HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Delay Extraction Based Equivalent Elmore Model For RLC On-Chip Interconnects

As feature sizes for VLSI technology is shrinking, associated with higher operating frequency, signal integrity analysis of on-chip interconnects has become a real challenge for circuit designers. For this purpose, computer-aided-design (CAD) tools are necessary to simulate signal propagation of on-chip interconnects which has been an active area for research. Although SPICE models exist which can accurately predict signal degradation of interconnects, they are computationally expensive. As a result, more effective and analytic models for interconnects are required to capture the response at the output of high speed VLSI circuits. This thesis contributes to the development of efficient and closed form solution models for signal integrity analysis of on-chip interconnects. The proposed model uses a delay extraction algorithm to improve the accuracy of two-pole Elmore based models used in the analysis of on-chip distributed RLC interconnects. In the proposed scheme, the time of fight signal delay is extracted without increasing the number of poles or affecting the stability of the transfer function. This algorithm is used for both unit step and ramp inputs. From the delay rational approximation of the transfer function, analytic fitted expressions are obtained for the 50% delay and rise time for unit step input. The proposed algorithm is tested on point to point interconnections and tree structure networks. Numerical examples illustrate improved 50% delay and rise time estimates when compared to traditional Elmore based two-pole models

Doctor of Philosophy

dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

System level power integrity transient analysis using a physics-based approach

With decreasing supply voltage level and massive demanding current on system chipset, power integrity design becomes more and more critical for system stability. The ultimate goal of well-designed power delivery network (PDN) is to deliver desired voltage level from the source to destination, in other words, to minimize voltage noise delivered to digital devices. The thesis is composed of three parts. The first part focuses on-die level power models including simplified chip power model (CPM) for system level analysis and the worst scenario current profile. The second part of this work introduces the physics-based equivalent circuit model to simplify the passive PDN model to RLC circuit netlist, to be compatible with any spice simulators and tremendously boost simulation speed. Then a novel system/chip level end-to-end transient model is proposed, including the die model and passive PDN model discussed in previous two chapters as well as a SIMPLIS based small signal VRM model. In the last part of the thesis, how to model voltage regulator module (VRM) is explicitly discussed. Different linear approximated VRM modeling approaches have been compared with the SIMPLIS small signal VRM model in both frequency domain and time domain. The comparison provides PI engineers a guideline to choose specific VRM model under specific circumstances. Finally yet importantly, a PDN optimization example was given. Other than previous PDN optimization approaches, a novel hybrid target impedance concept was proposed in this thesis, in order to improve system level PDN optimization process --Abstract, page iv

Application of three-dimensional circuit integration to global clock distribution

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2004.Includes bibliographical references (leaf 35).This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.As the semi-conductor industry moves towards deep sub-micron designs, efficiency of chip-wide communication is becoming the limiting factor on system performance. One globally distributed signal with significant effect on system performance is the clock signal. In this paper utilization of three-dimensional circuit integration to reduce the negative effects of technology scaling on clock signal distribution is investigated. A design is proposed that removes the clock distribution network from the same active plane as the logical functions of the system and places them on a separate, but electrically connected active plane. Proposed benefits of a three-dimensional distribution network are the reduction of global skew, greater signal integrity, and an increase in system density. All aspects of the design process are detailed including methodology, simulation tools and verification, interconnect and repeater design, the three-dimensional integration process, and the overall predicted system benefits.by Erica M. Salinas.M.Eng

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast