Cross-Layer Resiliency Modeling and Optimization: A Device to Circuit Approach

The never ending demand for higher performance and lower power consumption pushes the VLSI industry to further scale the technology down. However, further downscaling of technology at nano-scale leads to major challenges. Reduced reliability is one of them, arising from multiple sources e.g. runtime variations, process variation, and transient errors. The objective of this thesis is to tackle unreliability with a cross layer approach from device up to circuit level

FinFET Cell Library Design and Characterization

abstract: Modern-day integrated circuits are very capable, often containing more than a billion transistors. For example, the Intel Ivy Bridge 4C chip has about 1.2 billion transistors on a 160 mm2 die. Designing such complex circuits requires automation. Therefore, these designs are made with the help of computer aided design (CAD) tools. A major part of this custom design flow for application specific integrated circuits (ASIC) is the design of standard cell libraries. Standard cell libraries are a collection of primitives from which the automatic place and route (APR) tools can choose a collection of cells and implement the design that is being put together. To operate efficiently, the CAD tools require multiple views of each cell in the standard cell library. This data is obtained by characterizing the standard cell libraries and compiling the results in formats that the tools can easily understand and utilize. My thesis focusses on the design and characterization of one such standard cell library in the ASAP7 7 nm predictive design kit (PDK). The complete design flow, starting from the choice of the cell architecture, design of the cell layouts and the various decisions made in that process to obtain optimum results, to the characterization of those cells using the Liberate tool provided by Cadence design systems Inc., is discussed in this thesis. The end results of the characterized library are used in the APR of a few open source register-transfer logic (RTL) projects and the efficiency of the library is demonstrated.Dissertation/ThesisMasters Thesis Computer Engineering 201

Imperfection-Aware Design of CNFET Digital VLSI Circuits

Carbon nanotube field-effect transistor (CNFET) is one of the promising candidates as extensions to silicon CMOS devices. The CNFET, which is a 1-D structure with a near-ballistic transport capability, can potentially offer excellent device characteristics and order-of-magnitude better energy-delay product over standard CMOS devices. Significant challenges in CNT synthesis prevent CNFETs today from achieving such ideal benefits. CNT density variation and metallic CNTs are the dominant type of CNT variations/imperfections that cause performance variation, large static power consumption, and yield degradation. We present an imperfection-aware design technique for CNFET digital VLSI circuits by: 1) Analytical models that are developed to analyze and quantify the effects of CNT density variation on device characteristics, gate and system levels delays. The analytical models, which were validated by comparison to real experimental/simulation data, enables us to examine the space of CNFET combinational, sequential and memory cells circuits to minimize delay variations. Using these model, we drive CNFET processing and circuit design guidelines to manage/overcome CNT density variation. 2) Analytical models that are developed to analyze the effects of metallic CNTs on device characteristics, gate and system levels delay and power consumption. Using our presented analytical models, which are again validated by comparison with simulation data, it is shown that the static power dissipation is a more critical issue than the delay and the dynamic power of CNFET circuits in the presence of m-CNTs. 3) CNT density variation and metallic CNTs can result in functional failure of CNFET circuits. The complete and compact model for CNFET probability of failure that consider CNT density variation and m-CNTs is presented. This analytical model is applied to analyze the logical functional failures. The presented model is extended to predict opportunities and limitations of CNFET technology at todays Gigascale integration and beyond.\u2

Architectural level delay and leakage power modelling of manufacturing process variation

PhD ThesisThe effect of manufacturing process variations has become a major issue regarding the estimation of circuit delay and power dissipation, and will gain more importance in the future as device scaling continues in order to satisfy market place demands for circuits with greater performance and functionality per unit area. Statistical modelling and analysis approaches have been widely used to reflect the effects of a variety of variational process parameters on system performance factor which will be described as probability density functions (PDFs). At present most of the investigations into statistical models has been limited to small circuits such as a logic gate. However, the massive size of present day electronic systems precludes the use of design techniques which consider a system to comprise these basic gates, as this level of design is very inefficient and error prone. This thesis proposes a methodology to bring the effects of process variation from transistor level up to architectural level in terms of circuit delay and leakage power dissipation. Using a first order canonical model and statistical analysis approach, a statistical cell library has been built which comprises not only the basic gate cell models, but also more complex functional blocks such as registers, FIFOs, counters, ALUs etc. Furthermore, other sensitive factors to the overall system performance, such as input signal slope, output load capacitance, different signal switching cases and transition types are also taken into account for each cell in the library, which makes it adaptive to an incremental circuit design. The proposed methodology enables an efficient analysis of process variation effects on system performance with significantly reduced computation time compared to the Monte Carlo simulation approach. As a demonstration vehicle for this technique, the delay and leakage power distributions of a 2-stage asynchronous micropipeline circuit has been simulated using this cell library. The experimental results show that the proposed method can predict the delay and leakage power distribution with less than 5% error and at least 50,000 times faster computation time compare to 5000-sample SPICE based Monte Carlo simulation. The methodology presented here for modelling process variability plays a significant role in Design for Manufacturability (DFM) by quantifying the direct impact of process variations on system performance. The advantages of being able to undertake this analysis at a high level of abstraction and thus early in the design cycle are two fold. First, if the predicted effects of process variation render the circuit performance to be outwith specification, design modifications can be readily incorporated to rectify the situation. Second, knowing what the acceptable limits of process variation are to maintain design performance within its specification, informed choices can be made regarding the implementation technology and manufacturer selected to fabricate the design

Static noise margin analysis for CMOS logic cells in near-threshold

The advancement of semiconductor technology enabled the fabrication of devices with faster switching activity and chips with higher integration density. However, these advances are facing new impediments related to energy and power dissipation. Besides, the increasing demand for portable devices leads the circuit design paradigm to prioritize energy efficiency instead of performance. Altogether, this scenario motivates engineers towards reducing the supply voltage to the near and subthreshold regime to increase the lifespan of battery-powered devices. Even though operating in these regime offer interesting energy-frequency trade-offs, it brings challenges concerning noise tolerance. As the supply voltage reduces, the available noise margins decrease, and circuits become more prone to functional failures. In addition, near and subthreshold circuits are more susceptible to manufacturing variability, hence further aggravating noise issues. Other issues, such as wire minimization and gate fan-out, also contribute to the relevance of evaluating the noise margin of circuits early in the design Accordingly, this work investigates how to improve the static noise margin of digital synchronous circuits that will operate at the near/subthreshold regime. This investigation produces a set of three original contributions. The first is an automated tool to estimate the static noise margin of CMOS combinational cells. The second contribution is a realistic static noise margin estimation methodology that considers process-voltage-temperature variations. Results show that the proposed methodology allows to reduce up to 70% of the static noise margin pessimism. Finally, the third contribution is the noise-aware cell design methodology and the inclusion of a noise evaluation of complex circuits during the logic synthesis. The resulting library achieved higher static noise margin (up to 24%) and less spread among different cells (up to 62%).Os avanços na tecnologia de semicondutores possibilitou que se fabricasse dispositivos com atividade de chaveamento mais rápida e com maior capacidade de integração de transistores. Estes avanços, todavia, impuseram novos empecilhos relacionados com a dissipação de potência e energia. Além disso, a crescente demanda por dispositivos portáteis levaram à uma mudança no paradigma de projeto de circuitos para que se priorize energia ao invés de desempenho. Este cenário motivou à reduzir a tensão de alimentação com qual os dispositivos operam para um regime próximo ou abaixo da tensão de limiar, com o objetivo de aumentar sua duração de bateria. Apesar desta abordagem balancear características de performance e energia, ela traz novos desafios com relação a tolerância à ruído. Ao reduzirmos a tensão de alimentação, também reduz-se a margem de ruído disponível e, assim, os circuitos tornam-se mais suscetíveis à falhas funcionais. Somado à este efeito, circuitos com tensões de alimentação nestes regimes são mais sensíveis à variações do processo de fabricação, logo agravando problemas com ruído. Existem também outros aspectos, tais como a miniaturização das interconexões e a relação de fan-out de uma célula digital, que incentivam a avaliação de ruído nas fases iniciais do projeto de circuitos integrados Por estes motivos, este trabalho investiga como aprimorar a margem de ruído estática de circuitos síncronos digitais que irão operar em tensões no regime de tensão próximo ou abaixo do limiar. Esta investigação produz um conjunto de três contribuições originais. A primeira é uma ferramenta capaz de avaliar automaticamente a margem de ruído estática de células CMOS combinacionais. A segunda contribuição é uma metodologia realista para estimar a margem de ruído estática considerando variações de processo, tensão e temperatura. Os resultados obtidos mostram que a metodologia proposta permitiu reduzir até 70% do pessimismo das margens de ruído estática, Por último, a terceira contribuição é um fluxo de projeto de células combinacionais digitais considerando ruído, e uma abordagem para avaliar a margem de ruído estática de circuitos complexos durante a etapa de síntese lógica. A biblioteca de células resultante deste fluxo obteve maior margem de ruído (até 24%) e menor variação entre diferentes células (até 62%)

Computationally efficient characterization of standard cells for statistical static timing analysis

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Includes bibliographical references (p. 44-45).We propose a computationally efficient statistical static timing analysis (SSTA) technique that addresses intra-die variations at near-threshold to sub-threshold supply voltage, simulated on a scaled 32nm CMOS standard cell library. This technique would characterize the propagation delay and output slew of an individual cell for subsequent timing path analyses. Its efficiency stems from the fact that it only needs to find the delay or output slew in the vicinity of the ?- sigma operating point (where ? = 0 to 3) rather than the entire probability density function of the delay or output slew, as in conventional Monte-Carlo simulations. The algorithm is simulated on combinational logic gates that include inverters, NANDs, and NORs of different sizes. The delay and output slew estimates in most cases differ from the Monte-Carlo results by less than 5%. Higher supply voltage, larger transistor widths, and slower input slews tend to improve delay and output slew estimates. Transistor stacking is found to be the only major source of under-prediction by the SSTA technique. Overall, the cell characterization approach has a substantial computational advantage compared to SPICE-based Monte-Carlo analysis.by Sharon H. Chou.M.Eng

ULTRA ENERGY-EFFICIENT SUB-/NEAR-THRESHOLD COMPUTING: PLATFORM AND METHODOLOGY

Ph.DDOCTOR OF PHILOSOPH

An ultra-compact virtual source FET model for deeply-scaled devices: Parameter extraction and validation for standard cell libraries and digital circuits

In this paper, we present the first validation of the virtual source (VS) charge-based compact model for standard cell libraries and large-scale digital circuits. With only a modest number of physically meaningful parameters, the VS model accounts for the main short-channel effects in nanometer technologies. Using a novel DC and transient parameter extraction methodology, the model is verified with simulated data from a well-characterized, industrial 40-nm bulk silicon model. The VS model is used to fully characterize a standard cell library with timing comparisons showing less than 2.7% error with respect to the industrial design kit. Furthermore, a 1001-stage inverter chain and a 32-bit ripple-carry adder are employed as test cases in a vendor CAD environment to validate the use of the VS model for large-scale digital circuit applications. Parametric Vdd sweeps show that the VS model is also ready for usage in low-power design methodologies. Finally, runtime comparisons have shown that the use of the VS model results in a speedup of about 7.6×.Masdar Institute of Science and Technology (Massachusetts Institute of Technology Cooperative Agreement