Future of smart cardiovascular implants

Cardiovascular disease remains the leading cause of death in Western society. Recent technological advances have opened the opportunity of developing new and innovative smart stent devices that have advanced electrical properties that can improve diagnosis and even treatment of previously intractable conditions, such as central line access failure, atherosclerosis and reporting on vascular grafts for renal dialysis. Here we review the latest advances in the field of cardiovascular medical implants, providing a broad overview of the application of their use in the context of cardiovascular disease rather than an in-depth analysis of the current state of the art. We cover their powering, communication and the challenges faced in their fabrication. We focus specifically on those devices required to maintain vascular access such as ones used to treat arterial disease, a major source of heart attacks and strokes. We look forward to advances in these technologies in the future and their implementation to improve the human condition

Interconnect yield analysis and fault tolerance for field programmable gate arrays

Imperial Users onl

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Memory built-in self-repair and correction for improving yield: a review

Nanometer memories are highly prone to defects due to dense structure, necessitating memory built-in self-repair as a must-have feature to improve yield. Today’s system-on-chips contain memories occupying an area as high as 90% of the chip area. Shrinking technology uses stricter design rules for memories, making them more prone to manufacturing defects. Further, using 3D-stacked memories makes the system vulnerable to newer defects such as those coming from through-silicon-vias (TSV) and micro bumps. The increased memory size is also resulting in an increase in soft errors during system operation. Multiple memory repair techniques based on redundancy and correction codes have been presented to recover from such defects and prevent system failures. This paper reviews recently published memory repair methodologies, including various built-in self-repair (BISR) architectures, repair analysis algorithms, in-system repair, and soft repair handling using error correcting codes (ECC). It provides a classification of these techniques based on method and usage. Finally, it reviews evaluation methods used to determine the effectiveness of the repair algorithms. The paper aims to present a survey of these methodologies and prepare a platform for developing repair methods for upcoming-generation memories

Achieving Functional Correctness in Large Interconnect Systems.

In today's semi-conductor industry, large chip-multiprocessors and systems-on-chip are being developed, integrating a large number of components on a single chip. The sheer size of these designs and the intricacy of the communication patterns they exhibit have propelled the development of network-on-chip (NoC) interconnects as the basis for the communication infrastructure in these systems. Faced with the interconnect's growing size and complexity, several challenges hinder its effective validation. During the interconnect's development, the functional verification process relies heavily on the use of emulation and post-silicon validation platforms. However, detecting and debugging errors on these platforms is a difficult endeavour due to the limited observability, and in turn the low verification capabilities, they provide. Additionally, with the inherent incompleteness of design-time validation efforts, the potential of design bugs escaping into the interconnect of a released product is also a concern, as these bugs can threaten the viability of the entire system. This dissertation provides solutions to enable the development of functionally correct interconnect designs. We first address the challenges encountered during design-time verification efforts, by providing two complementary mechanisms that allow emulation and post-silicon verification frameworks to capture a detailed overview of the functional behaviour of the interconnect. Our first solution re-purposes the contents of in-flight traffic to log debug data from the interconnect's execution. This approach enables the validation of the interconnect using synthetic traffic workloads, while attaining over 80% observability of the routes followed by packets and capturing valuable debugging information. We also develop an alternative mechanism that boosts observability by taking periodic snapshots of execution, thus extending the verification capabilities to run both synthetic traffic and real-application workloads. The collected snapshots enhance detection and debugging support, and they provide observability of over 50% of packets and reconstructs at least half of each of their routes. Moreover, we also develop error detection and recovery solutions to address the threat of design bugs escaping into the interconnect's runtime operation. Our runtime techniques can overcome communication errors without needing to store replicate copies of all in-flight packets, thereby achieving correctness at minimal area costsPhDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116741/1/rawanak_1.pd

Fault-tolerant fpga for mission-critical applications.

One of the devices that play a great role in electronic circuits design, specifically safety-critical design applications, is Field programmable Gate Arrays (FPGAs). This is because of its high performance, re-configurability and low development cost. FPGAs are used in many applications such as data processing, networks, automotive, space and industrial applications. Negative impacts on the reliability of such applications result from moving to smaller feature sizes in the latest FPGA architectures. This increases the need for fault-tolerant techniques to improve reliability and extend system lifetime of FPGA-based applications. In this thesis, two fault-tolerant techniques for FPGA-based applications are proposed with a built-in fault detection region. A low cost fault detection scheme is proposed for detecting faults using the fault detection region used in both schemes. The fault detection scheme primarily detects open faults in the programmable interconnect resources in the FPGAs. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can be detected. For fault recovery, each scheme has its own fault recovery approach. The first approach uses a spare module and a 2-to-1 multiplexer to recover from any fault detected. On the other hand, the second approach recovers from any fault detected using the property of Partial Reconfiguration (PR) in the FPGAs. It relies on identifying a Partially Reconfigurable block (P_b) in the FPGA that is used in the recovery process after the first faulty module is identified in the system. This technique uses only one location to recover from faults in any of the FPGA’s modules and the FPGA interconnects. Simulation results show that both techniques can detect and recover from open faults. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can also be detected. Finally, both techniques require low area overhead

Using Relocatable Bitstreams for Fault Tolerance

This research develops a method for relocating reconfigurable modules on the Virtex-II (Pro) family of Field Programmable Gate Arrays (FPGAs). A bitstream translation program is developed which correctly changes the location of a partial bitstream that implements a module on the FPGA. To take advantage of relocatable modules, three fault-tolerance circuit designs are developed and tested. This circuit can operate through a fault by efficiently removing the faulty module and replacing it with a relocated module without faults. The FPGA can recover from faults at a known location, without the need for external intervention using an embedded fault recovery system. The recovery system uses an internal PowerPC to relocate the modules and reprogram the FPGA. Due to the limited architecture of the target FPGA and Xilinx tool errors, an FPGA with automatic fault recovery could not be demonstrated. However, the various components needed to do this type of recovery have been implemented and demonstrated individually