78,835 research outputs found

    MISSED: an environment for mixed-signal microsystem testing and diagnosis

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    A tight link between design and test data is proposed for speeding up test-pattern generation and diagnosis during mixed-signal prototype verification. Test requirements are already incorporated at the behavioral level and specified with increased detail at lower hierarchical levels. A strict distinction between generic routines and implementation data makes reuse of software possible. A testability-analysis tool and test and DFT libraries support the designer to guarantee testability. Hierarchical backtrace procedures in combination with an expert system and fault libraries assist the designer during mixed-signal chip debuggin

    Testing microelectronic biofluidic systems

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    According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays, which have rapidly gained importance in many biological, pharmaceutical, and industrial applications. The advantages of these systems, such as operation speed, use of very small amounts of liquid, on-board droplet detection, signal conditioning, and vast digital signal processing, make them very promising. However, testable design of these devices in a mass-production environment is still in its infancy, hampering their low-cost introduction to the market. This article describes analog and digital MEF design and testing method

    A Powerful Optimization Tool for Analog Integrated Circuits Design

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    This paper presents a new optimization tool for analog circuit design. Proposed tool is based on the robust version of the differential evolution optimization method. Corners of technology, temperature, voltage and current supplies are taken into account during the optimization. That ensures robust resulting circuits. Those circuits usually do not need any schematic change and are ready for the layout.. The newly developed tool is implemented directly to the Cadence design environment to achieve very short setup time of the optimization task. The design automation procedure was enhanced by optimization watchdog feature. It was created to control optimization progress and moreover to reduce the search space to produce better design in shorter time. The optimization algorithm presented in this paper was successfully tested on several design examples

    Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS

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    The RD53 collaboration is currently designing a large scale prototype pixel readout chip in 65 nm CMOS technology for the phase 2 upgrades at the HL-LHC. The RD53A chip will be available by the end of the year 2017 and will be extensively tested to confirm if the circuit and the architecture make a solid foundation for the final pixel readout chips for the experiments at the HL-LHC. A test and data acquisition system for the RD53A chip is currently under development to perform single-chip and multi-chip module measurements. In addition, the verification of the RD53A design is performed in a dedicated simulation environment. The concept and the implementation of the test and data acquisition system and the simulation environment, which are based on a modular data acquisition and system testing framework, are presented in this work

    Self-Reconfigurable Analog Arrays: Off-The Shelf Adaptive Electronics for Space Applications

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    Development of analog electronic solutions for space avionics is expensive and lengthy. Lack of flexible analog devices, counterparts to digital Field Programmable Gate Arrays (FPGA), prevents analog designers from benefits of rapid prototyping. This forces them to expensive and lengthy custom design, fabrication, and qualification of application specific integrated circuits (ASIC). The limitations come from two directions: commercial Field Programmable Analog Arrays (FPAA) have limited variability in the components offered on-chip; and they are only qualified for best case scenarios for military grade (-55C to +125C). In order to avoid huge overheads, there is a growing trend towards avoiding thermal and radiation protection by developing extreme environment electronics, which maintain correct operation while exposed to temperature extremes (-180degC to +125degC). This paper describes a recent FPAA design, the Self-Reconfigurable Analog Array (SRAA) developed at JPL. It overcomes both limitations, offering a variety of analog cells inside the array together with the possibility of self-correction at extreme temperatures

    Innovative teaching of IC design and manufacture using the Superchip platform

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    In this paper we describe how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the “Superchip”, has been developed, which allows multiple student designs to be fabricated on a single IC, and encapsulated in a standard package without excessive cost in terms of time or resources. We demonstrate how the practical process has been tightly coupled with theoretical aspects of the degree course and how transferable skills are incorporated into the design exercise. Furthermore, the students are introduced at an early stage to the key concepts of team working, exposure to real deadlines and collaborative report writing. This paper provides details of the teaching rationale, design exercise overview, design process, chip architecture and test regime

    A design for testability study on a high performance automatic gain control circuit.

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    A comprehensive testability study on a commercial automatic gain control circuit is presented which aims to identify design for testability (DfT) modifications to both reduce production test cost and improve test quality. A fault simulation strategy based on layout extracted faults has been used to support the study. The paper proposes a number of DfT modifications at the layout, schematic and system levels together with testability. Guidelines that may well have generic applicability. Proposals for using the modifications to achieve partial self test are made and estimates of achieved fault coverage and quality levels presente
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