Significance Driven Hybrid 8T-6T SRAM for Energy-Efficient Synaptic Storage in Artificial Neural Networks

Multilayered artificial neural networks (ANN) have found widespread utility in classification and recognition applications. The scale and complexity of such networks together with the inadequacies of general purpose computing platforms have led to a significant interest in the development of efficient hardware implementations. In this work, we focus on designing energy efficient on-chip storage for the synaptic weights. In order to minimize the power consumption of typical digital CMOS implementations of such large-scale networks, the digital neurons could be operated reliably at scaled voltages by reducing the clock frequency. On the contrary, the on-chip synaptic storage designed using a conventional 6T SRAM is susceptible to bitcell failures at reduced voltages. However, the intrinsic error resiliency of NNs to small synaptic weight perturbations enables us to scale the operating voltage of the 6TSRAM. Our analysis on a widely used digit recognition dataset indicates that the voltage can be scaled by 200mV from the nominal operating voltage (950mV) for practically no loss (less than 0.5%) in accuracy (22nm predictive technology). Scaling beyond that causes substantial performance degradation owing to increased probability of failures in the MSBs of the synaptic weights. We, therefore propose a significance driven hybrid 8T-6T SRAM, wherein the sensitive MSBs are stored in 8T bitcells that are robust at scaled voltages due to decoupled read and write paths. In an effort to further minimize the area penalty, we present a synaptic-sensitivity driven hybrid memory architecture consisting of multiple 8T-6T SRAM banks. Our circuit to system-level simulation framework shows that the proposed synaptic-sensitivity driven architecture provides a 30.91% reduction in the memory access power with a 10.41% area overhead, for less than 1% loss in the classification accuracy.Comment: Accepted in Design, Automation and Test in Europe 2016 conference (DATE-2016

On the Evaluation of SEEs on Open-Source Embedded Static RAMs

3Static RAM modules are widely adopted in high performance systems. Single Event Effects (SEEs) resilient memories are required in many embedded systems applied in automotive and aerospace applications to increase their overall resiliency against SEEs. The current SEE resilient SRAM modules are obtained by applying radiation-hardened by design solutions which leads to elevated area overhead and difficulty to tune the resiliency capability with respect to the particle’s radiation profile. To overcome these limitations, we propose a methodology for the analysis and mitigation of embedded SRAMs generated by the OpenRAM memory compiler. A technology-oriented radiation analysis tool is presented to support the interaction of the charged radiation particles with the SRAM layout and depict the sensitive transistors of the SRAM memory. A selective duplication of the sensitive transistors has been applied to the 6T-SRAM cell designed at the layout level. The designed cell is included in the OpenRAM compiler and used to generate a mitigated 8Kb SRAM-bank. We evaluated the SEEs sensitivity by comparative simulation-based radiation analysis observing a reduction more than 6 times with respect to the original 6T-SRAM cell for the SEE sensitivity at high energy heavy ions particles, with negligible degradation of operations margins and power consumption and area overhead of less than ̴4%.partially_openopenAzimi, Sarah; De Sio, Corrado; Sterpone, LucaAzimi, Sarah; De Sio, Corrado; Sterpone, Luc

A Technique for Designing Variation Resilient Subthreshold Sram Cell

This paper presents a technique for designing a variability aware subthreshold SRAM cell. The architecture of the proposed cell is similar to the standard read-decoupled 8-transistor (RD8T) SRAM cell with the exception that the access FETS are replaced with transmission gates (TGs). In this work, various design metrics are assessed and compared with RD8T SRAM cell. The proposed design offers 2.14× and 1.75× improvement in TRA (read access time) and TWA (write access time) respectively compared with RD8T. It proves its robustness against process variations by featuring narrower spread in TRA distribution (2.35×) and TWA distribution (3.79×) compared with RD8T. The proposed bitcell offers 1.16× higher read current (IREAD) and 1.64× lower bitline leakage current (ILEAK) respectively compared with RD8T. It also shows its robustness by offering 1.34× (1.58×) tighter spread in IREAD (ILEAK) compared with RD8T. It exhibits 1.42× larger IREAD to ILEAK ratio. It shows 2.2× higher frequency @ 250 mV with read bitline capacitance of 10 fF. Besides, the proposed bitcell achieves same read stability and write-ability as that of RD8T at the cost of 3 extra transistors. The leakage power of the proposed design is close to that of RD8T.   ABSTRAK: Kertas kerja ini membentangkan teknik merekabentuk sel bawah ambang SRAM yang bolehubah. Senibina sel yang dicadangkan adalah sama dengan sel SRAM 8-transistor (RD8T) “pisahan-bacaan” piawai kecuali FET akses  digantikan dengan sel pintu transmisi (TGs). Di dalam kajian ini, beberapa metrik rekabentuk dinilai dan dibandingkan dengan sel RD8T SRAM. Rekabentuk yang dicadangkan menawarkan  peningkatan 2.14× dan 1.75×  dalam TRA (masa akses baca) dan TWA (masa akses tulis) berbanding dengan RD8T. Ia membuktikan kekukuhan variasi proses dengan menampilkan tebaran yang lebih sempit dalam pengagihan TRA (2.35 ×) dan pengagihan TWA (3.79 ×) berbanding dengan RD8T. Sel-Bit yang dicadangkan mempunyai arus baca 1.16 × lebih tinggi  (IREAD) dan arus bocor bitline 1.64 × lebih rendah (ILEAK) berbanding dengan RD8T. Ia juga membuktikan kekukuhan dengan menawarkan 1.34 × (1.58 ×) penyebaran sempit di IREAD (ILEAK) berbanding dengan RD8T dan nisbah IREAD / ILEAK 1.42 × lebih besar. Ia menunjukkan kekerapan 2.2 × lebih tinggi pada 250 mV dengan kemuatan membaca bitline sebanyak 10 fF. Selain itu, sel bit yang dicadangkan mencapai kestabilan membaca dan keupayaan menulis yang sama seperti RD8T dengan kos tambahan 3 transistor. Kebocoran kuasa  rekabentuk yang dicadangkan hampir sama dengan RD8T. KEYWORDS: variability; robust, subthreshold; random dopant fluctuation (RDF); read static noise margin (RSNM); write static noise margin (WSNM)

Gestión de contenidos en caches operando a bajo voltaje

La eficiencia energética de las caches en chip puede mejorarse reduciendo su voltaje de alimentación (Vdd ). Sin embargo, este escalado de Vdd está limitado a una tensión Vddmin por debajo de la cual algunas celdas SRAM (Static Random Access Memory) puede que no operen de forma fiable. Block disabling (BD) es una técnica microarquitectónica que permite operar a tensiones muy bajas desactivando aquellas entradas que contienen alguna celda que no opera de forma fiable, aunque a cambio de reducir la capacidad efectiva de la cache. Se utiliza en caches de último nivel (LLC), donde el ahorro potencial es mayor. Sin embargo, para algunas aplicaciones, el incremento de consumo debido a los accesos a memoria fuera del chip no compensa el ahorro energético conseguido en la LLC. Este trabajo aprovecha recursos existentes en los multiprocesadores, como son la jerarqui´a de memoria en chip y el mecanismo de coherencia, para mejorar las prestaciones de BD. En concreto, proponemos explotar la redundancia natural existente en una jerarqui´a de cache inclusiva para mitigar la pérdida de rendimiento debida a la reducción en la capacidad de la LLC. También proponemos una nueva poli´tica de gestión de contenidos consciente de la existencia de entradas de cache defectuosas. Utilizando la información de reúso, el algoritmo de reemplazo asigna entradas de cache operativas a aquellos bloques con más probabilidad de ser referenciados. Las técnicas propuestas llegan a reducir el MPKI hasta en un 36.4 % respecto a block disabling, mejorando su rendimiento entre un 2 y un 13%.Peer ReviewedPostprint (author's final draft

Novel Non Precharging Single Bitline 8T Static Random Access Memory

Title from PDF of title page viewed August 25, 2017Thesis advisor: Masud H ChowdhuryVitaIncludes bibliographical references (pages 39-41)Thesis (M.S.)--School of Computing and Engineering. University of Missouri-Kansas City, 2016Novel 8T SRAM design, employs individual bit-line (BL) and word-line (WL) for each operation. The read operation uses read word-line (RWL) and read bit-line (RBL) respectively. On other hand the write operation employs write word-line (WWL) and write bit line (WBL). Due to single BL and WL the power consumption of the proposed 8T SRAM cell is significantly less.The proposed design avoids the stability and reliability issues of the conventional 6T and other existing SRAM cells. The read stability and the write ability of the proposed design are better compared to the standard 6T and other 7T, 8T and 9T SRAM designs. The proposed 8T SRAM is as good as the 10T design without the overheads. The power consumption of the proposed 8T SRAM cell is significantly lower than other SRAM cells. The proposed design is ratio-less, which makes the construction and operation of the proposed SRAM much simpler and the response time much faster. The proposed cell design and its reliability and stability have been analyzed for 45nm technology. We have also analyzed the static noise margin (SNM) and the stability of the proposed design. In this analysis, we have used three methods. First, the traditional SNM method with the butterfly curve is introduced. Second, the N-curve method is used. And finally, we used the bit-line voltage method. We have also analyzed the impact of some process and parametric variations. The write ability of the proposed design is also compared to that of the conventional 6T SRAM.Introduction -- Existing SRAM designs -- Proposed 8T SRAM -- Analysis of power and area overheads of the proposed 8T SRAM -- Stability analysis of the proposed 8T SRAM -- Analysis of process and parametric variation in the proposed 8T SRAM -- Monte Carlo analysis -- Conclusio

A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components that may be unreliable. In order to do so, it is crucial to understand the close interplay between the different layers of a system: technology, platform, and application. This will enable the most general tradeoff exploration, reaping the most benefits in power, performance and reliability. This paper surveys various cross layer techniques and approaches for power, performance, and reliability tradeoffs are technology, circuit, architecture and application layers. © 2013 Elsevier B.V. All rights reserved

Robust Circuit Design for Low-Voltage VLSI.

Voltage scaling is an effective way to reduce the overall power consumption, but the major challenges in low voltage operations include performance degradation and reliability issues due to PVT variations. This dissertation discusses three key circuit components that are critical in low-voltage VLSI. Level converters must be a reliable interface between two voltage domains, but the reduced on/off-current ratio makes it extremely difficult to achieve robust conversions at low voltages. Two static designs are proposed: LC2 adopts a novel pulsed-operation and modulates its pull-up strength depending on its state. A 3-sigma robustness is guaranteed using a current margin plot; SLC inherently reduces the contention by diode-insertion. Improvements in performance, power, and robustness are measured from 130nm CMOS test chips. SRAM is a major bottleneck in voltage-scaling due to its inherent ratioed-bitcell design. The proposed 7T SRAM alleviates the area overhead incurred by 8T bitcells and provides robust operation down to 0.32V in 180nm CMOS test chips with 3.35fW/bit leakage. Auto-Shut-Off provides a 6.8x READ energy reduction, and its innate Quasi-Static READ has been demonstrated which shows a much improved READ error rate. A use of PMOS Pass-Gate improves the half-select robustness by directly modulating the device strength through bitline voltage. Clocked sequential elements, flip-flops in short, are ubiquitous in today’s digital systems. The proposed S2CFF is static, single-phase, contention-free, and has the same number of devices as in TGFF. It shows a 40% power reduction as well as robust low-voltage operations in fabricated 45nm SOI test chips. Its simple hold-time path and the 3.4x improvement in 3-sigma hold-time is presented. A new on-chip flip-flop testing harness is also proposed, and measured hold-time variations of flip-flops are presented.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111525/1/yejoong_1.pd

A Read-Decoupled Gated-Ground SRAM Architecture for Low-Power Embedded Memories

In order to meet the incessantly growing demand of performance, the amount of embedded or on-chip memory in microprocessors and systems-on-chip (SOC) is increasing. As much as 70% of the chip area is now dedicated to the embedded memory, which is primarily realized by the static random access memory (SRAM). Because of the large size of the SRAM, its yield and leakage power consumption dominate the overall yield and leakage power consumption of the chip. However, as the CMOS technology continues to scale in the sub-65 nanometer regime to reduce the transistor cost and the dynamic power, it poses a number of challenges on the SRAM design. In this thesis, we address these challenges and propose cell-level and architecture level solutions to increase the yield and reduce the leakage power consumption of the SRAM in nanoscale CMOS technologies. The conventional six transistor (6T) SRAM cell inherently suffers from a trade-off between the read stability and write-ability because of using the same bit line pair for both the read and write operations. An optimum design at a given process and voltage condition is a key to ensuring the yield and reliability of the SRAM. However, with technology scaling, process-induced variations in the transistor dimensions and electrical parameters coupled with variation in the operating conditions make it difficult to achieve a reasonably high yield. In this work, a gated SRAM architecture based on a seven transistor (7T) SRAM bit-cell is proposed to address these concerns. The proposed cell decouples the read bit line from the write bit lines. As a result, the storage node is not affected by any read induced noise during the read operation. Consequently, the proposed cell shows higher data stability and yield under varying process, voltage, and temperature (PVT) conditions. A single-ended sense amplifier is also presented to read from the proposed 7T cell while a unique write mechanism is used to reduce the write power to less than half of the write power of the conventional 6T cell. The proposed cell consumes similar silicon area and leakage power as the 6T cell when laid out and simulated using a commercial 65-nm CMOS technology. However, as much as 77% reduction in leakage power can be achieved by coupling the 7T cell with the column virtual grounding (CVG) technique, where a non-zero voltage is applied to the source terminals of driver NMOS transistors in the cell. The CVG technique also enables implementing multiple words per row, which is a key requirement for memories to avoid multiple-bit data upset in the event of radiation induced single event upset or soft error. In addition, the proposed cell inherently has a 30% larger soft error critical charge, making its soft error rate (SER) less than the half of that of the 6T cell