A Novel variation-tolerant 9T SRAM design for nanoscale CMOS

As the feature sizes decrease, understanding manufacturing variations becomes essential to effectively design robust circuits. Manufacturing variations occur when process parameters deviate from their ideal or expected values, resulting in variations in device characteristics. Variations in the device characteristics cause the circuit to deviate from its expected behavior resulting in circuit instability, performance degradation, and yield loss. Both from an economic and performance standpoint, the yield and performance of Static Random Access Memories (SRAMs) are of great importance to the modern System-on-Chip designs. SRAM bitcells typically employ well-matched, minimum-sized transistors which make them highly sensitive to process variations. To overcome these challenges, researchers have proposed different topologies for SRAMs with 8T and 10T SRAM designs. These designs improve the cell stability but suffer from bitline-leakage noise, placing constraints on the number of cells shared by each bitline. These designs also have substantial area overhead when compared to the traditional 6T design. In this work, the published SRAM designs are characterized using commercial CMOS 65 nm models and are compared based on critical SRAM parameters like read stability, write stability, bitline leakage and the impact of process variations. Furthermore, a single-ended 9T SRAM design is proposed that enhances data stability and simultaneously addresses the bitline leakage problem. The proposed design also satisfies the yield criterion to achieve 90% yield for a 1Mb SRAM array in the presence of process variations

Supply Voltage Dependence of Heavy Ion Induced SEEs on 65nm CMOS Bulk SRAMs

The power consumption of Static Random Access Memory (SRAM) has become an important issue for modern integrated circuit design, considering the fact that they occupy large area and consume significant portion of power consumption in modern nanometer chips. SRAM operating in low power supply voltages has become an effective approach in reducing power consumption. Therefore, it is essential to experimentally characterize the single event effects (SEE) of hardened and unhardened SRAM cells to determine their appropriate applications, especially when a low supply voltage is preferred. In this thesis, a SRAM test chip was designed and fabricated with four cell arrays sharing the same peripheral circuits, including two types of unhardened cells (standard 6T and sub-threshold 10T) and two types of hardened cells (Quatro and DICE). The systems for functional and radiation tests were built up with power supply voltages that ranged from near threshold 0.4 V to normal supply 1 V. The test chip was irradiated with alpha particles and heavy ions with various linear energy transfers (LETs) at different core supply voltages, ranging from 1 V to 0.4 V. Experimental results of the alpha test and heavy ion test were consistent with the results of the simulation. The cross sections of 6T and 10T cells present much more significant sensitivities than Quatro and DICE cells for all tested supply voltages and LET. The 10T cell demonstrates a more optimal radiation performance than the 6T cell when LET is small (0.44 MeV·cm2/mg), yet no significant advantage is evident when LET is larger than this. In regards to the Quatro and DICE cells, one does not consistently show superior performance over the other in terms of soft error rates (SERs). Multi-bit upsets (MBUs) occupy a larger portion of total SEUs in DICE cell when relatively larger LET and smaller supply voltage are applied. It explains the loss in radiation tolerance competition with Quatro cell when LET is bigger than 9.1 MeV·cm2/mg and supply voltage is smaller than 0.6 V. In addition, the analysis of test results also demonstrated that the error amount distributions follow a Poisson distribution very well for each type of cell array

U-DVS SRAM design considerations

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (leaves 73-78).With the continuous scaling down of transistor feature sizes, the semiconductor industry faces new challenges. One of these challenges is the incessant increase of power consumption in integrated circuits. This problem has motivated the industry and academia to pay significant attention to low-power circuit design for the past two decades. Operating digital circuits at lower voltage levels was shown to increase energy efficiency and lower power consumption. Being an integral part of the digital systems, Static Random Access Memories (SRAMs), dominate the power consumption and area of modern integrated circuits. Consequently, designing low-power high density SRAMs operational at low voltage levels is an important research problem. This thesis focuses on and makes several contributions to low-power SRAM design. The trade-offs and potential overheads associated with designing SRAMs for a very large voltage range are analyzed. An 8T SRAM cell is designed and optimized for both sub-threshold and above-threshold operation. Hardware reconfigurability is proposed as a solution to power and area overheads due to peripheral assist circuitry which are necessary for low voltage operation. A 64kbit SRAM has been designed in 65nm CMOS process and the fabricated chip has been tested, demonstrating operation at power supply levels from 0.25V to 1.2V. This is the largest operating voltage range reported in 65nm semiconductor technology node. Additionally, another low voltage SRAM has been designed for the on-chip caches of a low-power H.264 video decoder. Power and performance models of the memories have been developed along with a configurable interface circuit. This custom memory implemented with the low-power architecture of the decoder provides nearly 10X power savings.by Mahmut E. Sinangil.S.M

Low-power and application-specific SRAM design for energy-efficient motion estimation

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.Cataloged from PDF version of thesis.Includes bibliographical references (p. 181-189).Video content is expected to account for 70% of total mobile data traffic in 2015. High efficiency video coding, in this context, is crucial for lowering the transmission and storage costs for portable electronics. However, modern video coding standards impose a large hardware complexity. Hence, energy-efficiency of these hardware blocks is becoming more critical than ever before for mobile devices. SRAMs are critical components in almost all SoCs affecting the overall energy-efficiency. This thesis focuses on algorithm and architecture development as well as low-power and application-specific SRAM design targeting motion estimation. First, a motion estimation design is considered for the next generation video standard, HEVC. Hardware cost and coding efficiency trade-offs are quantified and an optimum design choice between hardware complexity and coding efficiency is proposed. Hardware-efficient search algorithm, shared search range across CU engines and pixel pre-fetching algorithms provide 4.3x area, 56x on-chip bandwidth and 151 x off-chip bandwidth reduction. Second, a highly-parallel motion estimation design targeting ultra-low voltage operation and supporting AVC/H.264 and VC-1 standards are considered. Hardware reconfigurability along with frame and macro-block parallel processing are implemented for this engine to maximize hardware sharing between multiple standards and to meet throughput constraints. Third, in the context of low-power SRAMs, a 6T and an 8T SRAM are designed in 28nm and 45nm CMOS technologies targeting low voltage operation. The 6T design achieves operation down to 0.6V and the 8T design achieves operation down to 0.5V providing ~ 2.8x and ~ 4.8x reduction in energy/access respectively. Finally, an application-specific SRAM design targeted for motion estimation is developed. Utilizing the correlation of pixel data to reduce bit-line switching activity, this SRAM achieves up to 1.9x energy savings compared to a similar conventional 8T design. These savings demonstrate that application-specific SRAM design can introduce a new dimension and can be combined with voltage scaling to maximize energy-efficiency.by Mahmut Ersin Sinangil.Ph.D

Subthreshold SRAM Design for Energy Efficient Applications in Nanometric CMOS Technologies

Embedded SRAM circuits are vital components in a modern system on chip (SOC) that can occupy up to 90% of the total area. Therefore, SRAM circuits heavily affect SOC performance, reliability, and yield. In addition, most of the SRAM bitcells are in standby mode and significantly contribute to the total leakage current and leakage power consumption. The aggressive demand in portable devices and billions of connected sensor networks requires long battery life. Therefore, careful design of SRAM circuits with minimal power consumption is in high demand. Reducing the power consumption is mainly achieved by reducing the power supply voltage in the idle mode. However, simply reducing the supply voltage imposes practical limitations on SRAM circuits such as reduced static noise margin, poor write margin, reduced number of cells per bitline, and reduced bitline sensing margin that might cause read/write failures. In addition, the SRAM bitcell has contradictory requirements for read stability and writability. Improving the read stability can cause difficulties in a write operation or vice versa. In this thesis, various techniques for designing subthreshold energy-efficient SRAM circuits are proposed. The proposed techniques include improvement in read margin and write margin, speed improvement, energy consumption reduction, new bitcell architecture and utilizing programmable wordline boosting. A programmable wordline boosting technique is exploited on a conventional 6T SRAM bitcell to improve the operational speed. In addition, wordline boosting can reduce the supply voltage while maintaining the operational frequency. The reduction of the supply voltage allows the memory macro to operate with reduced power consumption. To verify the design, a 16-kb SRAM was fabricated using the TSMC 65 nm CMOS technology. Measurement results show that the maximum operational frequency increases up to 33.3% when wordline boosting is applied. Besides, the supply voltage can be reduced while maintaining the same frequency. This allows reducing the energy consumption to be reduced by 22.2%. The minimum energy consumption achieved is 0.536 fJ/b at 400 mV. Moreover, to improve the read margin, a 6T bitcell SRAM with a PMOS access transistor is proposed. Utilizing a PMOS access transistor results in lower zero level degradation, and hence higher read stability. In addition, the access transistor connected to the internal node holding V DD acts as a stabilizer and counterbalances the effect of zero level degradation. In order to improve the writability, wordline boosting is exploited. Wordline boosting also helps to compensate for the lower speed of the PMOS access transistor compared to a NMOS transistor. To verify our design, a 2kb SRAM is fabricated in the TSMC 65 nm CMOS technology. Measurement results show that the maximum operating frequency of the test chip is at 3.34 MHz at 290 mV. The minimum energy consumption is measured as 1.1 fJ/b at 400 mV

Low-Power, Low-Voltage SRAM Circuits Design For Nanometric CMOS Technologies

Embedded SRAM memory is a vital component in modern SoCs. More than 80% of the System-on-Chip (SoC) die area is often occupied by SRAM arrays. As such, system reliability and yield is largely governed by the SRAM's performance and robustness. The aggressive scaling trend in CMOS device minimum feature size, coupled with the growing demand in high-capacity memory integration, has imposed the use of minimal size devices to realize a memory bitcell. The smallest 6T SRAM bitcell to date occupies a 0.1um2 in silicon area. SRAM bitcells continue to benefit from an aggressive scaling trend in CMOS technologies. Unfortunately, other system components, such as interconnects, experience a slower scaling trend. This has resulted in dramatic deterioration in a cell's ability to drive a heavily-loaded interconnects. Moreover, the growing fluctuation in device properties due to Process, Voltage, and Temperature (PVT) variations has added more uncertainty to SRAM operation. Thus ensuring the ability of a miniaturized cell to drive heavily-loaded bitlines and to generate adequate voltage swing is becoming challenging. A large percentage of state-of-the-art SoC system failures are attributed to the inability of SRAM cells to generate the targeted bitline voltage swing within a given access time. The use of read-assist mechanisms and current mode sense amplifiers are the two key strategies used to surmount bitline loading effects. On the other hand, new bitcell topologies and cell supply voltage management are used to overcome fluctuations in device properties. In this research we tackled conventional 6T SRAM bitcell limited drivability by introducing new integrated voltage sensing schemes and current-mode sense amplifiers. The proposed schemes feature a read-assist mechanism. The proposed schemes' functionality and superiority over existing schemes are verified using transient and statistical SPICE simulations. Post-layout extracted views of the devices are used for realistic simulation results. Low-voltage operated SRAM reliability and yield enhancement is investigated and a wordline boost technique is proposed as a means to manage the cell's WL operating voltage. The proposed wordline driver design shows a significant improvement in reliability and yield in a 400-mV 6T SRAM cell. The proposed wordline driver design exploit the cell's Dynamic Noise Margin (DNM), therefore boost peak level and boost decay rate programmability features are added. SPICE transient and statistical simulations are used to verify the proposed design's functionality. Finally, at a bitcell-level, we proposed a new five-transistor (5T) SRAM bitcell which shows competitive performance and reliability figures of merit compared to the conventional 6T bitcell. The functionality of the proposed cell is verified by post-layout SPICE simulations. The proposed bitcell topology is designed, implemented and fabricated in a standard ST CMOS 65nm technology process. A 1.2_ 1.2 mm2 multi-design project test chip consisting of four 32-Kbit (256-row x 128-column) SRAM macros with the required peripheral and timing control units is fabricated. Two of the designed SRAM macros are dedicated for this work, namely, a 32-Kbit 5T macro and a 32-Kbit 6T macro which is used as a comparison reference. Other macros belong to other projects and are not discussed in this document

Low-power and high-performance SRAM design in high variability advanced CMOS technology

As process technologies shrink, the size and number of memories on a chip are exponentially increasing. Embedded SRAMs are a critical component in modern digital systems, and they strongly impact the overall power, performance, and area. To promote memory-related research in academia, this dissertation introduces OpenRAM, a flexible, portable and open-source memory compiler and characterization methodology for generating and verifying memory designs across different technologies.In addition, SRAM designs, focusing on improving power consumption, access time and bitcell stability are explored in high variability advanced CMOS technologies. To have a stable read/write operation for SRAM in high variability process nodes, a differential-ended single-port 8T bitcell is proposed that improves the read noise margin, write noise margin and readout bitcell current by 45%, 48% and 21%, respectively, compared to a conventional 6T bitcell. Also, a differential-ended single-port 12T bitcell for subthreshold operation is proposed that solves the half-select disturbance and allows efficient bit-interleaving. 12T bitcell has a leakage control mechanism which helps to reduce the power consumption and provides operation down to 0.3 V. Both 8T and 12T bitcells are analyzed in a 64 kb SRAM array using 32 nm technology. Besides, to further improve the access time and power consumption, two tracking circuits (multi replica bitline delay and reconfigurable replica bitline delay techniques) are proposed to aid the generation of accurate and optimum sense amplifier set time.An error tolerant SRAM architecture suitable for low voltage video application with dynamic power-quality management is also proposed in this dissertation. This memory uses three power supplies to improve the SRAM stability in low voltages. The proposed triple-supply approach achieves 63% improvement in image quality and 69% reduction in power consumption compared to a single-supply 64 kb SRAM array at 0.70 V

Ultra-low-power SRAM design in high variability advanced CMOS

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.Cataloged from PDF version of thesis.Includes bibliographical references (p. 163-181).Embedded SRAMs are a critical component in modern digital systems, and their role is preferentially increasing. As a result, SRAMs strongly impact the overall power, performance, and area, and, in order to manage these severely constrained trade-offs, they must be specially designed for target applications. Highly energy-constrained systems (e.g. implantable biomedical devices, multimedia handsets, etc.) are an important class of applications driving ultra-low-power SRAMs. This thesis analyzes the energy of an SRAM sub-array. Since supply- and threshold-voltage have a strong effect, targets for these are established in order to optimize energy. Despite the heavy emphasis on leakage-energy, analysis of a high-density 256x256 sub-array in 45nm LP CMOS points to two necessary optimizations: (1) aggressive supply-voltage reduction (in addition to Vt elevation), and (2) performance enhancement. Important SRAM metrics, including read/write/hold-margin and read-current, are also investigated to identify trade-offs of these optimizations. Based on the need to lower supply-voltage, a 0.35V 256kb SRAM is demonstrated in 65nm LP CMOS. It uses an 8T bit-cell with peripheral circuit-assists to improve write-margin and bit-line leakage. Additionally, redundancy, to manage the increasing impact of variability in the periphery, is proposed to improve the area-offset trade-off of sense-amplifiers, demonstrating promise for highly advanced technology nodes. Based on the need to improve performance, which is limited by density constraints, a 64kb SRAM, using an offset-compensating sense-amplifier, is demonstrated in 45nm LP CMOS with high-density 0.25[mu]m2 bit-cells.(cont.) The sense-amplifier is regenerative, but non -strobed, overcoming timing uncertainties limiting performance, and it is single-ended, for compatibility with 8T cells. Compared to a conventional strobed sense-amplifier, it achieves 34% improvement in worst-case access-time and 4x improvement in the standard deviation of the access-time.by Naveen Verma.Ph.D

Design techniques for dense embedded memory in advanced CMOS technologies

University of Minnesota Ph.D. dissertation. February 2012. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); viii, 116 pages.On-die cache memory is a key component in advanced processors since it can boost micro-architectural level performance at a moderate power penalty. Demand for denser memories only going to increase as the number of cores in a microprocessor goes up with technology scaling. A commensurate increase in the amount of cache memory is needed to fully utilize the larger and more powerful processing units. 6T SRAMs have been the embedded memory of choice for modern microprocessors due to their logic compatibility, high speed, and refresh-free operation. However, the relatively large cell size and conflicting requirements for read and write make aggressive scaling of 6T SRAMs challenging in sub-22 nm. In this dissertation, circuit techniques and simulation methodologies are presented to demonstrate the potential of alternative options such as gain cell eDRAMs and spin-torque-transfer magnetic RAMs (STT-MRAMs) for high density embedded memories.Three unique test chip designs are presented to enhance the retention time and access speed of gain cell eDRAMs. Proposed bit-cells utilize preferential boostings, beneficial couplings, and aggregated cell leakages for expanding signal window between data `1' and `0'. The design space of power-delay product can be further enhanced with various assist schemes that harness the innate properties of gain cell eDRAMs. Experimental results from the test chips demonstrate that the proposed gain cell eDRAMs achieve overall faster system performances and lower static power dissipations than SRAMs in a generic 65 nm low-power (LP) CMOS process. A magnetic tunnel junction (MTJ) scaling scenario and an efficient HSPICE simulation methodology are proposed for exploring the scalability of STT-MRAMs under variation effects from 65 nm to 8 nm. A constant JC0*RA/VDD scaling method is adopted to achieve optimal read and write performances of STT-MRAMs and thermal stabilities for a 10 year retention are achieved by adjusting free layer thicknesses as well as projecting crystalline anisotropy improvements. Studies based on the proposed methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material properties in order to overcome the poor write performance from 22 nm node

ULTRALOW-POWER, LOW-VOLTAGE DIGITAL CIRCUITS FOR BIOMEDICAL SENSOR NODES

Ph.DDOCTOR OF PHILOSOPH