dependable Computing (PRDC 2019), December 1-3, 2019, Kyoto, Japa
Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip
Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips.
To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability.
Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield.
With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle.
To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired.
In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements
Innovative Techniques for Testing and Diagnosing SoCs
We rely upon the continued functioning of many electronic devices for our everyday welfare,
usually embedding integrated circuits that are becoming even cheaper and smaller
with improved features. Nowadays, microelectronics can integrate a working computer
with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC).
SoCs are also employed on automotive safety-critical applications, but need to be tested
thoroughly to comply with reliability standards, in particular the ISO26262 functional
safety for road vehicles.
The goal of this PhD. thesis is to improve SoC reliability by proposing innovative
techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals,
and GPUs. The proposed approaches in the sequence appearing in this thesis are described
as follows:
1. Embedded Memory Diagnosis: Memories are dense and complex circuits which
are susceptible to design and manufacturing errors. Hence, it is important to understand
the fault occurrence in the memory array. In practice, the logical and physical
array representation differs due to an optimized design which adds enhancements to
the device, namely scrambling. This part proposes an accurate memory diagnosis
by showing the efforts of a software tool able to analyze test results, unscramble
the memory array, map failing syndromes to cell locations, elaborate cumulative
analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing
syndromes were analyzed as case studies gathered on an industrial automotive
32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually,
and results were confirmed by real photos taken from a microscope.
2. Functional Test Pattern Generation: The key for a successful test is the pattern applied
to the device. They can be structural or functional; the former usually benefits
from embedded test modules targeting manufacturing errors and is only effective
before shipping the component to the client. The latter, on the other hand, can be
applied during mission minimally impacting on performance but is penalized due
to high generation time. However, functional test patterns may benefit for having
different goals in functional mission mode. Part III of this PhD thesis proposes
three different functional test pattern generation methods for CPU cores embedded
in SoCs, targeting different test purposes, described as follows:
a. Functional Stress Patterns: Are suitable for optimizing functional stress during
I
Operational-life Tests and Burn-in Screening for an optimal device reliability
characterization
b. Functional Power Hungry Patterns: Are suitable for determining functional
peak power for strictly limiting the power of structural patterns during manufacturing
tests, thus reducing premature device over-kill while delivering high test
coverage
c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns
with functional ones, allowing its execution periodically during mission.
In addition, an external hardware communicating with a devised SBST was proposed.
It helps increasing in 3% the fault coverage by testing critical Hardly
Functionally Testable Faults not covered by conventional SBST patterns.
An automatic functional test pattern generation exploiting an evolutionary algorithm
maximizing metrics related to stress, power, and fault coverage was employed
in the above-mentioned approaches to quickly generate the desired patterns. The
approaches were evaluated on two industrial cases developed by STMicroelectronics;
8051-based and a 32-bit Power Architecture SoCs. Results show that generation
time was reduced upto 75% in comparison to older methodologies while
increasing significantly the desired metrics.
3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices
are suitable for generating structural patterns, testing and activating mitigation techniques,
and validating robust hardware and software applications. GPGPUs are
known for fast parallel computation used in high performance computing and advanced
driver assistance where reliability is the key point. Moreover, GPGPU manufacturers
do not provide design description code due to content secrecy. Therefore,
commercial fault injectors using the GPGPU model is unfeasible, making radiation
tests the only resource available, but are costly. In the last part of this thesis, we
propose a software implemented fault injector able to inject bit-flip in memory elements
of a real GPGPU. It exploits a software debugger tool and combines the
C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in
program variables. The goal is to validate robust parallel algorithms by studying
fault propagation or activating redundancy mechanisms they possibly embed. The
effectiveness of the tool was evaluated on two robust applications: redundant parallel
matrix multiplication and floating point Fast Fourier Transform
Fault-Resilient Lightweight Cryptographic Block Ciphers for Secure Embedded Systems
The development of extremely-constrained environments having sensitive nodes such as RFID tags and nano-sensors necessitates the use of lightweight block ciphers. Indeed, lightweight block ciphers are essential for providing low-cost confidentiality to such applications. Nevertheless, providing the required security properties does not guarantee their reliability and hardware assurance when the architectures are prone to natural and malicious faults. In this thesis, considering false-alarm resistivity, error detection schemes for the lightweight block ciphers are proposed with the case study of XTEA (eXtended TEA). We note that lightweight block ciphers might be better suited for low-resource environments compared to the Advanced Encryption Standard, providing low complexity and power consumption. To the best of the author\u27s knowledge, there has been no error detection scheme presented in the literature for the XTEA to date. Three different error detection approaches are presented and according to our fault-injection simulations for benchmarking the effectiveness of the proposed schemes, high error coverage is derived. Finally, field-programmable gate array (FPGA) implementations of these proposed error detection structures are presented to assess their efficiency and overhead. The proposed error detection architectures are capable of increasing the reliability of the implementations of this lightweight block cipher. The schemes presented can also be applied to lightweight hash functions with similar structures, making the presented schemes suitable for providing reliability to their lightweight security-constrained hardware implementations
Identifying worst case test vectors for FPGA exposed to total ionization dose using design for testability techniques
Electronic devices often operate in harsh environments which contain a variation of radiation sources. Radiation may cause different kinds of damage to proper operation of the devices. Their sources can be found in terrestrial environments, or in extra-terrestrial environments like in space, or in man-made radiation sources like nuclear reactors, biomedical devices and high energy particles physics experiments equipment. Depending on the operation environment of the device, the radiation resultant effect manifests in several forms like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). TID effect causes an increase in the delay and the leakage current of CMOS circuits which may damage the proper operation of the integrated circuit. To ensure proper operation of these devices under radiation, thorough testing must be made especially in critical applications like space and military applications. Although the standard which describes the procedure for testing electronic devices under radiation emphasizes the use of worst case test vectors (WCTVs), they are never used in radiation testing due to the difficulty of generating these vectors for circuits under test. For decades, design for testability (DFT) has been the best choice for test engineers to test digital circuits in industry. It has become a very mature technology that can be relied on. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Surprisingly, however, radiation testing has not yet made use of this reliable technology. In this thesis, a novel methodology is proposed to extend the usage of DFT to generate WCTVs for delay failure in Flash based field programmable gate arrays (FPGAs) exposed to total ionizing dose (TID). The methodology is validated using MicroSemi ProASIC3 FPGA and cobalt 60 facility
A comprehensive comparison between design for testability techniques for total dose testing of flash-based FPGAs
Radiation sources exist in different kinds of environments where electronic devices often operate. Correct device operation is usually affected negatively by radiation. The radiation resultant effect manifests in several forms depending on the operating environment of the device like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). CMOS circuits and Floating gate MOS circuits suffer from an increase in the delay and the leakage current due to TID effect. This may damage the proper operation of the integrated circuit. Exhaustive testing is needed for devices operating in harsh conditions like space and military applications to ensure correct operations in the worst circumstances. The use of worst case test vectors (WCTVs) for testing is strongly recommended by MIL-STD-883, method 1019, which is the standard describing the procedure for testing electronic devices under radiation. However, the difficulty of generating these test vectors hinders their use in radiation testing. Testing digital circuits in the industry is usually done nowadays using design for testability (DFT) techniques as they are very mature and can be relied on. DFT techniques include, but not limited to, ad-hoc technique, built-in self test (BIST), muxed D scan, clocked scan and enhanced scan. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Despite all these recommendations for DFT, radiation testing has not benefited from this reliable technology yet. Also, with the big variation in the DFT techniques, choosing the right technique is the bottleneck to achieve the best results for TID testing. In this thesis, a comprehensive comparison between different DFT techniques for TID testing of flash-based FPGAs is made to help designers choose the best suitable DFT technique depending on their application. The comparison includes muxed D scan technique, clocked scan technique and enhanced scan technique. The comparison is done using ISCAS-89 benchmarks circuits. Points of comparisons include FPGA resources utilization, difficulty of designs bring-up, added delay by DFT logic and robust testable paths in each technique
Interconnect yield analysis and fault tolerance for field programmable gate arrays
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